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Single-crystal Silicon Carbide: A Biocompatible and Hemocompatible Semiconductor for Advanced Biomedical Applications

Published online by Cambridge University Press:  01 February 2011

Stephen E. Saddow
Affiliation:
[email protected], University of South Florida, Electrical Engineering, Tampa, Florida, United States
Camilla Coletti
Affiliation:
[email protected], University of South Florida, Electrical Engineering, Tampa, Florida, United States
Christopher Frewin
Affiliation:
[email protected], University of South Florida, Tampa, Florida, United States
Norelli Castro Schettini
Affiliation:
[email protected], University of South Florida, Electrical Engineering, Tampa, Florida, United States
Alexandra Oliveros
Affiliation:
[email protected], University of South Florida, Electrical Engineering, 4202 E. Fowler Ave, ENB 118, Tampa, Florida, 33620, United States
Mark Jaroszeski
Affiliation:
[email protected], University of South Florida, Chemical and Biomedical Engineering, Tampa, Florida, United States
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Abstract

Crystalline silicon carbide (SiC) and silicon (Si) biocompatibility was evaluated in vitro by directly culturing three skin and connective tissue cell lines, two immortalized neural cell lines, and platelet-rich plasma (PRP) on these semiconducting substrates. The experiments were performed specifically for the three adopted SiC polytypes, namely 3C-, 4H- and 6H-SiC, and the results were compared to those obtained for Si crystals. Cell proliferation and adhesion quality were studied using MTT [3-(4,5-dimethylthiazol-2-yl)-2,5-diphenyltetrazolium bromide] assays and fluorescent microscopy. For the neural cells studied AFM was also used to quantify the filopodia and lamellipodia extensions on the surface of the tested materials. Fluorescent microscopy was also used to assess platelet adhesion to the semiconductor surfaces where significantly lower values of platelet adhesion to 3C-SiC was observed compared to Si. The reported results show that SiC is indeed a more biocompatible substrate than Si. While there were some differences among the degree of biocompatibility of the various SiC polytypes tested, SiC appears to be a highly biocompatible material in vitro that is also somewhat hemocompatible. This extremely intriguing result appears to put SiC into a unique class of materials that is both bio- and hemo-compatible and is, to the best of our knowledge, the only semiconductor with this property.

Type
Research Article
Copyright
Copyright © Materials Research Society 2010

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References

[1] Bayliss, S.C., Buckberry, L.D., Harris, P.J., Tobin, M., Journal of Porous Material 7, pp. 191195, 2000.Google Scholar
[2] Maitz, M.F., Pham, M., Wieser, E., Journal of biomaterials applications 17, (4), pp. 303319, 2003.Google Scholar
[3] Mayne, A.H., Bayliss, S.C., Barr, P., Tobin, M., and Buckberry, L.D., “Biologically interfaced porous silicon devices,” Phys. Stat. Sol. (a), 182, pp. 505, 2000.Google Scholar
[4] Zhang, X.G., Electrochemistry of silicon and its oxide, Kluwer Academic/Plenum Publishers, New York, 2001.Google Scholar
[5] Carrasso, J.I. and Faktor, M.M., in The electrochemistry of semiconductors, Holmes, P.J. Editor, Academic Press, London, 1962, pp. 205255.Google Scholar
[6] Li, X., Wang, X., Bondokov, R., Morris, J., An, Y.H., Sudarshan, T.S., J. Biomed. Mater. Res. B: Appl. Biomater. 72, (2), pp. 353–61, 2005.Google Scholar
[7] Gonzalez, P., Serra, J., Liste, S., Chiussi, S., Leon, B., Perez-Amor, M., Fernandez, J. Martinez-, Arellano-Lopez, A.R. de, Varela-Feria, F.M., Biomaterials 24, pp. 48274832, Nov. 2003.Google Scholar
[8] Nordsletten, L., Hogasen, A.K., Konttinen, Y.T., Santavirta, S., Aspenberg, P., and Aasen, A.O., Biomaterials 17, pp. 15211527, 1996.Google Scholar
[9] Santavirta, S., Takagi, M., Nordsletten, L., Anttila, A., Lappalainen, R., Konttinen, Y.T., Arch. Orthop. Trauma Surg. 118, pp. 8991, 1998.Google Scholar
[10] Aspenberg, P., Aniila, A., Konttinen, Y.T. et al., Biomaterials 17, pp. 807812, 1995.Google Scholar
[11] Kalnins, U., Erglis, A., Dinne, I., Kumsars, I., Jegere, S., Med. Sci. Monit. 8, (2), 2002.Google Scholar
[12] Fan, J.; Li, H.; Jiang, J.; So, L. , K. Y.; Lam, Y. W.; Chu, P. K., Small 2008, 4, 10581062.Google Scholar
[13] Botsoa, J.; Lysenko, V.; Géloën, A.; Marty, O.; Bluet, J. M.; Guillot, G., Applied Physics Letters 92, 173902 (2008).Google Scholar
[14] Reyes, M., Shishkin, Y., Harvey, S., Saddow, S.E., Mater. Res. Soc. Symp. Proc., Vol. 911, pp. 79 (2006).Google Scholar
[15] Frewin, C. L., Coletti, C., Riedl, C., Starke, U., Saddow, S. E., Materials Science Forum 615–617, 589592 (2009).Google Scholar
[16] , Kumar, Ahmed, A., Vedawyas, I., M., , J. Vac. Sci. Technol. A 18 (5): 24862492 (2000).Google Scholar
[17] Coletti, C., Jaroszeski, M. J., Pallaoro, A., Hoff, A.M., Iannotta, S. and Saddow, S.E., IEEE EMBC Proceedings, pp. 58495852, (2007).Google Scholar
[18] Coletti, C., Jaroszeski, M., Hoff, A. M. and Saddow, S.E., Mater. Res. Soc. Symp. Proc., 950 (2006).Google Scholar
[19] Weisenberg, B A. and Mooradian, D. L., J Biomed Mater Res., vol. 60, no. 2, pp. 283291, May 2002.Google Scholar
[20] Park, K., Mao, F. W., and Park, H., Biomaterials, vol. 11, pp. 2431, 1989.Google Scholar
[21]Image J. [Online]. http://rsbweb.nih.gov/ij/Google Scholar
[22] Lebedev, M.A., and Nicolelis, M.A.L., Trends in Neurosciences, vol. 29, no. 9, pp. 536546, 2006.Google Scholar
[23] Polikov, V. S., Tresco, P.A., and Reichert, W.M., Journal of Neuroscience Methods, vol. 148, pp. 118, 2005.Google Scholar
[24] Lee, K., et al., Sensors and Actuators B, vol. 102: pp. 6772, 2004.Google Scholar
[25] Frewin, C. L., Jaroszeski, M., Weeber, E., Muffly, K.E., Kumar, A., Peters, M., Oliveros, A., and Saddow, S.E., Journal of Molecular Recognition, Vol. 22, pp. 380388, (2009).Google Scholar