Surface roughness is a critical factor affecting the performance of dental implants. One approach to influence this is through sandblasted, large grit, acid-etched (SLA) modification on pure titanium implant surfaces. In this study, SLA was performed on grade IV pure titanium. Sandblasting was conducted at distances of 2, 4, and 6 cm. Subsequently, the samples were etched with a mixed acid solution of HCl, H2SO4, and H2O for 0, 30, and 60 min. Surface roughness and X-ray diffraction (XRD) characterizations were conducted on the samples. The results revealed that surface roughness increased but was not too significant as the sandblasting distance decreased. Longer etching durations for sandblasted with acid-etched samples led to reduced surface roughness (Sa and Sz). It was found that a 60 min-etched sample resulted in optimal Sa, Sz, and Ssk values, i.e., 1.19 μm, 13.76 μm, and −0.60, respectively. The XRD texture was significantly influenced by sandblasting, with compressive residual stress increasing as the sandblasting distance decreased. Normal stress causes hill formations at shorter sandblasting distances. For etched samples, the residual stress decreased with longer etching durations. Normal stress-decreasing trend aligns with the initial reduction in hill and valley within the samples and subsequent hill enhancement at extended etching duration.

Residual strain in electrodeposited Li films may affect safety and performance in Li metal battery anodes, so it is important to understand how to detect residual strain in electrodeposited Li and the conditions under which it arises. To explore this Li films, electrodeposited onto Cu metal substrates, were prepared under an applied pressure of either 10 or 1000 kPa and subsequently tested for the presence or absence of residual strain via sin2(ψ) analysis. X-ray diffraction (XRD) analysis of Li films required preparation and examination within an inert environment; hence, a Be-dome sample holder was employed during XRD characterization. Results show that the Li film grown under 1000 kPa displayed a detectable presence of in-plane compressive strain (−0.066%), whereas the Li film grown under 10 kPa displayed no detectable in-plane strain. The underlying Cu substrate revealed an in-plane residual strain near zero. Texture analysis via pole figure determination was also performed for both Li and Cu and revealed a mild fiber texture for Li metal and a strong bi-axial texture of the Cu substrate. Experimental details concerning sample preparation, alignment, and analysis of the particularly air-sensitive Li films have also been detailed. This work shows that Li metal exhibits residual strain when electrodeposited under compressive stress and that XRD can be used to quantify that strain.

Elastic modulus and residual stress in freestanding ultrathin films (<100 nm) are characterized using bilayer cantilevers. The cantilevers comprise a test film and a well-characterized reference material (SU-8). When released from the substrate, residual stresses in the bilayer cantilever cause it to deflect with measurable curvatures, allowing the determination of both stiffness and residual stress of the test film. The technique does not require sophisticated mechanical test equipment and serves as a useful metrology tool for characterizing coatings immediately after fabrication in a clean room assembly line. The measured biaxial modulus and residual strain of 75 nm copper films are 211 ± 19 GPa and (7.05 ± 0.22) × 10−3, respectively. Additional experiments on the freestanding structures yield a mean Young’s modulus of 115 GPa. These properties are in close agreement with those measured from additional residual stress–driven structures developed on the same coatings by the authors.

In this paper, we will report about the implementation of the self-consistent Kröner–Eshelby model for the calculation of X-ray elastic constants for general, triclinic crystal symmetry. With applying appropriate symmetry relations, the point groups of higher crystal symmetries are covered as well. This simplifies the implementation effort to cover the calculations for any crystal symmetry. In the literature, several models can be found to estimate the polycrystalline elastic properties from single crystal elastic constants. In general, this is an intermediate step toward the calculation of the polycrystalline response to different techniques using X-rays, neutrons, or ultrasonic waves. In the case of X-ray residual stress analysis, the final goal is the calculation of X-ray Elastic constants. Contrary to the models of Reuss, Voigt, and Hill, the Kröner–Eshelby model has the benefit that, because of the implementation of the Eshelby inclusion model, it can be expanded to cover more complicated systems that exhibit multiple phases, inclusions or pores and that these can be optionally combined with a polycrystalline matrix that is anisotropic, i.e., contains texture. We will discuss a recent theoretical development where the approaches of calculating bounds of Reuss and Voigt, the tighter bounds of Hashin–Shtrikman and Dederichs–Zeller are brought together in one unifying model that converges to the self-consistent solution of Kröner–Eshelby. For the implementation of the Kröner–Eshelby model the well-known Voigt notation is adopted. The 4-rank tensor operations have been rewritten into 2-rank matrix operations. The practical difficulties of the Voigt notation, as usually concealed in the scientific literature, will be discussed. Last, we will show a practical X-ray example in which the various models are applied and compared.

