Intensive research is currently underway to exploit the highly interesting properties of nano-bits (“nano-sized particles and molecules”) for optical, electronic and other applications. The basis of these unique properties is the small-size of these structures which result in quantum mechanical phenomena and interesting surface properties. The small molecules and/or nano-particles are selected in such a way so that it can create an internal electric in the nano-composite. We define a nanocomposite is an admixture of small molecules and/or nano-particles and a polymer. We have demonstrated the internal electric field in our devices, made from nano-bits (nano-particles and/or molecules) and insulating materials, can contribute to the electrical bistability i.e. two conductive states.

Silicon Nitride based charge trap devices have been studied since the 1980s for applications in non-volatile memories. Silicon-Oxide-Nitride-Oxide-Silicon (SONOS) stack as the non-volatile memory gate stack has been the focus since the 1990s. Several enhancements in SONOS layer materials have been invented to reduce the programming voltage and improve the reliability of the SONOS memory. SONOS memories are a widely used class of non-volatile memories today. This paper will review the history of SONOS and highlight the various innovations that have enhanced SONOS memory performance, reliability and low cost of manufacture. Topics covered include various improvements in the SONOS stack such as Band gap engineering, High K–Metal Gate for SONOS, 3D SONOS, SONOS FinFETs (Field Effect Transistor) and embedded SONOS.

In this work the electrical performance of a radiation hard designed 1T-1R resistive random access memory (RRAM) device is investigated in DC (voltage sweep) and AC (pulsed voltage) modes. This new device is based on the combination of an Enclosed Layout Transistor (ELT) used as selector device and a TiN/ HfO2/ Ti/TiN RRAM stack used as resistive device. The high cell to cell variability in the DC mode makes it difficult to define an electrical gap between the High Resistive State (HRS) and the Low Resistive State (LRS). The strong reduction of the variability by the use of Incremental Step Pulse with Verify Algorithm (ISPVA) makes the later a mandatory programming approach. The Quantum Point Contact (QPC) model defines an energy barrier located in the rupture point of the filament in HRS. The compensation between the width and height variations of this barrier during cycling could explain the stability of HRS and LRS. The good performance of the proposed device using the ISPVA programming approach makes it a good candidate for Rad-Hard Non Volatile Memories integration.

Practical use of Resistive Random Access Memory (ReRAM) depends on thorough understanding of the resistive switching (RS) mechanism in polycrystalline metal oxide films. Based on experimental and theoretical results of NiO based ReRAM, we have proposed a grain surface tiling model, in which grain surfaces (i.e. grain boundaries) are composed by insulating and conductive micro surface structures. This paper reports the adequacy of our model to the NiO based ReRAM and universality of surface electronic properties in metal oxides of NiO, CoO and MgO. Experimental results of RS operating modes suggest that the resistance changes in the grain boundaries, supporting our model. First-principles calculation results suggest that our model can be adopted to other metal oxide materials and the RS from a low resistance to a high resistance can be caused at 1000 K, which agrees with previous experimental reports.

Metal Organic Decomposition (MOD)-made BaTiO3 (BT) thin films were prepared for Resistive Random Access Memory (ReRAM) under various annealing conditions and investigated for improving the properties of bipolar-type resistive switching, focusing on the relation between oxygen vacancies and the behavior of resistive hysteresis. BT thin films with both pre- and final- annealing in nitrogen showed the resistive hysteresis of bipolar-type switching with current ON/OFF ratios of 2 orders of magnitude for both bias polarities. Finally they showed the endurance property with the 106 switching cycles. It was suggested that oxygen vacancies near the oxide surface (both interfaces at metal electrode/oxide and between layer-by-layered oxide layers) are increased by N2 annealing and enhanced the interface-type resistive switching. Pre-annealing in N2 was also found to be very effective to improve endurance properties, implying that not only the electrode/oxide interface but also the middle part of the film would contribute the interface-type mechanism.

