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Microfabrication of Si/SiO2–Spherical Shells as a Path to Sub-mm3 Autonomous Robotic Systems

Published online by Cambridge University Press:  01 February 2011

Vladimir Vasilyev ,
James R. Reid  and
Richard T. Webster
Vladimir Vasilyev
Affiliation:
[email protected], S4 Inc., Burlington, Massachusetts, United States
James R. Reid
Affiliation:
[email protected], Air Force Research Laboratory, AFRL/RYHA, Hanscom AFB, Massachusetts, United States
Richard T. Webster
Affiliation:
[email protected], Air Force Research Laboratory, AFRL/RYHA, Hanscom AFB, Massachusetts, United States
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Abstract

A process for forming thin (1-3 μm) stacks of Si/SiO2 or SiO2/Si/SiO2 layers into spherical shells 0.5-3.0 mm in diameter is demonstrated as the baseline for realizing sub-mm3 micro-robots. The fabrication process combines bulk and thin-film micromachining, design of novel masks, and multistage wet and dry etching to release the layers from the substrate. The released layers curl up, self assembling into a spherical shell. The radius of curvature of the released stack is a function of the type, thickness, and residual stresses in the layers. The diameter of the resulting shells is calculated using a mechanical model of the multi-layer stacks. This calculation is compared with measurements of fabricated spheres. The fabrication process is compatible with CMOS circuitry, and future work will focus on realizing spheres with embedded solar cell as a power source and a capacitor for energy storage, which will result in a functional micro-robot.

Keywords

microelectro-mechanical (MEMS)stress/strain relationshipthin film
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1139: Symposium GG – Microelectromechanical Systems–Materials and Devices II , 2008 , 1139-GG03-43
Copyright
Copyright © Materials Research Society 2009

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References

REFERENCES

1. Hollar, S., Flynn, A., Bellow, C., and Pister, K., IEEE International Conference on Micro Electro Mechanical Systems, January 2003, pp. 706–711.Google Scholar
2. Reid, J.R., Vasilyev, V., Webster, R.T., Proc. of Nanotech 2008, Boston, MA, June 2008.Google Scholar
3. Tabata, O., Asahi, R., Funabashi, H., Shimaoka, K., and Sugiyama, S., Sensors and Actuators. 34, 51 (1992).Google Scholar
4. Schwartz, B. and Robbins, H., J. Electrochem. Soc. 123, 1903 (1976).Google Scholar
5. Chu, P. B., Chen, J. T., Yeh, R., Lin, G., Huang, J. C. P., Warneke, B. A., and Pister, K. S. J., Digest of the International Conference on Solid-State Sensors and Actuators. 1, 665 (1997).Google Scholar