Accurate and reliable disaster forecasting is vital for saving lives and property. Hence, effective disaster management is necessary to reduce the impact of natural disasters and to accelerate recovery and reconstruction. Typhoons are one of the major disasters related to heavy rainfall in Korea. As a typhoon develops in the far ocean, satellite observations are the only means to monitor them. Our study uses satellite observations to propose a deep-learning-based disaster monitoring model for short-term typhoon rainfall forecasting. For this, we consider two deep learning models: a video frame prediction model, Warp and Refine Network (WR-Net), to predict future satellite observations and an image-to-image translation model, geostationary rainfall product (GeorAIn) (based on the Pix2PixCC model), to generate rainfall maps from predicted satellite images. Typhoon Hinnamnor, the worst typhoon case in 2022 in Korea, is selected as a target case for model verification. The results show that the predicted satellite images can capture the structures and patterns of the typhoon. The rainfall maps generated from the GeorAIn model using predicted satellite images show a correlation coefficient of 0.81 for 3-hr and 0.56 for 7-hr predictions. The proposed disaster monitoring model can provide us with practical implications for disaster alerting systems and can be extended to flood-monitoring systems.

Microscopy is a widely used method in biological research to observe the morphology and structure of cells. Amongst the plethora of microscopy techniques, fluorescent labeling with dyes or antibodies is the most popular method for revealing specific cellular organelles. However, fluorescent labeling also introduces new challenges to cellular observation, as it increases the workload, and the process may result in nonspecific labeling. Recent advances in deep visual learning have shown that there are systematic relationships between fluorescent and bright-field images, thus facilitating image translation between the two. In this article, we propose the cross-attention conditional generative adversarial network (XAcGAN) model. It employs state-of-the-art GANs (GANs) to solve the image translation task. The model uses supervised learning and combines attention-based networks to explore spatial information during translation. In addition, we demonstrate the successful application of XAcGAN to infer the health state of translated nuclei from bright-field microscopy images. The results show that our approach achieves excellent performance both in terms of image translation and nuclei state inference.

This paper discusses the design steps and experimental characterization of a monolithic microwave integrated circuit (MMIC) power amplifier developed for the next generation of K-band 17.3–20.2 GHz very high throughput satellites. The technology used is a commercially available 100-nm gate length gallium nitride on silicon process. The chip was developed taking into account the demanding constraints of the spacecraft and, in particular, carefully considering the thermal constraints of such technology, in order to keep the junction temperature in all devices below 160°C in the worst-case condition (i.e., maximum environmental temperature of 85°C). The realized MMIC, based on a three-stage architecture, was first characterized on-wafer in pulsed regime and, subsequently, mounted in a test-jig and characterized under continuous wave operating conditions. In 17.3–20.2 GHz operating bandwidth, the built amplifier provides an output power >40 dBm with a power added efficiency close to 30% (peak >40%) and 22 dB of power gain.

This paper presents the radio frequency (RF) measurements of an SPST switch realized in gallium nitride (GaN)/RF-SOI technology compared to its GaN/silicon (Si) equivalent. The samples are built with an innovative 3D heterogeneous integration technique. The RF switch transistors are GaN-based and the substrate is RF-SOI. The insertion loss obtained is below 0.4 dB up to 30 GHz while being 1 dB lower than its GaN/Si equivalent. This difference comes from the vertical capacitive coupling reduction of the transistor to the substrate. This reduction is estimated to 59% based on a RC network model fitted to S-parameters measurements. In large signal, the linearity study of the substrate through coplanar waveguide transmission line characterization shows the reduction of the average power level of H2 and H3 of 30 dB up to 38 dBm of input power. The large signal characterization of the SPST shows no compression up to 38 dBm and the H2 and H3 rejection levels at 38 dBm are respectively, 68 and 75 dBc.

This paper presents a high-efficiency linear GaN K-band transmitter for broadband high peak-average power ratio (PAPR) signals. A GaN MMIC 18.5–24 GHz three-stage power amplifier with over 4 W peak output power, 20 dB saturated gain, and 40% peak PAE is supply-modulated with a four-level discrete dynamic supply GaN MMIC. For 100 MHz signals with ${\rm PAPR}\gt 10\, {\rm dB}$, we demonstrate an average efficiency improvement from 14 to 20% with a simultaneous linearity improvement in noise power ratio (NPR) from 23 to 26 dB through a shaping function focused on gain linearization. For 250 MHz signal bandwidth, there is no observed degradation in NPR and the efficiency is improved by 5 percentage points. For discrete supply modulation, the switching transients between levels are experimentally investigated for wideband signals.

