The electrical properties of Al/LaAlO3/GaAs metal-oxide-semiconductor capacitors were investigated. A thick arsenic (As2) capping layer was used to protect the GaAs from oxidation and contamination during the air exposure that occurred between the deposition of the GaAs and LaAlO3 layers in different molecular-beam epitaxy systems. Amorphous LaAlO3 was deposited on c(4×4)- and (2×4)-reconstructed (100) GaAs surfaces. Post dielectric deposition annealing was found to improve the capacitance-voltage (C-V) characteristics by eliminating frequency dispersion in the depletion and weak inversion regimes and diminished the bi-directional C-V hysteresis to 210 mV. Reasonably low gate leakage current was maintained after annealing.

Scanning tunneling microscopy (STM) observations are performed on 4H-SiC(0001) surfaces after wet-chemical preparation steps including HF treatments.1×1 structures are formed on a terrace together with other local structures.Their atomic images are investigated in conjunction with low-energy electron diffraction and electron spectroscopy for chemical analysis.It is suggested that each bright dot forming the 1×1 phase corresponds to an OH-terminated Si atom.

We have carried out a comparison between flat-band transients displayed in metal-oxide-semiconductor (MOS) structures fabricated on several atomic layer deposited (ALD) high-k dielectric films: HfO2, ZrO2, Al2O3, Ta2O5, TiO2, and Gd2O3. The gate voltage as a function of time is recorded while keeping constant the capacitance at the initial flat band condition (CFB). Since samples are in darkness, under no electric fields and no charge-injection conditions, transients must be due to charge trapping of localized states produced by electrons (holes) coming from the semiconductor by tunnelling. The process is assisted by phonons and it is therefore thermally activated. The temperature-transient amplitude relation follows an Arrhenius plot which provides the thermal activation energy of soft-optical phonons. Finally, we describe the dependencies of the flat-band voltage on the setup bias history (accumulation or inversion) and the hysteresis sign (clockwise or counter-clockwise) of the capacitance-voltage (C-V) characteristics of MOS structures.

We have investigated the effect of Si3N4 content in (Ti(Hf)O2)x(Si3N4)y(SiO2)1-x-y pseudo-ternary alloys by tracking systematic changes of electrical properties, including electrically active defects. Results from Soft x-ray photoelectron spectroscopy (SXPS) studies indicate no detectable hole traps for Ti/Hf Si oxynitrides with Si3N4 content >35%; these alloys haveequal concentrations of Ti(Hf)O2 and SiO2, ~30-32%, and additionally are stable for annealing in Ar ambients to temperatures of 1100°C. Derivative near edge x-ray absorption spectroscopy (NEXAS) comparisons for the O K1 edges of TiO2 and optimized Ti Si oxynitride alloys provides a significantly reduced average crystal field d-state splitting from 1.9 to 1.6eV, as well as decreased electron trapping, and is correlated with a four-fold coordination of Ti in the Ti Si oxynitride alloys. The flat band voltage shift with varying frequency from 10 kHz to 1MHz in these alloys is less than 12 mV and the compositional dependence of current-voltage characteristics on Si3N4 composition results in the lowest leakage current at a Si3N4 content of ~40 % with the smallest equivalent oxide thickness (EOT) as well. Based on these studies, Transition Metal (TM) Si oxynitride alloys are anticipated to yield EOT <1 nm for scaled CMOS devises.

HfO2 films were grown on SiO2/4H-SiC and SiON/4H-SiC layers by evaporation of metallic Hf in an electron beam deposition system followed by thermal oxidation. X-ray photoelectron spectroscopy confirmed the formation of HfO2 films. There is no evidence of formation of hafnium silicide or carbon pile up at the surface as well as at the interfacial layer. Electrical measurements show the presence of fewer slow traps in the HfO2/SiON gate dielectric stack on 4H-SiC and comparable values of interface state density. The HfO2/SiON stack layer improves leakage current characteristics with a higher breakdown field and has better reliability under electrical stress.

