This paper presents a systematic investigation of AlN nanowire synthesis by chemical vapor deposition using Al and NH3 on SiO2/Si substrate and direct nitridation of mixture of Al-Al2O3 by NH3. A wide variety of catalyst materials, in both discrete nanoparticle and thin film forms, have been used (Co, Au, Ni, and Fe). The growth runs have been carried out at temperatures between 800 and 1100oC mainly under H2 as carrier gas. It was found that the most efficient catalyst in terms of nanowire formation yield was 20-nm Ni film. The AlN nanowire diameters are about 20-30 nm, about the same thickness as the Ni-film. Further studies of direct nitridation of mixture of Al-Al2O3 by NH3 have resulted in high density one-dimensional nanostructure networks at 1100oC. It was observed that catalyst-free nanostructures resulted from the direct nitridation were significantly longer than that with catalysts. The analysis of the grown nanowires has been carried out by scanning electron microscopy, transmission electron microscopy, atomic force microscopy, and x-ray diffraction.

Many reported CuIn1-xGaxSe2 (CIGS) thin films for high-efficiency solar cells have been prepared via a two-stage process that consists of a high-vacuum film deposition step followed by selenization with excess H2Se gas or Se vapor. Removing toxic gas and high-vacuum requirements from this process would greatly simplify it and make it less hazardous. We report the formation of CuIn1-xGaxSe2 (x = 0, 0.25, 0.50, 0.75, 1.0) thin films achieved by rapid thermal annealing of spray-deposited CuIn1-xGaxS2 and Se in the absence of an additional selenium source. To prepare the Se layer, commercial Se powder was dissolved by refluxing in ethylenediamine/2,2-dimethylimidizolidine. After cooling to room temperature, this mixture was combined with 2-propanol and the resulting colloidal Se suspension was sprayed by airbrush onto a heated glass substrate. The resulting film was coated with nanocrystalline CuIn1-xGaxS2 via spray deposition of a toluene-based “nanoink” suspension. The two-layer sample was annealed at 550 oC in an argon atmosphere for 60 minutes to form the final CIGS product. Scanning electron microscopy images reveal that film grains are 200-300 nm in diameter and comparable to sizes of the reactant CuIn1-xGaxS2 nanoparticles. XRD patterns are consistent with the chalcopyrite unit cell and calculated lattice parameters and A1 phonon frequencies change nearly linearly between those for CuInSe2 and CuGaSe2.

A channel layer substitution of a wider bandgap AlGaN for a conventional GaN in high electron mobility transistors (HEMTs) is an effective method of enhancing the breakdown voltage. Wider bandgap AlGaN, however, should also increase the ohmic contact resistance. Si ion implantation doping technique was utilized to achieve sufficiently low resistive source/drain contacts. The fabricated AlGaN channel HEMTs with the field plate structure demonstrated good pinch-off operation with sufficiently high drain current density of 0.5 A/mm without noticeable current collapse. The obtained maximum breakdown voltages was 1700 V in the AlGaN channel HEMT with the gate-drain distance of 10 μm. These remarkable results indicate that AlGaN channel HEMTs could become future strong candidates for not only high-frequency devices such as low noise amplifiers but also high-power devices such as switching applications.

Indium containing III-Nitride layers are predominantly grown by heteroepitaxy on foreign substrates, most often Al2O3, SiC and Si. We have investigated the epitaxial growth of InxGa1-xN (InGaN) alloys on Ge substrates. First we looked at the influence of buffer layers between the InGaN and Ge substrate. When applying a high temperature (850 °C) GaN buffer, the InGaN showed superior crystal quality. Furthermore the influence of growth parameters on the structural quality and composition of InGaN layers has been looked into. For a fixed gallium and nitrogen supply, the indium beam flux was increased incrementally. For both nitrogen- as well as for metal (Ga + In) rich growth conditions, the In incorporation increases for increasing In flux. However, for metal rich growth conditions, segregation of metallic In is observed. An optimum in crystal quality is obtained for a metal:nitrogen flux ratio close to unity. The XRD FWHM of the GaN (0002) reflection increases significantly after InGaN growth. Apparently the presence of indium deteriorates the GaN buffer during InGaN growth. The mechanism of the effect is not known yet.