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Structure and Property Characterization of Porous Low-k Dielectric Constant Thin Films using X-ray Reflectivity and Small Angle Neutron Scattering

Published online by Cambridge University Press:  17 March 2011

Eric K. Lin ,
Wen-li Wu ,
Changming Jin  and
Jeffrey T. Wetzel
Eric K. Lin
Affiliation:
Polymers Division, Materials Science and Engineering Laboratory, National Institute of Standards and Technology 100 Bureau Drive, Stop 8541, Gaithersburg, MD 20899-8541, USA
Wen-li Wu
Affiliation:
Polymers Division, Materials Science and Engineering Laboratory, National Institute of Standards and Technology 100 Bureau Drive, Stop 8541, Gaithersburg, MD 20899-8541, USA
Changming Jin
Affiliation:
SEMATECH 2706 Montopolis Drive, Austin, TX 78741-6499, USA
Jeffrey T. Wetzel
Affiliation:
SEMATECH 2706 Montopolis Drive, Austin, TX 78741-6499, USA
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Abstract

High-resolution X-ray reflectivity and small angle neutron scattering measurements are used as complementary techniques to characterize the structure and properties of porous thin films for use as low-k interlevel dielectric (ILD) materials. With the addition of elemental composition information, the average pore size, porosity, pore connectivity, matrix density, average film density, film thickness, coefficient of thermal expansion, and moisture uptake of porous thin films are determined. Examples from different classes of materials and two analysis methods for small angle neutron scattering data are presented and discussed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 612: Symposium D – Materials, Technology & Reliability for Advanced Interconnects.. , 2000 , D4.1.1
Copyright
Copyright © Materials Research Society 2000

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