A process for forming thin (1-3 μm) stacks of Si/SiO2 or SiO2/Si/SiO2 layers into spherical shells 0.5-3.0 mm in diameter is demonstrated as the baseline for realizing sub-mm3 micro-robots. The fabrication process combines bulk and thin-film micromachining, design of novel masks, and multistage wet and dry etching to release the layers from the substrate. The released layers curl up, self assembling into a spherical shell. The radius of curvature of the released stack is a function of the type, thickness, and residual stresses in the layers. The diameter of the resulting shells is calculated using a mechanical model of the multi-layer stacks. This calculation is compared with measurements of fabricated spheres. The fabrication process is compatible with CMOS circuitry, and future work will focus on realizing spheres with embedded solar cell as a power source and a capacitor for energy storage, which will result in a functional micro-robot.