Membranes with dimensions up to 10 mm x 15 mm have been fabricated in epitaxial 3C-SiC/Si wafers. An array of CTLM metal contacts was deposited onto the upper surface of the n-SiC membrane. Both Al/n-SiC and Pd/n-SiC contacts which were formed on the membrane and on the adjacent substrate have shown an ohmic current/ voltage response. Values of specific contact resistance, ρc, were measured directly on the membranes. These results have shown no consistent difference in ρc of the contacts located either on the membrane or off the membrane. The exposure of SiC surfaces to reactive ion etching in CF4 plasma during the fabrication of a membrane has resulted in ρc which was higher by a factor of 103 than with as-grown and KOH etched silicon surfaces.

The combined application of section and projection topography carried out using synchrotron white beam radiation can be a powerful tool for the determination of the three-dimensional configurations of defects in single crystals. In this paper, we present examples of the application of this combination of techniques to the analysis of defect configurations in PVT-grown 4H-SiC wafers cut perpendicular and parallel to the growth axis. Detailed correlation between section and projection topography of threading screw dislocations (TSDs) is presented with particular emphasis being laid on the determination of the signs of the dislocations. Further, information can also be determined regarding the position of the dislocations within the crystal depth. In addition, similar correlation is presented for threading edge dislocations (TEDs) and basal plane dislocations (BPDs). The section topography images of dislocations can comprise direct, intermediary and dynamical contrast and all three types are observed. The application to the study of stacking faults will be also discussed in detail.

The reliability of the electrical characteristics of SiC “Super” Junction Transistors (SJTs) is investigated under long-term avalanche-mode, DC and pulsed-current operation. There is absolutely no change in the blocking I-V characteristics after a 934 hour repetitive avalanche stress test. Long-term operation of the Gate-Source diode (open-Drain mode) alone does not result in any degradation of the on-state voltage drop (VF) or current gain (β). Long-term operation in common-Source mode results in negligible VF or β degradation, if the base-plate is maintained at 25 °C. A greater degradation of β results with increasing base-plate temperature. The same total electrical charge, if passed through the SJT as a pulsed current instead of a DC current results in a smaller β reduction. It is also shown that this β degradation can be reversed by annealing at ≥ 200 °C, suggesting the possibility of degradation-free operation of SiC SJTs, when operating in pulsed current mode at ≥ 200 °C temperatures.

Homoepitaxial layers were grown with very low surface roughness on 4", 4˚ off-axis substrates, but a new kind of large obtuse angled triangular defect that spanned 1000-2000 μm was observed. Process changes resulted in reduction of the size and concentration of these triangular defects from 3.5cm-2 to 0.13cm-2. Both large and small triangular defects were found to have a similar core structure. No degradation in the epitaxial morphology or quality was seen due to the process change. JBS diodes fabricated on wafers with large triangular defects had much higher leakage when the triangular defects were present in the active area of the diodes.

Investigation of lanthanum cerium oxide as a gate oxide on 4H-SiC was performed by varying post-deposition annealing temperature from 400 to 1000°C. Energy band alignment and band gap of bulk oxide and interfacial layer (IL) with respect to SiC were extracted using X-ray photoelectron microscopy. Two band alignment structures were proposed and the change of band alignment was affected by the changes in chemical composition in bulk oxide and in IL that may induce lattice strains and dipoles. A conduction band offset of IL/SiC was 0.97 eV for sample annealed at 1000°C, which was comparable to the value extracted from Fowler-Nordheim model. The acquisition of sufficient conduction band offset, coupled with the lowest slow trap density, effective oxide charges, interface trap density, as well as total interface trap density, yielded the lowest leakage current density for this sample.

In this paper we present a microfabricated SiC based alternative to glass-fiber optogenetic stimulation. The glass fiber system currently used for stimulation has numerous drawbacks. First, the very presence of glass can evoke an immune response in cortical tissue that can impede the light-to-neuron optical interface. This glial scarring of brain tissue effectively lowers the spatial resolution and power output of the system. Second, the fragility of an implanted glass fiber is a problem that has yet to be fully addressed. Using SiC the proposed optical structure will address these problems by significantly lowering the amount glial scarring and astrocytic activity expressed as a result of the implant. In addition, single crystal SiC allows for a flexible device that can move with the surrounding tissue without fracturing. Finally, the current glass fibers tend be single channel devices with a single ended emitter. The proposed microfabricated device will allow for multiple channels, multiple wavelengths of stimulation, and electrical feedback on each channel improving upon the current standard.

The influence of negative substrate bias on the chemical, electrical and mechanical properties of silicon carbide (SiC) thin films deposited onto (100) silicon substrate by dc magnetron cosputtering without external substrate heating is reported. These studies were performed by using the following techniques: Rutherford backscattering spectroscopy (RBS), profilometry, Raman spectroscopy, four-point probe method and nanoindentation. The results indicate that there is a good correlation between the substrate bias voltage and the argon incorporation into SiC film, namely, the SiC films deposited under substrate bias of –200 V and –300 V have higher argon content and higher elastic modulus and hardness than those deposited at 0 V. An opposite behavior was found for electrical resistivity: the SiC deposited at –300 V has resistivity of 0.45 Ω.cm whereas the deposited at 0 V has 7.0 Ω.cm.

