A void free 3C-SiC film grown on Si(100) can be achieved by low pressure chemical vapor deposition using the modified four-step method. The diffusion step plays an important role to enhance the quality of the 3C-SiC buffer layer on Si(100). X-ray photoelectron spectroscopy was used to characterize the bonding characteristics of the 3C-SiC buffer layer of about 10 nm thick. The Si-C bonds are partially formed on the as-carburized Si(100) before the diffusion step. The ratio of C-C to Si-C bonds on the as-carburized Si(100) is about 7:3, which can be lowered to about 1:9 after the diffusion step at 1350 oC for 5 min or at 1300 oC for 7 min. According to XPS data and Fick's second law, the diffusivity of Si across the 3C-SiC interlayer are determined to be 2.2×10-16 cm2/s and 3.13×10-16 cm2/s at 1300°C and 1350°C, respectively. The derived activation energy is 1.6 eV for the diffusion of Si atoms in the 3C-SiC buffer layer.

We propose a new technique to fabricate 4H-SiC metal–oxide–semiconductor field-effect transistors (MOSFETs) with high inversion channel mobility. P atoms were incorporated into the SiO2/4H-SiC(0001) interface by post-oxidation annealing using phosphoryl chloride (POCl3). The interface state density at 0.2 eV from the conduction band edge was reduced to less than 1 × 1011 cm−2eV−1 by the POCl3 annealing at 1000 °C. The peak field-effect mobility of 4H-SiC MOSFETs on (0001) Si-face processed with POCl3 annealing at 1000 °C was approximately 90 cm2/Vs. The high channel mobility is attributed to the reduced interface state density near the conduction band edge.

In this work, 4H-SiC substrates intentionally misoriented from the (0001) plane toward [1-100] direction are shown to eliminate rotational twinning in icosahedral boron arsenide (B12As2, abbreviated here as IBA) epitaxial films. Previous studies of IBA on other substrates, including (100), (110), (111) Si and (0001) 6H-SiC, produced polycrystalline and twinned epilayers. Comparisons of IBA on on-axis and off-axis c-plane 4H-SiC by synchrotron white beam x-ray topography (SWBXT), and high resolution transmission electron microscopy (HRTEM) confirm the single crystalline and much higher quality of the films on the latter substrates. Furthermore, no intermediate layer between the epilayer and substrate was observed for IBA on off-axis 4H-SiC. Steps formed on the off-axis 4H-SiC substrate surface before deposition cause the film to adopt a single orientation, a process that is not seen with substrates with either no misorientation, or those tilted toward the [11-20] direction. This work demonstrates that c-plane 4H-SiC with 7° offcut toward (1-100) is potentially a good substrate choice for the growth of high-quality, untwinned B12As2 epilayers for future device applications.

Graphene has been grown by direct deposition of carbon from solid sources on both SiC and Ta films on SiC in an MBE environment. Carbon fluxes were obtained from thermally evaporated C60 and from a heated graphite filament. The graphene films were characterized by Raman spectroscopy, X-ray photoelectron spectroscopy and atomic force microscopy. Graphene films on Si-face SiC grown by carbon source MBE (CSMBE) were compared with graphene grown by the standard epitaxial graphene process using SiC thermal decomposition. CSMBE on SiC was found to grow at lower temperatures (1200°C) and to have fewer pits and a more uniform surface. Uniform graphene films were found to grow on Ta films after exposure to both carbon sources at 1200°C but Raman measurements showed no signs of graphene on films exposed to the same temperature without a carbon flux.

Single Shockley faults (SSF) have been studied in 4H-SiC epitaxial layers by using a spatial resolved micro-photoluminescence technique. In particular the effect of the UV pumping laser has been investigated. Samples have been irradiated at different power densities in order to find a threshold for the growth of the SSF defects. A low power density (115 W/cm2) exposition at 325 nm does not affect the structural properties of the epitaxial layers. We observed a growth of this defect through the epitaxial layers when the power density is increased over the value of 115 W/cm2.

This study compares p-MOS capacitors fabricated on N+ implanted and on virgin 4H-SiC. The former sample have N at the SiO2/SiC interface, the latter have not. To investigate the presence of deep and shallow hole traps at the SiO2/SiC interface, high frequency and quasi-static capacitance voltage measurements under dark have been compared for bias sweeping from accumulation to depletion and from depletion to accumulation, the latter after white light illumination. The presence of N has an effect on the density of the shallow donor like traps but none effect on the deep ones. The positive charge trapped in the oxide and/or at the oxide interface after equivalent tunneling hole injection have been compared and are equivalent. Time dependent dielectric breakdown tests have been compared too. The oxide grown on N+implanted SiC broken at lower electric field.