The special application environment puts forward the higher requirement of reliability of parts made from titanium alloy Ti–6Al–4V, which is closely related to the machining-induced residual stress. For the fact of the non-linear distribution of residual stress beneath the machined surface, distribution of peripheral milling-induced residual stress and its effect on fatigue performance of titanium alloy Ti–6Al–4V are still confusing. In the present study, residual stress profile induced by peripheral milling of Ti–6Al–4V is first studied. And then, energy criteria are proposed to characterise the whole state of the residual stress field. Finally, the effects of residual stress profile and surface energy on tensile–tensile fatigue performance of titanium alloy Ti–6Al–4V are discussed. The conclusions were drawn that the variation trend of surface residual stress (σr,Sur), maximum compressive residual stress (σC,ax), location (hr0) and response depth (hry) of residual stress profile with cutting parameters showed a similar pattern for both measure directions those parallel (σ1) and perpendicular (σ3) to the cutting direction. Cutting speed and feed rate have a main effect on surface residual stress, and the depth of cut has little effect on all the four key factors of residual stress profile. With the increase of cutting speed and feed rate, machining-induced surface energy tends to become larger. But increasing the depth of cut caused the strain energy stored in unit time to decrease. Furthermore, the effect of depth of cut on surface energy was weakened when the value of cutting depth becomes larger. Both the surface compressive residual stress and the maximum compressive residual stress are beneficial for prolonging the fatigue life, while large value of machining-induced surface energy leads to a decrease of fatigue life. Analysis of variance result shows that maximum residual compressive stress has a greater impact on fatigue life than other residual stress factors.

In this study, a thermal–elastic–plastic finite element model is proposed to investigate the effect of volume energy density on the temperature field, molten pool size, and residual stress distribution in the selective laser melting (SLM) process of Inconel 718 alloy. A temperature-dependent thermal–mechanical property of materials is considered, as well as the properties conversion between powder layer and solidified alloy. Within the scope of the study parameters, the simulated molten pool size increases with increasing volume energy density and exhibits linear growth relationship, which are validated by the experimental results and show a good agreement. In addition, five scanning strategies are adopted to study the effect of these scanning strategies on the residual stress distribution in this research. The results show that the residual stress distribution of SLM Inconel 718 specimen largely depends on the scanning strategy. Finally, to reveal the mechanism of residual stress formation, the restraint bar model is used to further analyze the formation mechanism of residual stress during the SLM process.

A two-dimensional (2D) diffraction pattern is an image representing the diffraction intensity distribution over the detected area. For data evaluations of various materials characterization, such as phase identification, stress, texture, and crystal size, this distribution is further converted into the intensity distribution over 2θ or γ angles. For many applications, especially phase analysis and structure refinement, it is crucial for the two-dimensional (2D) pattern to have a large 2θ range sufficient to cover as many diffraction rings as necessary. The 2θ range covered by a 2D detector is determined by the size of the detector active area and the detector distance from the sample. In order to expand the 2θ coverage with a given 2D detector, one may collect several 2D frames at various swing angles and then merge the multiple frames, or scan the 2D detector over the desired 2θ range during the data collection. This paper introduces the geometry and algorithms to produce accurate 2D diffraction patterns with expanded 2θ coverages from multiple images or scanned images.

The grazing incidence diffraction (GID) method in side inclination mode, described by Ma et al. in 2002, of polycrystalline thin-film residual stress was revisited and explained using simple geometric relations. To overcome the issue of decreasing peak intensity of this method, which is induced by the decreasing incident angle because of the Eulerian cradle Chi-tilt, an improvement of Omega (ω)–Phi (φ) compensation was devised and applied to a NiFe thin-film sample. The geometry of this improved ω–φ compensated GID method in side inclination mode is detailed in this paper. This improvement guarantees a constant incident angle on the sample surface and a fixed sample illumination volume during measurement. The measured data were analysed using parametric refinement in DIFFRAC.TOPAS v6 software in Launch Mode, and details of the input file (.INP) are explained in this paper. The tensile stress of the NiFe thin-film sample was measured to be 1181 ± 85 MPa using this improved method.

