Hostname: page-component-586b7cd67f-vdxz6 Total loading time: 0 Render date: 2024-11-27T03:50:50.103Z Has data issue: false hasContentIssue false
  • English
  • Français

Improvement of X-ray stress measurement from a Debye–Scherrer ring by oscillation of the X-ray incident angle

Published online by Cambridge University Press:  12 August 2015

Toshiyuki Miyazaki ,
Yoichi Maruyama ,
Yohei Fujimoto  and
Toshihiko Sasaki
Toshiyuki Miyazaki*
Affiliation:
Kanazawa Universiyt, Kanazawa city, 920-1165, Japan
Yoichi Maruyama
Affiliation:
Kanazawa Universiyt, Kanazawa city, 920-1165, Japan
Yohei Fujimoto
Affiliation:
Kanazawa Universiyt, Kanazawa city, 920-1165, Japan
Toshihiko Sasaki
Affiliation:
Kanazawa Universiyt, Kanazawa city, 920-1165, Japan
*
a) Author to whom correspondence should be addressed. Electronic mail: [email protected]
Get access Rights & Permissions [Opens in a new window]

Abstract

A technique to improve the stress measurement from a Debye–Scherrer ring (D–S ring) is reported. In a previous work, the authors reported a technique to calculate stress from the Fourier series of the normal strain of a D–S ring. That technique, similar to the cosα method that came before it, is inaccurate when the grain size of the specimen is relatively large. To cope with this problem, the authors propose using the oscillation of the X-ray incident angle. The present study demonstrates this technique to improve the stress measurement.

Keywords

X-ray stress measurementDebye–Scherrer ringFourier seriesX-ray incident angle oscillation
Type
Technical Articles
Information
Powder Diffraction , Volume 30 , Issue 3 , September 2015 , pp. 250 - 255
Check for updates
Copyright
Copyright © International Centre for Diffraction Data 2015 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

Lode, W. and Peiter, A. (1981). “X-ray-measurable deformations in superficial layers and their representations,” Materialpruefung 23, 227–230.Google Scholar
Maruyama, Y. Ph.D thesis, Kanazawa University (In progress, 2015).Google Scholar
Miyazaki, T. and Sasaki, T. (2014). “X-ray stress measurement with two-dimensional detector based on Fourier analysis,” Int. J. Mater. Res. 105, 922–927.Google Scholar
Miyazaki, T. and Sasaki, T. (2015). “X-ray stress measurement from an imperfect Debye–Scherrer ring,” Int. J. Mater. Res. 106, 3:237–241.Google Scholar
Noyan, I. C. and Cohen, J. B. (1987). Residual Stress (Springer-Verlag, New York).Google Scholar
Sasaki, T., Hirose, Y., and Yasukawa, S. (1997). “X-ray stress measurement of coarse-grained polycrystalline materials by imaging plate method,” Trans. Jpn. Soc. Mech. Eng. Part A. 63, 533–541.Google Scholar
Taira, S., Tanaka, K., and Yamasaki, T. (1978). “A method of x-ray microbeam measurement of local stress and its application to fatigue crack growth problem,” J. Soc. Mat. Sci, Japan. 27, 251–256.Google Scholar
Welzel, U., Ligot, J., Lamparter, P., Vermeulen, A. C., and Mittermeijer, E. J. (2005). “Stress analysis of polycrystalline thin films and surface regions by X-ray diffraction,” J. Appl. Crystallogr. 38, 1–29.Google Scholar