Hostname: page-component-586b7cd67f-rdxmf Total loading time: 0 Render date: 2024-11-23T18:03:24.691Z Has data issue: false hasContentIssue false
  • English
  • Français

Dicing of Fragile MEMS Structures

Published online by Cambridge University Press:  01 February 2011

Peter Lange ,
Norman Marenco ,
Sven Gruenzig ,
Stephan Warnat  and
Thilo Semperowitsch
Peter Lange
Affiliation:
[email protected], Fraunhofer ISIT, MST, Itzehoe, Germany
Norman Marenco
Affiliation:
[email protected], Fraunhofer ISIT, AVT, Itzhoe, Germany
Sven Gruenzig
Affiliation:
[email protected], Fraunhofer ISIT, ICD, Itzehoe, Germany
Stephan Warnat
Affiliation:
[email protected], Fraunhofer ISIT, AVT, Itzhoe, Germany
Thilo Semperowitsch
Affiliation:
[email protected], Accretech GmbH, Munich, Germany
Get access

Abstract

Stealth dicing appears to be the appropriate methode to singulate surface sensitive microelectromechanical devices, without producing dicing debris or using water jet. The operating mode of the stealth dicing will be explained. A three dimensional integration project with open micromachined structures is taken as a reference to evaluate the advantages and limitations of this new dicing method. The preconditions for successful singulations will be discussed. Optical and SEM inspection results after successful separation will be discussed.

Keywords

microelectro-mechanical (MEMS)packagingmicrostructure
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1139: Symposium GG – Microelectromechanical Systems–Materials and Devices II , 2008 , 1139-GG01-09
Copyright
Copyright © Materials Research Society 2009

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

[1] Marenco, N., Kostner, H., Reinert, W., and Hillmann, G., Smart System Integration, Barcelona (2008), Proceedings, p. 351 Google Scholar
[2] Merz, P., Reinert, W., Reimer, K., Wagner, B., Konferenzband Mikrosystemtechnik-Kongress 2005, D/Freiburg, VDE Verlag, p.467–470 Google Scholar
[3] Kumagai, M., Uchiyama, N., Ohmure, E., Sugiura, R., Atsumi, K., and Fukumitsu, K., IEEE Transaction on Semiconductor Manufactoring, 20 (3), 2007, p.259 Google Scholar
[4] Ohmura, E., Fukuyo, F., Fukumitsu, K., and Morita, H., JAMME, Vol 17 (1–2), 2006, 381 Google Scholar
[5]. Monodane, T., Ohmura, E., Fukuyo, F., Fukumitsu, K., Morita, H., and Hirata, Y., JLMN-Journal of Laser Micro/Nanoengineering, Vol. 1 (3) 2006, 231 Google Scholar
[6] von Allmen, M. F., Coupling of laser radiation to metals and semiconductors, in Bertolotti, M. (Ed), Physical Processes in Laser-Material Interactions, 1983 Plenum Press, New York, page 49Google Scholar
[7] Private communication with H.BerntGoogle Scholar