29 results
Effects of microstructure on the formation, shape, and motion of voids during electromigration in passivated copper interconnects
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- Journal:
- Journal of Materials Research / Volume 23 / Issue 2 / February 2008
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- 31 January 2011, pp. 383-391
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- February 2008
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Stress development and relaxation during reactive film formation of Ni2Si
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- Journal of Materials Research / Volume 19 / Issue 2 / February 2004
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- 03 March 2011, pp. 676-680
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- February 2004
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Mortality Dependence of Cu Dual Damascene Interconnects on Adjacent Segment
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- MRS Online Proceedings Library Archive / Volume 812 / 2004
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- 17 March 2011, F7.2
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- 2004
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Experimental Characterization of the Reliability of Multi-Terminal Dual-Damascene Copper Interconnect Trees
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- MRS Online Proceedings Library Archive / Volume 766 / 2003
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- 01 February 2011, E1.5
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- 2003
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The Effects of Width Transitions on the Reliability of Interconnects
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- MRS Online Proceedings Library Archive / Volume 612 / 2000
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- 17 March 2011, D2.8.1
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- 2000
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Experimental Studies of the Reliability of Interconnect Trees
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- MRS Online Proceedings Library Archive / Volume 612 / 2000
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- 17 March 2011, D8.7.1
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- 2000
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Circuit-Level and Layout-Specific Interconnect Reliability Assessments
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- MRS Online Proceedings Library Archive / Volume 612 / 2000
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- 17 March 2011, D2.2.1
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- 2000
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Modeling of the Structure and Reliability of Near-Bamboo Interconnects
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- MRS Online Proceedings Library Archive / Volume 391 / 1995
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- 15 February 2011, 163
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- 1995
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Competition between strain and interface energy during epitaxial grain growth in Ag films on Ni(001)
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- Journal of Materials Research / Volume 9 / Issue 9 / September 1994
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- 03 March 2011, pp. 2411-2424
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- September 1994
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EGRET High-Energy Gamma-ray Observations of AGN: Energy Spectra and Time Variability
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- Symposium - International Astronomical Union / Volume 159 / 1994
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- 19 July 2016, pp. 49-52
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- 1994
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The Effect of Variability Among Grain Boundary Energies on Grain Growth in Thin Film Strips
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- MRS Online Proceedings Library Archive / Volume 338 / 1994
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- 22 February 2011, 295
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- 1994
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Electromigration Lifetimes of Single Crystal Aluminum Lines with Different Crystallographic Orientations
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- MRS Online Proceedings Library Archive / Volume 338 / 1994
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- 22 February 2011, 319
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- 1994
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The yield stress of polycrystalline thin films
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- Journal of Materials Research / Volume 8 / Issue 2 / February 1993
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- 31 January 2011, pp. 237-238
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- February 1993
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Use of Magneto-Optic Kerr Effect Measurements to Study Strain and Misfit Accommodation in Thin Films of Ni/Cu (100)
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- MRS Online Proceedings Library Archive / Volume 308 / 1993
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- 15 February 2011, 765
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- 1993
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The Effect of Solute Drag on Grain Growth in Thin Films
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- MRS Online Proceedings Library Archive / Volume 317 / 1993
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- 15 February 2011, 431
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- 1993
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Grain Growth in Thin Films With Variable Grain Boundary Energy
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- MRS Online Proceedings Library Archive / Volume 317 / 1993
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- 15 February 2011, 485
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- 1993
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The Effect of Thermal History On Interconnect Reliability
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- MRS Online Proceedings Library Archive / Volume 309 / 1993
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- 21 February 2011, 383
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- 1993
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Nucleation of an intermetallic at thin-film interfaces: VSi2 contrasted with Al3Ni
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- Journal of Materials Research / Volume 7 / Issue 6 / June 1992
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- 31 January 2011, pp. 1350-1355
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- June 1992
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On the role of diffusion in phase selection during reactions at interfaces
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- Journal of Materials Research / Volume 7 / Issue 2 / February 1992
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- 31 January 2011, pp. 367-373
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- February 1992
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Kinetic and Thermodynamic Aspects of Phase Evolution in Ti/a-Si Multilayer Films
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- MRS Online Proceedings Library Archive / Volume 187 / 1990
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- 21 February 2011, 83
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- 1990
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