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Effects of Interstitial Additions on the Structure of Ti5Si3
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- 31 January 2011, pp. 1773-1779
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Thermal Expansion of Ti5Si3 with Ge, B, C, N, or O Additions
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- Published online by Cambridge University Press:
- 31 January 2011, pp. 1780-1785
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A Study of Microindentation Hardness Tests by Mechanism-based Strain Gradient Plasticity
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- 31 January 2011, pp. 1786-1796
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The Effects of the Mechanical Properties of the Confinement Material on Electromigration in Metallic Interconnects
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- 31 January 2011, pp. 1797-1802
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Effect of the Pretreatment Step Condition in the Growth Process of the Si Melt Method on the Size of β–Si3N4 Single Crystals
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- 31 January 2011, pp. 1803-1810
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Structural and Electronic Properties of (CdTe)1−x(In2Te3)x Films Grown by Close-spaced vapor Transport Combined with Free Evaporation
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- 31 January 2011, pp. 1811-1815
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Processing and Characterization of High-conductance Bismuth Wire Array Composites
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- 31 January 2011, pp. 1816-1821
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Preparation of Carbon Nanotubes from CO and in situ Formed Nano-sized Pd Particles
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- 31 January 2011, pp. 1822-1827
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Metalorganic Chemical Vapor Deposition of Nickel Films from Ni(C5H5)2/H2
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- 31 January 2011, pp. 1828-1833
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Effect of Processing Temperature on the Morphology of Hydrothermally Derived Barium Titanate/polymer Thin Films
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- 31 January 2011, pp. 1834-1841
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Facile Sol-gel Synthesis of Porous Silicas Using Poly(propylene)imine Dendrimers as Templates
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- 31 January 2011, pp. 1842-1848
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