In this study, we present a small-size implantable RF antenna (biosensor) which is made of fully biocompatible material, cubic silicon carbide. Silicon Carbide is one of the few semiconducting materials that combine biocompatibility and sensing potentiality. The hypothesis of a SiC based antenna, to be used for glucose monitoring, is that the changes in the medium surrounding the antenna affect the antenna properties such as input impedance and resonance frequency, and these changes can be used to estimate the patient’s plasma glucose level. An all-SiC patch antenna has been designed, simulated and fabricated with a target frequency of operation of 10 GHz. A Cu patch antenna was fabricated on SiC to serve as a reference antenna. The all-SiC antenna was realized by growing a poly-crystalline 3C-SiC film using CVD on a thick oxide layer that had been coated with poly-Si to serve as a growth template. A semi-insulating 4H-SiC substrate was used to minimize RF losses during operation.

3C-SiC is very attractive due the chance to be grown on large-area, low-cost Si substrates. Moreover, 3C-SiC has higher channel electron mobility with respect to 4H-SiC, interesting property in MOSFET applications. Other application fields where 3C-SiC can play a significant role are solar cells and MEMS-based sensors. In this work, we present a general overview of 3C-SiC growth on Si substrate. The influence of growth parameters, such as the growth rate, on the crystal quality of 3C-SiC films is discussed. The main issue for 3C-SiC development is the reduction of the stacking fault density, which shows an exponential decreasing trend with the film thickness tending to a saturation value of about 1000 cm-1. Some aspect of processing will be also faced with the realization of cantilever for Young modulus calculations and the implantation of Al ions for the study of damaging and recovery of the 3C-SiC crystal.

Growth stresses in amorphous SiO2 scales formed during SiC fiber oxidation were calculated. A numerical method using Deal-Grove oxidation kinetics and shear-stress dependent SiO2 viscosity was used. Initial compressive stresses in SiO2 of ∼25 GPa from the 2.2× oxidation volume expansion rapidly relaxes. At >1200°C, viscous flow of amorphous SiO2 further relaxes stress to negligible levels. At 700° - 900°C, axial and hoop stress at the GPa level persist in SiO2 near the SiC-SiO2 interface. Radial expansion of the scale causes hoop stress to become tensile, and axial stresses are driven to tensile values by the Poisson effect. These tensile stresses can be >1 GPa for thick scales formed at lower temperatures on surfaces with high curvature. Approximate analytical expressions for growth stress are discussed. Effects of viscosity variation as well as other assumptions and limitations of the calculation method are discussed.

Homoepitaxial growth on 4H-SiC Si-face substrates with sizes corresponding to 150 mm was carried out. The influence of growth conditions for uniformity and epitaxial defect density was investigated. A 150 mm size was realized by using two 76.2 mm wafers lined up in a radial direction. C/Si ratio is found to be a major parameter for controlling triangular defect density and the generation of step bunching. As a result, the surface morphology without bunched step structure and the triangular defect density with 0.5 cm−2 were obtained by decreasing C/Si ratio to 1.0 on the size corresponding to 150 mm. Under this condition, good carrier concentration and thickness uniformity of σ/mean =15.2 % and 1.7 % could be obtained.

Since a few years, VLS transport is studied not only for homoepitaxial SiC growth but also for SiC selective epitaxial growth (SEG). In this approach, a stacking of silicon and aluminum layers is deposited on the substrate and patterns are created by photolithography. Upon melting, the Al-Si liquid droplets are fed by propane to obtain the SEG of p-doped SiC. In this work, the growth mechanisms were deeper investigated, in particular the influence of the carrier gas (H2 or Ar) and the growth temperature. SEG experiments showed higher growth rates than those measured in the standard configuration (nonselective growth). Moreover, the SiC layers exhibited step-bunched areas characteristic of liquid phase growth but also areas with morphological features due to a disruption of the step-bunching growth mode.

This paper presents Thermal Laser Separation (TLS) as a novel dicing technology for silicon carbide (SiC) wafers. Results of this work will play an important role in improving the SiC dicing process regarding throughput and edge quality. TLS process parameters were developed for separating 4H-SiC wafers. Separated SiC dies were analyzed and compared with results produced with current state of the art blade dicing technology. For the first time, fully processed 100 mm 4H-SiC wafers with a thickness of 450 μm, including epi-layer and back side metal layers, could be separated with feed rates up to 200 mm/s. Besides the vastly improved dicing speed, the TLS separation process results in two important features of the separated SiC devices: First, edges are free of chipping and therefore of higher quality than the edges produced by blade dicing. Second, the TLS process is kerf free, which allows for reducing the necessary dicing street width and hence increasing the number of devices per wafer.

The silicon carbide thin film formation process, completely performed at room temperature, was developed by argon plasma and a chemical vapor deposition using monomethylsilane gas. Time-of-flight secondary ion mass spectrometry showed that siliconcarbon bonds existed in the obtained film, the surface of which could remain specular after the exposure to hydrogen chloride gas at 800 °C. The silicon dangling bonds formed at the silicon surface by the argon plasma are considered to easily accept the monomethylsilane molecules at room temperature to produce the amorphous silicon carbide film.