Silicon carbide (SiC) semiconductor devices for high power are becoming more mature and are now commercially available as discrete devices. Schottky diodes have been on the market since a few years but also bipolar junction transistors (BJTs), JFETs and MOSFETs are now reaching the market. The interest is rapidly growing for these devices in high power and high temperature applications. The BJTs have low conduction losses, fast switching capability, operate in normally-off mode, have high radiation hardness, and can handle high power density.

This paper will review the current state of the art in active switching device performance with special emphasis on BJTs. Device performance has been demonstrated over a wide temperature interval. A very important feature in high power switch applications is the low on-resistance of a device. Better material quality and epi processes suppress the amount of basal plane dislocations to avoid stacking fault formation generated during high current injection. This has long been a concern for bipolar SiC devices but several research reports and long term reliability measurements of pn-junctions show that the bipolar degradation problem can be solved by a fine-tuned epitaxial technique. A discussion on surface passivation control is included.

Finally, an example of a power switching module is given also demonstrating the excellent paralleling capability of BJTs.

Crystalline silicon carbide (SiC) and silicon (Si) biocompatibility was evaluated in vitro by directly culturing three skin and connective tissue cell lines, two immortalized neural cell lines, and platelet-rich plasma (PRP) on these semiconducting substrates. The experiments were performed specifically for the three adopted SiC polytypes, namely 3C-, 4H- and 6H-SiC, and the results were compared to those obtained for Si crystals. Cell proliferation and adhesion quality were studied using MTT [3-(4,5-dimethylthiazol-2-yl)-2,5-diphenyltetrazolium bromide] assays and fluorescent microscopy. For the neural cells studied AFM was also used to quantify the filopodia and lamellipodia extensions on the surface of the tested materials. Fluorescent microscopy was also used to assess platelet adhesion to the semiconductor surfaces where significantly lower values of platelet adhesion to 3C-SiC was observed compared to Si. The reported results show that SiC is indeed a more biocompatible substrate than Si. While there were some differences among the degree of biocompatibility of the various SiC polytypes tested, SiC appears to be a highly biocompatible material in vitro that is also somewhat hemocompatible. This extremely intriguing result appears to put SiC into a unique class of materials that is both bio- and hemo-compatible and is, to the best of our knowledge, the only semiconductor with this property.

The unique capabilities and characteristics provided by afterglow or remote plasma chemical oxide growth processing of silicon carbide are reviewed. Such processing provides for thermal growth of oxide films at temperatures far below those employed by conventional atmospheric processing methods. Overshadowing this growth capability is the ability to create chemistries, sequential procedures, and specific process environments to address material and defect issues in a manner not possible under conventional atmospheric conditions. The details and outcomes of multi-step afterglow oxidation processing of SiC will be discussed. An example sequence might include; 1) surface conditioning, 2) film growth at 850C and 1 Torr total pressure, and 3) reduced pressure unexcited media post-growth treatments. Surface conditioning impacts the thickness uniformity of the final oxide film and the oxidation rate. The film growth interval produces a nominal 500Å of oxide film in 90 minutes at 850C, a temperature that would not produce any significant oxide film at atmospheric pressure. And the post-growth processing improves the performance of the dielectric film. Using in-line corona-Kelvin metrology the electrical characteristics stemming from these processes have been determined. Electrical effective oxide thickness results were used to assess thickness uniformity and to estimate process rate constants for comparison to other process methods. Fowler-Nordheim, F-N, characteristics determined with the same metrology demonstrate that afterglow, AG, oxides require higher field levels to produce the same F-N current as thermal oxides and that AG films are less susceptible to stress fluence. Process extensions from these and other results are discussed and related to chemical, physical, and electrical film outcomes and potential pathways to improve control over dielectric SiC structures.

We present theoretical calculations for ohmic contact technology to wurtzite Silicon Carbide using thin Indium Gallium Nitride and Aluminium Indium Nitride cap layers. Spontaneous and piezoelectric polarization in Indium Gallium Nitride and Aluminium Indium Nitride cap layers gives rise to bound interface sheet charge density of the order of 1013 electrons per cm2, and built-in electric fields of the order of MV per cm. For Si-face p-type SiC, the large compressive strain in very thin InGaN and AlInN cap layers results in negative sheet charge densities and much lower tunneling widths for holes compared to bulk contacts. For C-face p-type SiC, pseudomorphic nitride layers yield no benefit over bulk contacts since positive interface sheet charge densities repel holes and give higher contact resistances. However, thick, relaxed cap layers lead to spontaneous polarization-based negative charge densities that attract holes, leading to lower contact resistances. The contributions of the heavy, light and split-off band holes to the total tunneling flux is taken into account in our calculations. All tunneling probabilities are calculated within the Wentzels-Kramers-Brillouin approximation. The presence of the appropriate cap layers leads to several orders of magnitude improvement in tunneling transmission probabilities, and in many cases, makes ohmic technology to SiC feasible. While the major difficulties are encountered for contacts to p-type SiC, the effect of cap-based polarization technology on contacts to n-type layers is also discussed in this paper. Our calculations have relevance to contact technology for bipolar devices built from wide band-gap wurtzite semiconductors like heterojunction bipolar transistors, light-emitting diodes and lasers.