This paper presents a novel GaN-based digital outphasing power amplifier (PA) for the 800 MHz range. The PA reaches a maximum output power of 5.8 W at 30 V final-stage (FS) drain supply voltage. A novel output combiner circuit is used and efficiency is improved by resonant commutation of the FSs and optimized driver circuits for the two GaN push-pull FSs. 3D electromagnetic simulation of output network has been conducted to extract an equivalent circuit model and to access full information in terms of functionality and broadband impedance characteristics for optimized outphasing operation in the final design. Measured total efficiencies (ηtot) of 59 and 25% at 0 and 10 dB power back-off are achieved, respectively, fitting the simulation quite well. The proposed digital outphasing module is a promising candidate for fully digitized base-station architectures in future wireless communications.

The paper presents a highly efficient GaN-based synchronous buck converter suitable for switching in the lower GHz range. The module includes a very compact 2-stage GaN half-bridge converter MMIC (monolithic microwave integrated circuit) for low parasitic inductances between switches and drivers and a hybrid output network with core-less inductors to avoid ferrite losses. At 1 GHz switching frequency the buck converter achieves with pulse-width modulated (PWM) input signals power loop conversion efficiencies up to 78% for 40 V operation and output voltages up to 33 V. For 100 MHz the power loop efficiencies peak at 87.5% for 14.5 W conversion to 25 V. By changing the output network to a 2nd order low-pass with 700 MHz cut-off frequency the module has been characterized for the use as a supply modulator in very broadband envelope tracking systems with modulation bandwidths of up to 500 MHz. For 1 GHz switching frequency the power-added efficiency peaks at 74% for a 90% duty-cycle PWM input signal. The novelty of this work is that for the first time a buck converter design proves highest flexibility supporting different applications from very compact DC converters to microwave power amplifier efficiency enhancement techniques as well as efficient high frequency switching up to 1 GHz.

GaN films have been grown on SiC substrates with an AlN nucleation layer by using a metal organic chemical vapor deposition technique. Micro-cracking of the GaN films has been observed in some of the grown samples. In order to investigate the micro-cracking and microstructure, the samples have been studied using various characterization techniques such as optical microscopy, atomic force microscopy, Raman spectroscopy, scanning electron microscopy and transmission electron microscopy (TEM). The surface morphology of the AlN nucleation layer is related to the stress evolution in subsequent overgrown GaN epilayers. It is determined via TEM evidence that, if the AlN nucleation layer has a rough surface morphology, this leads to tensile stresses in the GaN films, which finally results in cracking. Raman spectroscopy results also suggest this, by showing the existence of considerable tensile residual stress in the AlN nucleation layer. Based on these various observations and results, conclusions or propositions relating to the microstructure are presented.

This paper describes the development of an L-Band (f0 = 1.575 GHz) high power and efficient solid state power amplifier (SSPA) designed for the European satellite navigation system (i.e. Galileo). The amplifier, developed in the framework of the European Project named SLOGAN, exploits the GH50-10 GaN technology available at United Monolithic Semiconductor foundry. The aim of the project is to offer, using as much as possible European technologies, a valid alternative to replace traveling wave tube amplifiers with more compact and reliable systems. All the SSPA functionalities, i.e. power supply, power conditioning and radio frequency amplification, are integrated in the developed architecture and accommodated in a single box with limited volume and mass. The required output power level is achieved by parallelizing several GaN die power bars of 12 and/or 25.6 mm. In continuous wave operating mode, the overall SSPA delivers an output power higher than 250 W at less than 2 dB of gain compression in the whole E1-band. Moreover, the registered gain and efficiency are higher than 67 dB and 54%, respectively.

Group III nitrides are promising materials for light emitting diodes (LEDs). The occurrence of structural defects strongly affects the efficiency of these LEDs. We investigate the optical properties of basal plane stacking faults (BFSs), and the assignment of specific spectral features to distinct defect types by direct correlation of localized emission bands measured by cathodoluminescence in a scanning electron microscope with defects found in high resolution (scanning) transmission electron microscopy and electron beam induced current at identical sample spots. Thus, we are able to model the electronic structure of BSFs addressing I1, I2, and E type BSFs in GaN and AlGaN with low Al content. We find hints that BSFs in semipolar AlGaN layers cause local changes of the Al content, which strongly affects the usability of AlGaN as an electron blocking layer in nitride based LEDs.

