With the availability of resolution boosting and delocalization
minimizing techniques, for example, spherical aberration correction and
exit-plane wave function reconstruction, high-resolution transmission
electron microscopy is drawing to a breakthrough with respect to the
atomic-scale imaging of common semiconductor materials. In the present
study, we apply a combination of these two state-of-the-art techniques
to investigate lattice defects in GaAs-based heterostructures at atomic
resolution. Focusing on the direct imaging of stacking faults as well
as the core structure of edge and partial dislocations, the practical
capabilities of both techniques are illustrated. For the first time, we
apply the technique of bright-atom contrast imaging at negative
spherical aberration together with an appropriate overfocus setting for
the investigation of lattice defects in a semiconductor material. For
these purposes, the elastic displacements associated with lattice
defects in GaAs viewed along the [110] zone axis
are measured from experimental images using reciprocal space strain map
algorithms. Moreover, we demonstrate the benefits of the retrieval of the
exit-plane wave function not only for the elimination of residual
imaging artefacts but also for the proper on-line alignment of
specimens during operation of the electron microscope—a basic
prerequisite to obtain a fair agreement between simulated images and
experimental micrographs.