Book contents
- Electromigration in Metals
- Electromigration in Metals
- Copyright page
- Dedication
- Contents
- Preface
- 1 Introduction to Electromigration
- 2 Fundamentals of Electromigration
- 3 Thermal Stress Characteristics and Stress-Induced Void Formation in Aluminum and Copper Interconnects
- 4 Stress Evolution and Damage Formation in Confined Metal Lines under Electric Stressing
- 5 Electromigration in Cu Interconnect Structures
- 6 Scaling Effects on Microstructure of Cu and Co Nanointerconnects
- 7 Analysis of Electromigration-Induced Stress Evolution and Voiding in Cu Damascene Lines with Microstructure
- 8 Massive-Scale Statistical Studies for Electromigration
- 9 Assessment of Electromigration Damage in Large On-Chip Power Grids
- Index
Preface
Published online by Cambridge University Press: 05 May 2022
Book contents
- Electromigration in Metals
- Electromigration in Metals
- Copyright page
- Dedication
- Contents
- Preface
- 1 Introduction to Electromigration
- 2 Fundamentals of Electromigration
- 3 Thermal Stress Characteristics and Stress-Induced Void Formation in Aluminum and Copper Interconnects
- 4 Stress Evolution and Damage Formation in Confined Metal Lines under Electric Stressing
- 5 Electromigration in Cu Interconnect Structures
- 6 Scaling Effects on Microstructure of Cu and Co Nanointerconnects
- 7 Analysis of Electromigration-Induced Stress Evolution and Voiding in Cu Damascene Lines with Microstructure
- 8 Massive-Scale Statistical Studies for Electromigration
- 9 Assessment of Electromigration Damage in Large On-Chip Power Grids
- Index
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- Electromigration in MetalsFundamentals to Nano-Interconnects, pp. xi - xivPublisher: Cambridge University PressPrint publication year: 2022