Various practical issues affecting atom probe tomography (APT) analysis of III-nitride semiconductors have been studied as part of an investigation using a c-plane InAlN/GaN heterostructure. Specimen preparation was undertaken using a focused ion beam microscope with a mono-isotopic Ga source. This enabled the unambiguous observation of implantation damage induced by sample preparation. In the reconstructed InAlN layer Ga implantation was demonstrated for the standard “clean-up” voltage (5 kV), but this was significantly reduced by using a lower voltage (e.g., 1 kV). The characteristics of APT data from the desorption maps to the mass spectra and measured chemical compositions were examined within the GaN buffer layer underlying the InAlN layer in both pulsed laser and pulsed voltage modes. The measured Ga content increased monotonically with increasing laser pulse energy and voltage pulse fraction within the examined ranges. The best results were obtained at very low laser energy, with the Ga content close to the expected stoichiometric value for GaN and the associated desorption map showing a clear crystallographic pole structure.

The dislocation distribution of high-quality single-crystal gallium nitride (GaN) films grown by the hybrid vapor phase epitaxy was analyzed. This study examined the domain structure of GaN from the dislocation distribution on the macroscale by optical microscopy. The surface structure of GaN consisted of domains with microcolumns as the substructure. The inner domains contained a lower density of dislocations but a large number of these dislocations were observed along the domain boundaries. The existence of a domain boundary structure doubly increased the total dislocation density.

This paper reports on digital transmitter architecture for the 450 MHz band using an envelope delta-sigma modulator realized in CMOS and a voltage-mode class-S (VMCS) power amplifier (PA) based on GaN monolithic microwave integrated circuits (MMICs). The class-S PA is characterized for narrowband single-tone signals and a single- as well as a four-carrier downlink wideband code division multiple access (WCDMA) signal with a peak-to-average power ratio of 7.5 dB. Using single-tone excitation the PA shows a maximum drain efficiency of 86% and a peak output power of 4.4 W. At 6 and 10 dB back-off, 59 and 36% efficiency are achieved, respectively. With the single- and four-carrier WCDMA input signals maximum drain efficiencies of 64 and 53% are reached, respectively, and peak output power is 0.7 W. The adjacent channel leakage ratio shows values of about −34 dBc (5 MHz) and −38 dBc (10 MHz) for single-carrier WCDMA excitation. This is the first complete VMCS PA chain characterized with standard communication signals.

This paper reports on a novel voltage-mode class-S power amplifier for the 450 MHz band, based on GaN–HEMT monolithic microwave integrated circuits (MMICs). It achieves a peak output power of 3.4 W for a single tone at 400 MHz, encoded in standard band-pass delta-sigma modulation with 1.6 Gbps sampling frequency. The corresponding efficiency is 38%, peaking at 52% for 0.5 W output power. In order to demonstrate the influence of coding efficiency, additional measurements using a periodic square-wave signal were performed (class-D operation), which yield a maximum output power of 7 W with 64% efficiency. To the author's knowledge, these are the best results in this frequency range achieved so far with the voltage-mode class-S configuration. The paper discusses behavior at power back-off and the influence of the loss mechanisms.

We present here a new set of equations for modeling the I–V characteristics of Field Effects Transistors (FETs), particularly optimized for AlGaN/GaN HEMTs. These equations describe the whole characteristics from negative to positive breakdown loci, and reproduce the current saturation at high level. Using this model enables to decrease the modeling process duration when a same transistor topology is used for several applications in a T/R module. It can even be used for switches design, which is the most demanding application in terms of I–V swing. Moreover, particular care was taken to accurately model the first third orders of the current derivatives, which is important for multione applications. We also focused on an accurate definition of the nonlinear elements such as capacitances for power applications. There are 18 parameters for the main current source (and six for both diodes Igs and Igd). This can be compared to Tajima's equations-based model (13 parameters) or to the Angelov model (14 parameters), which only fit the I–V characteristics for positive values of Vds. We will detail here the model formulation, and show some measurements/modeling comparisons on both I–V, [S]-parameters and temporal load-pull obtained for a 8 × 75 μm GaN HEMT, with 0.25 μm gate length.

