Hostname: page-component-586b7cd67f-dlnhk Total loading time: 0 Render date: 2024-11-29T07:47:54.440Z Has data issue: false hasContentIssue false
  • English
  • Français

The Effect of Solute Drag on Grain Growth in Thin Films

Published online by Cambridge University Press:  15 February 2011

H.J. Frost ,
Y. Hayashi ,
C.V. Thompson  and
D.T. Walton
H.J. Frost
Affiliation:
Dartmouth College, Thayer School of Engineering, Hanover, New Hampshire 03755
Y. Hayashi
Affiliation:
NEC Corporation, ULSI Research Laboratory, 1120Shimokuzawa, Kanagawa229, Japan
C.V. Thompson
Affiliation:
M.I.T., Dept. of Materials Science and Engineering, Cambridge, Massachusetts 02139
D.T. Walton
Affiliation:
Dartmouth College, Thayer School of Engineering, Hanover, New Hampshire 03755 Digital Equipment Corporation, 75 Reed Road, Hudson, Massachusetts 01749
Get access

Abstract

We have modelled the microstructural evolution of polycrystalline thin films during grain growth under the situation in which grain boundary migration becomes impeded by solute drag. For this we use a two-dimensional simulation of capillarity-driven grain growth in which grain boundaries migrate at velocities proportional to local curvature. At high driving forces, corresponding to high curvatures, the boundaries are given a mobility corresponding to drag-free motion. At low driving forces, corresponding to curvatures less than some critical value, the boundaries are given a lower mobility which models the effect of solute drag. During grain growth the average curvature of boundary segments decreases. When the boundary curvatures begin to fall below the critical curvature, the grain size distribution evolves to a lognormal distribution, which is maintained as significant further grain growth occurs. This is in accordance with many experimental grain size distributions which are commonly observed to be lognormal.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 317: Symposium B – Mechanisms of Thin Film Evolution , 1993 , 431
Copyright
Copyright © Materials Research Society 1994

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Gordon, P. and Vandermeer, R.A., Trans. TMS-AIME 224, 917–928 (1962).Google Scholar
2. Lücke, K. and Detert, K., Acta Metall. 5, 628–637 (1957).Google Scholar
3. Machlin, E.S., Trans. TMS-AIME 224, 1153–1167 (1962).Google Scholar
4. Cotterill, P. and Mould, P.R.. Recrystallization and Grain Growth in Metals, (John Wiley & Sons, New York, 1976).Google Scholar
5. Simpson, C.J., Winegard, W.C., and Aust, K.T., Grain Boundary Mobility and Boundary-Solute Interactions in Grain Boundary Structure and Properties, edited by Chadwick, G.A. and Smith, D.A. (Academic Press, New York, 1976) pp. 201–234.Google Scholar
6. Cahn, J.W., Acta Metall. 10, 789–798 (1962).CrossRefGoogle Scholar
7. Lücke, K. and Stüwe, H.P., Acta Metall. 19, 1087–1099 (1971).Google Scholar
8. Frost, H.J., Thompson, C.V., Howe, C.L., and Whang, J., Scripta Metall. 22, 65–70, (1987).CrossRefGoogle Scholar
9. DeHoff, R.T. and Rhines, F.N., Quantitative Microscopy. (McGraw-Hill, New York, 1968).Google Scholar
10. Tracy, B.M., Davies, P.W., Fänger, D., and Gartman, P., in Microstructural Science for Thin Film Metallizations in Electronic Applications, edited by Sanchez, J., Smith, D.A. and DeLanerolle, N. (TMS, 1988) pp. 157–167.Google Scholar
11. Wu, K., Baerg, W., and Jupiter, P., Appl. Phys. Letters 58, 1299–1301 (1991).Google Scholar
12. Palmer, J.E., Thompson, C.V., Smith, H.I., J‥ Appl. Phys. 62, 2492 (1987).Google Scholar
13. Atkinson, H.V., Acta Metall. 36, 469–491 (1988).Google Scholar
14. Glazier, J. A. and Weaire, D., J. Physics: Condensed Matter 4, 1867–1894 (1992).Google Scholar
15. Frost, H.J. and Thompson, C.V., J.|Electronic Materials 17, 447–458 (1988)CrossRefGoogle Scholar
16. Frost, H.J., Hayashi, Y., Thompson, C.V., and Walton, D.T., Grain Growth in Thin Films with Variable Grain Boundary Energy, M. R. S. Proceedings Series, this volume, 1993. Google Scholar
17. Johnson, W.A. and Mehl, R.F., Trans AIME 135, 416–458 (1939).Google Scholar
18. Frost, H.J. and Thompson, C.V., Acta Metall. 35, 529–540 (1985).Google Scholar
19. Frost, H.J., Thompson, C.V., and Walton, D.T., Acta Metall.et Mater. 38, 1455–1462 (1990).Google Scholar
20. Mullins, W.W., J. Appl. Phys. 59, 1341–1349, (1986).Google Scholar