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Surface Roughness of Silicon-Nitride Gate Insulators Deposited in a 40-MHZ Glow Discharge

Published online by Cambridge University Press:  10 February 2011

H. Meiling
Affiliation:
Debye Institute, trecht University, P.O. Box 80.000, NL-3508 TA Utrecht, The Netherlands.
E. Ten Grotenhuis
Affiliation:
Debye Institute, trecht University, P.O. Box 80.000, NL-3508 TA Utrecht, The Netherlands.
W. F. van der Weg
Affiliation:
Debye Institute, trecht University, P.O. Box 80.000, NL-3508 TA Utrecht, The Netherlands.
J. J. Hautala
Affiliation:
Tokyo Electron America, Inc., 123 Brimbal Avenue, Beverly MA 01915, USA.
J. F. M. Westendorp
Affiliation:
Tokyo Electron America, Inc., 123 Brimbal Avenue, Beverly MA 01915, USA.
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Abstract

The surface morphology of 40-MHz PECVD SiNx films is investigated. We report on the correlation between the deposition conditions, bulk properties, and surface roughness of these TFT insulators. The roughness is measured with atomic-force microscopy, AFM. A link will be presented between the AFM properties and the effects of hydrogen dilution during deposition: gas composition and rf-power-density (P) dependences will be discussed. An increase of the surface roughness to 3.7 nm is observed upon H2 dilution and P increase, ascribed to enhanced ion bombardment of the surface during growth.

Type
Research Article
Copyright
Copyright © Materials Research Society 1997

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References

[1] Claassen, W. A. P., Valkenburg, W. G. J. N., Willemsen, M. F. C., and Wijgert, W. M. v. d., J. Electrochem. Soc. 132 (4), 893 (1985).Google Scholar
[2] Smith, D. L., Alimonda, A. S., Chen, C. C., Ready, S. E., and Wacker, B., J. Electrochem. Soc. 137 (2), 614 (1990).Google Scholar
[3] Smith, D. L., J. Vac. Sci. Technol. A 11 (4), 1843 (1993).Google Scholar
[4] Cotler, T. J. and Chapple-Sokol, J., J. Electrochem. Soc. 140 (7), 2071 (1993).Google Scholar
[5] Parsons, G. N., Souk, J. H., and Batey, J., J. Appl. Phys. 70 (3), 1553 (1991).Google Scholar
[6] Loboda, M. J. and Seifferly, J. A., J. Mater. Res. 11 (2), 391 (1996).Google Scholar
[7] Kuo, Y., J. Electrochem. Soc. 142 (7), 2486 (1995).Google Scholar
[8] Habraken, F. H. P. M. and Kuiper, A. E. T., Mat. Sci. Engineer. R 12 (3), 123 (1994).Google Scholar
[9] Shirai, H., Jpn. J. Appl. Phys. 34 (2A), 450 (1995).Google Scholar
[10] Abelson, J. R., Appl. Phys. A 56, 493 (1993).Google Scholar
[11] Uchida, H., Takechi, K., Nishida, S., and Kaneko, S., Jpn. J. Appl. Phys. 30 (12B), 3691 (1991).Google Scholar
[12] Meiling, H., Westendorp, J. F. M., Hautala, J. J., Saleh, Z. M., and Malone, C. T., in Flat Panel Display Materials, edited by Batey, J., Chiang, A., and Holloway, P. H. (Mater. Res. Soc. Proc. 345, Pittsburgh, PA, 1994), p. 65.Google Scholar
[13] Westendorp, J. F. M., Meiling, H., Pollock, J. D., Berrian, D. W., Laflamme, A. H. Jr, Hautala, J. J., and Vanderpot, J., in Flat Panel Display Materials, edited by Batey, J., Chiang, A., and Holloway, P. H. (Mater. Res. Soc. Proc. 345, Pittsburgh, PA, 1994), p. 175.Google Scholar
[14] Sherman, S., Lu, P.-Y., Gottscho, R. A., and Wagner, S., in Amorphous Silicon Technology - 1995, edited by Hack, M., Schiff, E. A., Madan, A., Powell, M., and Matsuda, A. (Mater. Res. Soc. Proc. 377, Pittsburgh, PA, 1995), p. 749.Google Scholar
[15] Lanford, W. A. and Rand, M. J., J. Appl. Phys. 49 (4), 2473 (1978).Google Scholar
[16] Campmany, J., Bertran, E., Andújar, J. L., Canillas, A., López-Villegas, J. M., and Morante, J. R., in Amorphous Silicon Technology - 1992, edited by Thompson, M. J., Hamakawa, Y., LeComber, P. G., Madan, A., and Schiff, E. A. (Mater. Res. Soc. Proc. 258, Pittsburgh, PA, 1992), p. 643.Google Scholar
[17] Kobayashi, I., Ogawa, T., and Hotta, S., Jpn. J. Appl. Phys. 31, 336 (1992).Google Scholar