The present paper presents an overview of the AlGaN/GaN-based circuits realized over the years. Two technological processes with 0.25 and 0.7 μm gate length allowed one to address applications from L- to Ku-bands. Depending on the process development and frequency of the operation, results on hybrid or MMIC technology are presented. GaN technology is evaluated through the realization of high-power amplifiers, robust low-noise amplifiers, or power switches to prepare the next generation of Tx-Rx modules.

The aim of the present paper is to highlight the possible benefits coming from the use of the GaN high electron-mobility transistor (HEMT) technology in the Doherty power amplifier (DPA) architecture. In particular, the attention is focused on the capabilities and the relevant drawbacks of a GaN HEMT technology when designing DPAs. A deep discussion of the DPA's design guidelines is also presented through the realization of three prototypes implementing different design solutions and working at 2.14 GHz. The first example is a tuned load DPA (TL-DPA), which show an average drain efficiency of 40.7% with 3 W of saturated output power in the obtained 6 dB of output back-off. The second DPA was designed implementing a class F harmonic termination for the main device, which allows an improvement of roughly 15% in output power and efficiency behavior with respect to the TL-DPA. The last DPA was realized implementing a single output matching network for both main and auxiliary devices, which allows a relevant reduction in the size of the resulting DPA, without downgrading the overall performances.

We present an overview on epitaxial growth, processing technology, device performance, and reliability of our GaN high electron mobility transistors (HEMTs) manufactured on 3- and 4-in. SiC substrates. Epitaxy and processing are optimized for both performance and reliability. We use three different gate lengths, namely 500 nm for 1–6 GHz applications, 250 nm for devices between 6 and 18 GHz, and 150 nm for higher frequencies. The developed HEMTs demonstrate excellent high-voltage stability, high power performance, and large DC to RF conversion efficiencies for all gate lengths. On large gate width devices for base station applications, an output power beyond 125 W is achieved with a power added efficiency around 60% and a linear gain around 16 dB. Reliability is tested both under DC and RF conditions with supply voltage of 50 and 30 V for 500 and 250 nm gates, respectively. DC tests on HEMT devices return a drain current change of just about 10% under IDQ conditions. Under RF stress the observed change in output power density is below 0.2 dB after more than 1000 h for both gate length technologies.

The present paper presents the transistor modeling work achieved in the GaN European project KorriGaN (“Key Organisation for Research in Integrated Circuits in GaN technology”). The KorriGaN project (2005–09) has released 29 GaN circuits such as high-power amplifiers (HPAs), low-noise amplifiers (LNAs), and switches. Modeling is one of the main key to reach successful designs. Therefore, nonlinear models of European GaN HEMT models have been developed. This work deals with characterization tools such as pulsed IV, pulsed [S] parameters, load-pull measurements, and measurement-based methods to perform GaN HEMT compact models parameters extraction. The present paper will describe the transistor modeling activities in KorriGaN for HPA designs (nonlinear models including trapping and/or self-heating effects) and LNA designs (nonlinear models and noise parameters).

We report on the investigation of GaN(0001)−1×1 using synchrotron radiation x-ray excited photoelectron spectra from the core levels Ga 3p and N 1s, as well as from the contaminants O 1s and C 1s. Measurements were done after outgassing (a) and during three surface treatment methods performed in sequence; (b) ammonia (NH3) flux anneals, (c) Ga deposition with sample held at room temperature followed by vacuum anneal, and (d) Ga deposition on a heated sample followed by Ga desorption during NH3 flux anneal. We have found that the initial NH3 flux anneals increased the amount of present N on the surface and enabled the formation of a well-ordered surface structure, according to the low energy electron diffraction (LEED) pattern. After treatment (b) and (d) the core level spectra of Ga 3p are much improved showing clearly distinct features indicative of increased Ga-N bonding. The Ga to N concentration ratio decreases during the surface treatments from 4.0 to 1.1, hence towards stoichiometry. The amounts of C (and O) present on the surface after outgassing corresponded to 1.1 (0.9) monolayers (ML) but reduced to 0.1 (0.1) ML after the final treatment (d). The Fermi level position in the band gap shifts down by 0.55 eV during the surface treatments, indicating a change of states present in the band gap. We have also found strong support that this Ga-polar sample is initially Ga-terminated.