Ferromagnetic/Ferroelectric/Ferromagnetic (Ni/PZT/Ni) tri-layer artificial multiferroelectric structures in spin capacitor configuration were fabricated by sputtering ferromagnetic electrodes on PZT. Magnetocapacitance, magnetoimpedance, and phase angle measurements were carried out by a wide range of frequencies and magnetic fields at room temperature. We also compared the magnetodielectric measurements with Ni/PZT/Ag and Ag/PZT/Ag tri-layers structures. Ni/PZT/Ni spin capacitor shows a significantly different behavior compared to conventional PZT capacitor with Ag electrode and mixed electrode capacitor with one ferromagnetic and one conventional electrode.

We investigate the feasibility of inert ion beam etch (IBE) for subtractive patterning of ReRAM-type structures. We report on the role of the angle-dependent ion beam etch rates in device area control and the minimization of sidewall re-deposition. The etch rates of key ReRAM materials are presented versus incidence angle and ion beam energy. As the ion beam voltage is increased, we demonstrate a significant enhancement in the relative etch rate at glancing incidence (for example, by a factor of 2 for HfO2). Since the feature sidewall is typically exposed to glancing incidence, this energy-dependence plays a role in optimization of the feature shape and in sidewall re-deposition removal.

We present results of SRIM simulations to estimate depth of ion-bombardment damage to the TMO sidewall. Damage is minimized by minimizing ion energy; its depth can be reduced by roughly a factor of 5 over typical IBE energy ranges. For example, ion energies of less than ∼250 eV are indicated to maintain damage below ∼1nm. Multi-angle and multi-energy etch schemes are proposed to maximize sidewall angle and minimize damage, while eliminating re-deposition across the TMO. We utilize 2-D geometry/3-D etch model to simulate IBE patterning of tight-pitched ReRAM features, and generate etched feature shapes.

Multiferroic materials are of great interest from the scientific and technological viewpoints based on their multifunctional behavior involving ferroelectricity, ferromagnetism, ferroelasticity and strong electromagnetic coupling properties. Among these materials, BiFeO3 (BFO), is a well-known multiferroic with simultaneous ferroelectricity (TC=1103K) and G-type antiferromagnetism (TN=643K). In this work, we doped BiFeO3 with Mn species and studied the doping effect on the corresponding magnetic properties, expected from the substitution of Bi3+ by Mn2+. Additionally, the optimum processing conditions to minimize the formation of any impurity phase were also identified. X-Ray Diffraction (XRD) characterization confirmed the formation of powdered impurity-free BFO in pure and 7 at.% Mn-BFO only after annealing of the precursor compounds at suitable temperatures and time (700°C, 15 minutes). Scanning Electron Microscopy (SEM) analyses were used to determine the size and morphology of synthetized powders. Vibrating sample magnetometry (VSM) measurements showed that maximum magnetization values increased with doping and reached a maximum value in the 7 at.% Mn-doped BFO annealed at 700°C for 15min; the corresponding magnetization in the non-saturated MH loops reached 0.68 emu/g. This behavior can be attributed to the actual incorporation of Mn species into the BFO lattice and the substitution of non-magnetic Bi species.

We proposed an MgO barrier which is fabricated by combination of rf-sputter deposition of MgO film and subsequent in-situ post oxidation (PO). We found that the perpendicular magnetic anisotropy (PMA) of the CoFeB layer formed on this MgO barrier with PO was improved. We also found that a short error rate reduced drastically and a magnetoresistance (MR) ratio increased about 20% for the magnetic tunnel junction (MTJ) with this MgO barrier with PO. In addition, we showed that this MgO barrier with PO has long endurance life compared with conventional sputtered MgO barriers, and has a potential to operate over 1016 write cycles.

Furthermore, we have observed that the PO could suppress the Fe diffusion into the MgO barrier and form Fe-O bonding at MgO/CoFeB interface using electron energy-loss spectroscopy (EELS). The obtained results might be involved to the improvement of PMA and MTJ characteristics.