We investigate the dielectric properties of Praseodymium based oxides and silicates by preparing MIS structures consisting of a metal layer (M), PrOX (praseodymium oxide) as a high-k insulating layer (I), and silicon (Si) or silicon carbide (SiC) as semiconductor substrates (S).

The use of a buffer layer between PrOX and SiC is necessary as we found destructive interactions like silicate and graphite formation between these materials. Based on a higher permittivity value than SiO2 and a good lattice matching in conjunction with nearly the same thermal expansion coefficient to SiC, we focus on aluminum oxynitride (AlON) as a suitable buffer layer for this high-k/wide-bandgapsystem. We report on results achieved by Synchrotron Radiation Photoemission Spectroscopy (SRPES) and by electrical measurements.

In our spectroscopic investigations we found a stable AlON/3C-SiC interface as well as no elemental carbon and silicate contributions in the core levels after thin PrOX deposition and annealing up to 900°C.

In electrical characterizations of PrOX/AlON stacks on silicon we already found a strong improvement in the leakage current down to values of 10-7 A/cm2 at an CET of 4nm. We observed an interface state density in the range of 5x1011-1x1012/eVcm2 and 1-5x1012/eVcm2 on Si and SiC, respectively.

Continuous downscaling of transistor leads silicon dioxide constituting the gate in typical metal oxide semiconductor field effect (MOSFET) to its limits. One possibility is to replace SiO2 by a material of higher dielectric constant (high-k). Hafnium dioxide seems to be the most promising one. However, high-k transistor performances are often affected by the presence of defects creating charge traps or diffusion centers. In this paper, using a pseudopotential plane wave code in the density-functional total theory framework, we calculate in a monoclinic HfO2 supercell the structure, formation and ionization energies, electron affinities of intrinsic defects (oxygen vacancy and interstitial, and hafnium vacancy). We consider different charge states of these defects. The positions of defect levels with respect to the bottom of silicon conduction band are determined. Our results will be discussed and compared to literature data.

A new 3DMultiString computer code of Ion Beam Analysis (IBA) using 4He++ ion channeling combined with Nuclear Resonance Analysis (NRA) is used to analyze controlled formation of order in continuous layers of silicon dioxide nucleated on (1×1) Si(100) via the Herbots-Atluri clean (U.S. patent 6,613,677 (9/3/2003)) in air at 300 K. In our most recent work, this new 3DMultiString simulations combined with IBA leads to the identification of a new two-dimensional nanophase of tetragonally distorted β-cristobalite SiO2 (annotated b-c SiO2) with a critical thickness of 2 nm from the (1×1) Si (100)/b-c SiO2 interface to the b-c SiO2 /amorphous SiO2 interface (annotated b-c SiO2/a-SiO2). 3DMultiString simulations of IBA data taken on this new b-c SiO2/(1×1) Si(100) interphase includes channeling along the three <100>, <110>, and <111> axes of Si (100) in combination 16OO(α, α)16O 3.045 MeV NRA to measure oxygen areal densities corresponding to nm-thick films. In this way, the critical thickness of the β-c SiO2 nanophase can be established as a function of oxygen coverage.This new 3DMultiSTRING computer code is derived from the original 3DSTRING program that originated at Bell Labs, NJ.

Germanium and hafnium-dioxide (HfO2) stack structures' physical and electrical properties were studied based on the comparison of germanium and silicon based metal-oxide-semiconductor (MOS) capacitors' electrical properties. In germanium MOS capacitor with oxide/oxynitride interface layer, larger negative flat-band-voltage (Vfb) shift compared with silicon based MOS capacitors was observed. Secondary ion mass spectrum (SIMS) characteristics of HfO2-germanium stack structure with germanium oxynitride (GeON) interfacial layer showed germanium out diffusion into HfO2. These results indicate that the germanium out diffusion into HfO2 would be the origin of the germanium originated negative Vfb shift. Using Ta3N5 layer as a germanium passivation layer, reduced Vfb shift and negligible hysteresis were observed. These results suggest that the selection of passivation layer strongly influences the electrical properties of germanium based MOS devices.