SiC single crystals are grown at II-VI by the seeded sublimation technique. The process has been scaled up and optimized to support commercial production of high-quality 100 mm diameter, Semi-Insulating (SI) 6H substrates and 100 mm 4H n+ substrates. The growth process incorporates special elements aimed at achieving uniform sublimation of the source, steady growth rate, uniform doping and reduced presence of background impurities.

Semi-insulating 6H substrates are produced using precise vanadium compensation. Vanadium doping is optimized to yield SI material with very high resistivity and low capacitance.

Crystal quality of the substrates is evaluated using a wide variety of techniques. Specific defects, their interaction and evolution during growth are described with emphasis on micropipes and dislocations. The current quality of the 6H SI and 4H n+ crystals grown at II-VI is summarized.

An effect of electron irradiation on the concentrations of deep-level centers in C-rich and Si-rich 6H-SiC wafers is investigated. In the former material, the main deep-level centers with activation energies of Ec-0.50, Ec-0.64 and Ec-0.67 eV are found to be related to dicarbon interstitials and CiNC complexes located in hexagonal and quasi-cubic lattice sites, respectively. In the latter material, the dicarbon interstitials are dominant after the irradiation with 1.5-MeV electrons. At the energy of bombarding electrons equal to 0.3 and 0.7 MeV, the activation energies of the dominant deep-level centers are Ec-0.38 and Ec-0.52 eV, respectively. The first center is related to carbon vacancies and the second to silicon interstitials.

Silicon carbide has robust mechanical, electrical, and chemical properties which make it an attractive material candidate for micro- and nano-electromechanical systems (MEMS and NEMS). 3C-SiC films grown via a polysilicon seed-layer CVD-deposited on an oxide coated (111) Si substrate offers an innovative method to overcome the residual film stress issues associated with 3C-SiC heteroepitaxy and the difficulties of fabricating structures from 3C-SiC films. The oxide plays a dual role by permitting film relaxation with respect to the supporting substrate and functioning as a MEMS release layer, allowing MEMS structures such as cantilevers and diaphragms, to be easily fabricated from the 3C-SiC film. The impact of the oxide layer on the relaxation of the film stress was investigated by comparing direction-sensitive MEMS stress sensors fabricated from 3C-SiC films grown via a polysilicon-on-oxide-coated-substrate and a polysilicon-on-crystalline Si substrate. Scanning Electron Microscopy (SEM) analysis of bridge structures fabricated on the polysilicon-on-oxide substrate revealed evidence of film strain relaxation when compared to bridge structures fabricated on the polysilicon-on-crystalline Si substrate. However, the upward-curled cantilever and comb structures fabricated on both substrates indicate the presence of a strain gradient in the 3C-SiC film grown on both substrates.

Synchrotron White Beam X-ray Topography studies are presented of dislocation behavior and interactions in a new generation of one hundred millimeter diameter, 4H-SiC wafers grown using Physical Vapor Transport (PVT) under specially designed low stress conditions. Such low stress growth conditions have, for example enabled reductions of basal plane dislocation (BPD) densities by two or three orders of magnitude compared to previous levels down to just a few hundred per square centimeter. This provides a unique opportunity to discern details of dislocation behavior which were previously precluded due to complications of image overlap at higher densities. Among the phenomena observed in these studies is the deflection of threading dislocations onto the basal plane producing various stacking fault configurations. Analysis of the contrast from these faults enables determination of their fault vectors which, in turn, provides insight into their possible formation mechanisms.

The characteristics of a tunable wavelength filter in a-SiC:H multilayered stack p-i'i-n graded cells are studied both theoretically and experimentally. Three different architectures are tested for proper fine tuning of the spectral sensitivity. The simplest configuration is a two terminal p-i-n photodiode where the active intrinsic layer is a double layered a-SiC:H/a-Si:H thin film. In the others the active device consists of a p-i'(a-SiC:H)-n / p-i(a-Si:H)-n heterostructures where the doped layers can have high or low conductivities. The spectral analysis of the device is performed under different optical and electrical applied bias and frequencies. Results show that, depending on the architecture and time window used, the device acts as an optical filter, an amplifier or a multiplexer /demultiplexer for optical signal processing, wavelength conversion, signal demultiplexing, and pattern recognition. A theoretical analysis supported by numerical and electrical simulations is presented. The analysis uses simple phototransistor and photodiode equations to explain the response of the device under different optical signals, and to compare the generated photocurrent with the experimental data.