The high-energy oscillating electric current pulse (ECP) technology was introduced to relieve the residual stresses in the small AISI 1045 steel specimens treated by the pulsed-laser surface irradiation. The high-energy oscillating ECP stress relief experiments were conducted to study the effectiveness of the high-energy oscillating ECP technology. In addition, the electroplasticity framework was developed based on the thermal activation theory to reveal the mechanism of the high-energy oscillating ECP stress relief. The results show that the high-energy oscillating ECP stress relief has good effects on eliminating the residual stress. Furthermore, the residual stress relieving mechanism of the high-energy oscillating ECP stress relief can be attributed to the electric softening effect and the dynamic stress effect. The findings confirm that the significant effects of high-energy oscillating ECP on metal plasticity and provide a basis to understand the underlying mechanism of the high-energy oscillating ECP stress relief.

The high-frequency vibration technology was introduced to relieve the quenched residual stress in the Cr12MoV steel based on the high-frequency vibration system that mainly consisted of an electromagnetic vibrator and an amplitude boost unit. The high-frequency vibratory stress relief (VSR) experiments were conducted to study the effectiveness of the high-frequency vibration technology. In addition, the high-frequency vibration plasticity model was developed based on the thermal activation theory to reveal the mechanism of the high-frequency VSR. The results show that the high-frequency VSR has good effects on eliminating residual stress, while the surface hardness for the Cr12MoV steel remains almost the same. Moreover, there are no changes in the grain size of the Cr12MoV steel during the high-frequency VSR, while the dislocation density for the Cr12MoV steel during the high-frequency VSR decreases by 27.21%. The decrease of dislocation density in the Cr12MoV steel is the essence of residual stress relaxation. The findings confirm the significant effects of high-frequency vibration on metal plasticity and provide a basis to understand the underlying mechanism of the high-frequency VSR.

Indentation method has been widely used in the measurement of material mechanical properties and residual stress for its simple, fast and nondestructive characteristics. In the indentation test, because of the plastic deformation of the material, the material accumulation and subsidence occurs around the indentation. It is found that the deformation amount of the indentation, especially the maximum pile-up around the indentation after unloading, is related to the magnitude and direction of the residual stress. In this paper, an experimental study on the pile-up morphology around an indentation for determining the direction and magnitude of residual stress is reported. Nonsymmetrical morphology of spherical indenting deformation on artificially strained steel specimen was measured with a laser scanning confocal system. A unique relationship between pile-up after unloading and biaxial residual stress was set up based on the experimental results. The direction and components of nonequibiaxial residual stress can be determined by the proposed method.

In this paper, taking into account the external loading, growth strain, creep, and bending deformation during the metallic high-temperature oxidation, a residual stress evolution model is developed according to the force- and moment-equilibrium equations. In this model, oxidation kinetic relationship (the stress-dependent growth rate) is related to the stress in the oxide scale, not classical parabolic law. If and only if the stress in the scale or the activation volume is equal to zero, this relationship can reduce to the parabolic law. Then the stress-dependent oxidation kinetics is compared with the stress-independent one (the parabolic law). Finally, effects of the external loading on the stress distribution in the oxide scale, the curvature of the system and the scale thickness are discussed, and numerical results show that the tensile external loading decreases the oxidation stress and promotes the growth rate of the oxidation layer.

The microstructure evolution (crystallite size and microstrain) as well as the residual stress of Cu thin films of various thicknesses (250 nm, 500 nm, and 1 μm) on passivated Si substrates during isochronal annealing was investigated by in situ X-ray diffraction measurements in the temperature range between 25 °C and 250 °C. Before annealing, the thermoelastic behavior was investigated excluding the occurrence of thermally activated relaxation processes occurring above ambient temperature by in situ stress measurements below ambient temperature. On this basis, above ambient temperature, effects of stress relaxation and emerging secondary stresses (due to grain growth and annihilation of crystal defects, giving rise to a considerable tensile stress contribution development) could be identified for all three layers in the temperature regime between ambient temperature and 250 °C. Grain growth in the nanocrystalline thin films started at much lower temperatures as compared to coarse-grained materials. The results were discussed in terms of the effects of different driving forces and grain-boundary mobilities acting in nanocrystalline materials.