We study structural and electronic properties of the oxygen vacancy in monoclinic HfO2 for five different charge states. We use a hybrid density functional to accurately reproduce the experimental band gap. To compare with measured defect levels, we determine total-energy differences appropriate to the considered experiments. Our results show that the oxygen vacancy can consistently account for the defect levels observed in optical absorption, direct electron injection, and trap-assisted conduction experiments.

A hot wall Atomic Layer Deposition (ALD) flow reactor equipped with a Quartz Crystal Microbalance (QCM) has been used for the deposition of HfO2 thin films with tetrakis (dimethylamino) hafnium (TDMAH) and H2O as precursors. HfO2 films were deposited on H-terminated Si and SC1 chemical oxide starting surfaces. Spectroscopic ellipsometry (SE) and QCM measurements confirm linear growth of the films at a substrate temperature of 275°C.FTIR spectra indicate the films are amorphous as-deposited.Two distinct growth regimes are observed: from 1-50 cycles, both surfaces display similar growth rates of about 1.0Å/cycle; from 50-200 cycles, HfO2 growth is decreased by about 15% to ~0.87Å/cycle on both surfaces.Nucleation and initial growth behavior of the films on Si-H were examined using X-ray photoelectron spectroscopy (XPS).Angle-resolved XPS, at take-off angles of θ=0, 15, 30, 45 and 60° measured from the normal to the sample surface, is used to probe the interfacial region of thin films (4, 7, 10, 15 and 25 cycles) on H-terminated samples. Initially, an interfacial layer comprised of a SiOx/HfSiOx mixture is grown between 1-10 ALD cycles.We observe that the Si/HfO2 interface is unstable, and oxidation continues up to the 25th ALD cycle, reaching a thickness of ~18Å.

Thin films of hafnium oxide were deposited on silicon substratesusing tetrakis-diethylamino hafnium as precursor. Two different oxidizers: (a) ozone/oxygen mixture, and (b) dry oxygen were used for comparative study of the effect of different oxidizers on the deposited films. The deposition using dry oxygen was carried out in a cold-wall rapid thermal processing metalorganic chemical vapor deposition (MOCVD) reactor, whereas ozone/oxygen mixture was used in a cold-wall atomic layer deposition (ALD) reactor. Annealing studies were carried out at 600 and 800°C in high-purity argon at atmospheric pressure. X-ray photoelectron spectroscopy (XPS) analyses of as-deposited and annealed films were performed to study the HfO2/Si interface. The films deposited using these two different oxidizers appeared to be of comparable quality. Silicon oxide formation at the interface occurred after annealing at 600°C and it increased upon further annealing at 800 °C.

Quantum mechanical simulations were performed to calculate the valence electron energy-loss spectra (VEELS) for hafnium oxide, hafnium silicate, silicon oxide and silicon systems using the full potential Linearized Augmented Plane Wave (LAPW) formalism within the Density Functional Theory (DFT) framework. The needed energy-loss function (ELF) was derived from the calculation of the complex dielectric tensor within the random phase approximation (RPA). The calculated spectra were compared with experimental scanning transmission electron microscopy (STEM)/EELS of atomic layer deposited (ALD) HfO2 on Si(100) to evaluate their use as a “fingerprint” method that can be used to distinguish among various polymorphs of HfO2 thin films and relate the fine structure to the electronic structure and local bonding environment. Calculated low-loss spectra are found to be in satisfactory agreement with experimental data. Also, the combination of such theoretical calculations and experimental data could be of key importance in our understanding of fundamental issues of these systems. Compared to energy-loss near edge structure (ELNES) or core energy-loss spectra, the ELF calculated for low-loss spectra is computationally less expensive and can prove useful for prompt analysis.

