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A Simple Analysis of Average Mechanical Behavior and Strain Energy Density of Misoriented Grains in a Textured Film

Published online by Cambridge University Press:  15 February 2011

R.P. Vinci ,
T.P. Weihs ,
E.M. Zielinski ,
T.W. Barbee Jr.  and
J.C. Bravman
R.P. Vinci
Affiliation:
Department of Materials Science and Engineering, Stanford University, Stanford, CA 94305-2205
T.P. Weihs
Affiliation:
Chemistry and Materials Science Department, Lawrence Livermore National Laboratory, Livermore, CA
E.M. Zielinski
Affiliation:
Department of Materials Science and Engineering, Stanford University, Stanford, CA 94305-2205
T.W. Barbee Jr.
Affiliation:
Chemistry and Materials Science Department, Lawrence Livermore National Laboratory, Livermore, CA
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Abstract

Differences in strain energy density between grains of different orientation within a thin film may drive morphological changes such as abnormal grain growth, hillocking, and sunken grains. Models of these morphological changes generally assume that the behavior of each grain is the same as that of a blanket film of corresponding orientation. In order to investigate this assumption as it applies to the behavior of a (100)-oriented grain within a {111}-fiber textured copper film, simple continuum analytical and finite element models are applied to the case of a film on a rigid substrate subjected to temperature changes. The simple models indicate that the behavior of a misoriented grain does not simply duplicate that of a blanket film of the same orientation; the behavior of the surrounding grains must also be considered. The strain energy density difference between the grain and the surrounding film is less than that predicted by blanket film behavior. An elasticity equation is presented which describes the average stress-temperature behavior of widely dispersed misoriented grains within a textured film.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 391: Symposium T – Materials Reliability in Microelectronics V , 1995 , 97
Copyright
Copyright © Materials Research Society 1995

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