Amorphous silicon carbide (a-SiC) thin films have been grown on aluminum nitride (AlN) intermediate layers on (100) Si substrates by RF magnetron sputtering technique. Profilometry, four-point probe method, Rutherford backscattering spectroscopy (RBS) and Fourier transform infrared (FTIR) were employed to characterize the as-deposited SiC thin films. Test structures have been developed to investigate the piezoresistive properties. These structures consist of SiC thin-film resistors on AlN/Si substrates defined by reactive ion etching (RIE) with Ti/Au pads formed by lift-off process. Gauge factor (GF) and temperature coefficient of resistance (TCR) measurements have been performed and demonstrated the potential of these resistors to be used as sensing elements in devices for high temperature application.

Conversion of basal plane dislocations (BPDs) to threading edge dislocations (TEDs) has been observed in 4H-SiC epilayers by simple high temperature annealing. Grazing incidence reflection synchrotron X-ray topography was used to image the dislocations in the epilayers. By comparing the X-ray topographs before and after annealing, some of the BPDs were confirmed to convert to TEDs from the epilayer surface. The dislocation behaviors during annealing are explained and the mechanism of BPD conversion is discussed. It is argued that the conversion process is realized by constricted BPD segments cross-slipping to the prismatic plane driven by the image force and TED glide on its slip plane driven by the line tension. Certain kinetic processes may assist the formation of constrictions on the BPDs.

In this work we describe the characterization of anti-myoglobin immobilization on 3C-SiC (100) by means of surface modification with 3-aminopropyltriethoxysilane (APTES). Surface water contact angle measurements were used to compare the wettability of 3C-SiC (100) before (16 ±3°) and after APTES layer formation (61 ±1°). Atomic force microscopy (AFM) was used to confirm the homogenous formation of APTES and anti-myoglobin immobilization with EDC-sulfo NHS coupling. For the APTES surfaces no significant change in the surface roughness was obtained whereas with anti-myoglobin surfaces, particles on the order of ∼60 nm in diameter with a globular shape were observed.

Commercially available bulk silicon carbide (SiC) has a high number (>2000/cm2) of screw dislocations (SD) that have been linked to degradation of high-field power device electrical performance properties. Researchers at the NASA Glenn Research Center have proposed a method to mass-produce significantly higher quality bulk SiC. In order for this bulk growth method to become reality, growth of long single crystal SiC fibers must first be achieved. Therefore, a new growth method, Solvent-Laser Heated Floating Zone (Solvent-LHFZ), has been implemented. While some of the initial Solvent-LHFZ results have recently been reported, this paper focuses on further characterization of grown crystals and their growth fronts. To this end, secondary ion mass spectroscopy (SIMS) depth profiles, cross section analysis by focused ion beam (FIB) milling and mechanical polishing, and orientation and structural characterization by X-ray transmission Laue diffraction patterns and X-ray topography were used. Results paint a picture of a chaotic growth front, with Fe incorporation dependant on C concentration.

Synchrotron topography studies are presented of the behavior of growth dislocations and deformation-induced dislocations in 4H-SiC single crystals. The growth dislocations include those in threading orientation with line directions approximately along c with Burgers vectors of a, c, and na+mc (where n and m are integers) while the deformation-induced dislocations include those with line directions confined to the basal plane with Burgers vectors of a and Shockley partial dislocations with Burgers vectors of 1/3<1-100> as well as those with line directions in the {1-100} prismatic planes with Burgers vectors of a. Processes leading to the nucleation of the growth dislocations are discussed as well as their deflection onto the basal plane during crystal growth in a reversible process. This latter process can lead to the conversion of segments of the deflected growth dislocations into deformation induced dislocations. In some cases this can lead to dislocation multiplication via the Hopping Frank-Read source mechanism and in others to the motion of single Shockley partial dislocations leading to Shockley stacking fault expansion. Studies are also presented of interactions between threading growth dislocations with c-component of Burger’s vector facilitated by climb processes which are mediated by interactions with non-equilibrium concentrations of vacancies. This can lead to reactions whereby complete or partial dislocation Burgers vector annihilation occurs.

Synchrotron X-ray topography (SXRT) of various geometries has been successfully utilized to image c+a dislocations in 4H-SiC crystals. Although molten potassium hydroxide(KOH) can be used to reveal the location of such dislocations, it is not possible to determine their senses or their Burgers vector magnitude. A simple, non-destructive method has been proposed to determine the Burgers vector of these c+a dislocations called the ray tracing simulation, which has been successfully implemented previously in revealing the dislocation sense and magnitude of micropipes, closed-core threading screw dislocations (TSDs) and threading edge dislocations (TEDs) in 4H-SiC. In this paper, grazing incidence topography is performed using the monochromatic beam for the horizontally cut wafers to record pyramidal reflections of 11-28 type. Ray tracing simulation has been successfully implemented to correlate the simulated images with experimental images which are discussed in the paper.