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High Performance Silicone Gel as IC Device Chip Protection
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- 21 February 2011, 175
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Chemistry of Adhesion at the Polyimide-Metal Interface
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- 21 February 2011, 189
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Characteristics of Polyethylene Thin Films Deposited by Ionized Cluster Beam
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- 21 February 2011, 201
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Etching and Surface Modification of Polymers in CF4/O2 Plasma Discharges
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- 21 February 2011, 207
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The Cracking and Decohesion of Thin Films
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- 21 February 2011, 213
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Polymer Encapsulated Microelectronics: Mechanisms of Protection and Failure
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- 21 February 2011, 219
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Chromium-Polyimide Interface Chemistry
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- 21 February 2011, 225
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XPS Studies of Chromium Atoms Interacting with a PMDA-ODA Polyimide Surface
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- 21 February 2011, 233
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The Promotion of Metal/Polymer Adhesion by Ion Beam Enhanced Deposition
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- 21 February 2011, 241
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Hydrogen Diffusion Between Plasma-Deposited Silicon Nitridepolyimide Polymer Interfaces
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- 21 February 2011, 247
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Materials and Processes At the Leading Edge of Photolithography
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- 21 February 2011, 257
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Spin-On Glass Films in Multilevel Ic Interconnection
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- 21 February 2011, 275
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Materials Interactions in the Firing of Copper Thick Film Multilayer Ceramics
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- 21 February 2011, 287
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Materials and Processes for High Functionality Hybrid Circuit Packages
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- 21 February 2011, 301
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Materials and Structures for High Density I/O Interconnection Systems
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- 21 February 2011, 309
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A Study of Threshold and Incubation Behaviourduring Electromigration in thin Film Metallisation
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- 21 February 2011, 319
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Asymmetries in the Formation of Electromigration Damage Around Divergence Dipoles in a Metallization Track
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- 21 February 2011, 327
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AEM Study of thin and Thick Film Metallization on AIN Substrates
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- 21 February 2011, 331
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Aluminum Nitride fibers from a Thermoplastic Organoaluminum Precursor
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- 21 February 2011, 337
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Mechanical Interconnects to Silicon Integrated Circuits
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- 21 February 2011, 347
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