The nature of the interface between Si and Ge substrates and high-k dielectrics often controls the performance of MOSFET devices. Precleaning and/or chemical functionalization of the surfaces can dramatically affect the formation of an interfacial layer. We have used in-situ IR spectroscopy to probe the relevant interfaces during ALD growth for a variety of surface treatments, including H- and Cl-termination, and nitridation. This paper focuses on understanding of the mechanisms for interfacial SiO2 (or GeOx) formation during HfO2 growth using tetrakis-ethylmethylamidohafnium (TEMAH) as the metal precursor and water or ozone as the oxygen precursor. We find that impurities arising from incomplete ligand elimination during growth (e.g. OH for H2O processing and CO- and NO-containing species for O3 processing) are incorporated into the HfO2 film during growth. Upon annealing, most of these species react, but can also migrate to the interface. Nitridation of Si and Ge surfaces will in general prevent SiO2 or GeOx formation but can also affect the growth rate.

This work demonstrates the application of a Markov Chain Monte Carlo (MCMC) approach to modeling X-ray reflectometry (XRR) data taken from a sub 10 nm Hafnium oxide film. We present here a comparison of two structural models for a 6 nm HfxOy atomic layer deposition (ALD) film on Si. Using the MCMC method and two distinct structural models, we show evidence of a thin interface between the HfxOy and Si layers with a density much higherthan native SiO2. Results from genetic algorithm XRR analysis and thickness measurements using cross-sectional transmission electron microscopy are included for comparison. We also demonstrate that our interpretation of HfxOy thickness differs between the two structural models (i.e., total film thicknesses may be partially additive within each model).

In this paper, various approaches to extend scalability of Hafnium-based dielectrics are reported.Among the three crystal phases of HfO2 (monoclinic, cubic and tetragonal), the tetragonal phase has been reported to have the highest dielectric constant.Tetragonal phase stabilization by crystallizing the thin HfO2 using a metal capping layer and by adding zirconium is demonstrated.The microstructure, morphology, optical properties and impurities of HfxZr1-xO2 dielectrics (for 0<x<1) are discussed.Subtle but important modification to high-k / Si interface characteristics resulting from addition of Zr into HfO2 is reported.To further boost the dielectric constant of hafnium-based dielectrics, incorporation of TiO2, which has been reported to have high dielectric constant, is explored.HfxZr1-xO2/TiO2 bilayer films were fabricated. 30 Å TiO2 films were deposited on a 5, 8, 12 or 15 Å HfxZr1-xO2 underlayer to determine the minimum thickness needed to maintain good thermal stability with Si substrate. CV and IV results indicated that 12-15 Å is the optimal thickness range for the HfxZr1-xO2 underlayer.A dielectric constant as high as 150 for TiO2 layer is extracted from TiO2 thickness series deposited on12 Å HfxZr1-xO2 underlayer.In addition to increasing the k-value of Hafnium-based dielectrics, it is important that the threshold voltage of these high-k devices is low.Here we report the use of thin Al2O3 capping layers to modulate PMOS threshold voltages.About 100 mV reduction in threshold voltage is achieved by capping HfO2 with a 5Å Al2O3 film.Finally, dielectric scaling by modifying the Si/high-k interfacial layer is attempted.Nitrogen incorporation into HfxZr1-xO2 is shown to be a simple and effective method to lower the capacitance equivalent thickness (CET) of Hafnium-based dielectrics.

The initial oxidation of Si(110)-16×2 clean surface has been investigated by using real-time synchrotron-radiation photoemission spectroscopy and scanning tunneling microscopy. The Si(110) initial oxidation is characterized by its unique rapid oxidation right after the introduction of oxygen molecules, which is most likely attributed to the preferential reactions at the pentagon pairs of the 16×2 reconstruction.