A physics-based model of residual stress in minimum quantity lubrication (MQL) machining is presented. The stresses resulting from thermal and mechanical loading in the MQL machining process are coupled into an incremental thermal-elastic-plastic model for predicting the final resultant residual stress in the machined workpiece. Comparative analysis is made between the stresses produced by the thermal load and mechanical load in the machining process. Results manifest that for the surface of the machined workpiece, the stress produced by thermal load is on par with the contact stress produced by mechanical load in the magnitude. With the increase of depth into the workpiece, the stress produced by mechanical load is dominant of the total stresses. The rationale demonstrates that thermal load is prone to generate the tensile residual stress at the surface of the machined workpiece, while the mechanical load is prone to generate the compressive residual stress at the surface of the machined workpiece. Finally, the residual stress prediction model is verified by orthogonal cutting of AISI 4130 alloy steel.

Pulsed tandem gas metal arc welding (PT-GMAW) is being developed to increase productivity and minimise weld-induced distortion in ship-building. The PT-GMAW process was used in pulse–pulse mode to butt-weld two different strength and thickness steels; the residual stress and hardness profiles of the welds are reported and correlated.

This paper presents a statistical method to analyze instabilities that can be introduced during imaging in scanning electron microscopy (SEM). The method is based on the correlation of digital images and it can be used at different length scales. It consists of the evaluation of three different approaches with four parameters in total. The methodology is exemplified with a specific case of internal stress measurements where ion milling and SEM imaging are combined with digital image correlation. It is concluded that before these measurements it is important to test the SEM column to ensure the minimization and randomization of the imaging instabilities. The method has been applied onto three different field emission gun SEMs (Philips XL30, Tescan Lyra, FEI Helios 650) that represent three successive generations of SEMs. Important to note that the imaging instability can be quantified and its source can be identified.

As a consequence of substantial advances in computer-aided design and manufacturing technology, engineering parts are no longer restricted to combination of simple geometrical shapes. Implementing complex curved surfaces in engineering components in combination with finite-element geometry optimization has become a prevalent means of designing a part. Measuring residual stresses using X-ray diffraction (XRD) on complex curved surfaces requires further development of current measurement methods. Here we investigate how a laboratory XRD system equipped with a five-axis stage and two-dimensional detector can execute sin2ψ residual stress measurements on curved surfaces. Shadowing that blocks the diffracted beam to reach the detector was avoided using proper rotations and tilting of the sample. A standard video-laser alignment system commonly used to manually place the sample in the center of diffraction was used to also generate virtual maps of the sample's curved surfaces on a fine mesh grid. The geometry was then used for setting the required rotations and tilt angles. A set of diffraction frames collected using this method on a model zirconia dental ceramic, afforded the opportunity to superimpose phase and stresses on a complex geometry. This is a step forward for the XRD technology, and its usefulness applies to many different industries.

The present paper is about the estimation of lattice deformation from data collected from manufactures directly on site. The aim here is to give evidence that the concept of the Mean Equivalent Lattice (MEL), when applied to “on site X-Ray Diffraction” is the basis for a reliable qualification of the material rheology to external solicitations. Such method allows for the identification of lattice deformations without resorting to the computation of the residual stress with using the elasticity constants (i.e. tensile, shear and rigidity constants E, μ, ν); these elasticity constants descend from the classical theory of solid mechanics, where the continuum mechanics and the material isotropic model are the fundaments. Any MEL deformation is instead related to the variation of the d-spacing among lattice planes which are connected to the anisotropic atomic arrangement. So the macroscopic scale is constituted by a number of MELs and related boundaries. The recent on site X-ray diffraction technology may offer effective and easy solutions, with a significant impact on reliability of results, simplification, economy and time consuming.

Residual stress in MEMS is of inherent importance in various respects. This study proposes a specific method using ANSYS including the birth and death method and combined with the optimal method (SCGM) to reduce the residual stresses during the CMOS fabrication process. The suitable cooling temperature for decreasing the residual stress is proposed and available. It demonstrates that the suitable parameter on the fabrication can reduce the residual stress in MEMS devices without any extra manufacturing process or external apparatus. The proposed method can expand to simulate the realistic MEMS model effectively.

Based on the researches on the temperature and microstructures dependent fracture strength and temperature dependent thermal shock resistance, the new thermal shock resistance models for ultra-high-temperature ceramics were proposed. The effect of density on the fracture strength of material was investigated. A damage term was introduced to reveal the effects of uncertain factors on fracture strength. The roles of residual stress and microstructure sizes at different initial thermal shock temperatures in the thermal shock resistance were studied using the models. The study showed that the models can reveal the relationships among the residual stress, microstructure sizes and the temperature dependent thermal shock resistance well. The better thermal shock resistance is found for ultra-high-temperature ceramics having small SiC grains and relatively large micro-cracks around SiC grains. Large enhancement in thermal shock resistance can be achieved through our studies.