Thick and high quality 4H-SiC epilayers have been grown in a vertical hot-wall chemical vapor deposition system at a high growth rate on (0001) 8 0 off-axis substrates. We discuss the use of dichlorosilane as the Si-precursor for 4H-SiC epitaxial growth as it provides the most direct decomposition route into SiCl 2, which is the predominant growth species in chlorinated chemistries. The RMS roughness of the films ranged from 0.5-2.0 nm with very few morphological defects (carrots, triangular defects, etc.) being introduced, while enabling growth rates of 30-100 μm/hr, 5-15 times higher than most conventional growths. A specular surface morphology was attained by limiting the hydrogen etch rate until the system was equilibrated at the desired growth temperature. Site-competition epitaxy was observed over a wide range of C/Si ratios, with doping concentrations as low as 2x10 14 cm -3 being recorded. X-ray rocking curves indicated that the epilayers were of high crystallinity, with linewidths as narrow as 7.8 arcsec being observed, while microwave photoconductive decay (μPCD) measurements indicated that these films had high injection (ambipolar) carrier lifetimes in the range of 2 μs. These films also appeared to be free of polytype inclusions.

The effect of using SiO2 capping layer during Al implant activation anneal on the performance of 4H-SiC P-i-N diodes has been investigated. Two sets of 4H-SiC pin diode samples, one with SiO2 cap and another with graphite cap, were annealed under high temperatures of 1500°C for activation after Al implantation at 650°C to form the p-type active region and the JTE region. The surface stoichiometry of annealed SiC was examined by x-ray photoelectron spectroscopy (XPS). Various material and device parameters including surface roughness, sheet resistance, minimum forward leakage current and maximum breakdown voltage have been extracted for comparison. The results show that SiO2 cap effectively protects the SiC surface during high temperature implant annealing.

Graphene, a monoatomic layer of graphite hosts a two-dimensional electron gas system with large electron mobilities which makes it a prospective candidate for future nanocarbon devices. Grown epitaxially on silicon carbide (SiC) wafers, large area graphene samples appear feasible and integration in existing device technology can be envisioned. A precise control of the number of graphene layers and growth of large homogeneous graphene samples can be achieved. However, as-grown epitaxial graphene on SiC is electron doped due to the influence of the reconstructed interface layer present between graphene and SiC. Covalent bonds between SiC and the first carbon layer grown on top induce a dipole layer which induces charges into the graphene. As a result, the Dirac point energy where the π-bands cross is shifted away from the Fermi energy, so that the ambipolar properties of graphene cannot be exploited. How this effect can be overcome by a precise control and manipulation of the electronic structure of the π-bands is demonstrated by two methods. On the one hand, transfer doping of the epitaxial graphene surfaces with the strong acceptor molecule tetrafluoro-tetracyanoquinodimethane (F4-TCNQ) allows for a fine tuning of the doping level. Charge neutrality can be achieved for mono- and bilayer graphene. On bilayer samples the magnitude of the existing bandgap can be increased up to more than double of its initial value. On the other hand, the impact of the SiC-graphene interface can be completely eliminated by annealing the samples in molecular hydrogen. The hydrogen atoms migrate through the graphene layers, intercalate between the SiC substrate and the interface layer and bind to the Si atoms of the SiC(0001) surface. Thus the interface layer, decoupled from the SiC substrate, is turned into a quasi-free standing graphene monolayer. Similarly, epitaxial monolayer graphene turns into a decoupled bilayer. The intercalation process represents a highly promising route towards epitaxial graphene based nanoelectronics.

We have investigated a point defect, common to all SiC substrates, that is thought to be a broken carbon bond. Electron paramagnetic resonance spectroscopy performed in combination with three different etching methods using p-type, n-type, and semi-insulating substrates demonstrate that the center lies near the surface of a wafer. The results suggest that on the order of 1013 cm-2 defects are removed within the first micron of the surface of a wafer.

A 1.0 cm2 silicon carbide Super-GTO was designed and fabricated for Army pulsed power applications. It is a milestone, being the first SiC Super-GTO of this size. The design is the culmination of several years of research into material improvement, termination and gate patterns, optimizing device size, and calibrating pulse performance. The SGTO's forward blocking voltage is 9.0 kV, and its on-state voltage is 2.9 V at turn-on. Six devices were evaluated for pulse capability in a high-energy RLC circuit that was designed to produce a 1-ms wide half-sine shaped pulse. The maximum safe operating current for each of the six Super-GTOs varied from 2.2 kA to 3.4 kA, with 13 V being the typical VAK at a current of 3.0 kA. Two of the GTOs were also tested for pulse reliability and repeatability. They were individually switched in the pulse circuit for >500 pulses at very low duty cycle. This study is base-level research on pulse capability of the newest generation of SiC Super-GTOs and as such strives to identify the defining characteristics of an optimal device as well as the predominant modes of device failure.