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Selective Deposition of C-axis Oriented Pb5Ge3O11 on the Patterned High k Gate Oxide by MOCVD Processes

Published online by Cambridge University Press:  01 February 2011

Tingkai Li ,
Sheng Teng Hsu ,
Bruce Ulrich  and
Dave Evans
Tingkai Li
Affiliation:
Sharp Laboratory of America, Inc. 5700 NW Pacific Rim Blvd. Camas, WA 98607, [email protected]
Sheng Teng Hsu
Affiliation:
Sharp Laboratory of America, Inc. 5700 NW Pacific Rim Blvd. Camas, WA 98607, [email protected]
Bruce Ulrich
Affiliation:
Sharp Laboratory of America, Inc. 5700 NW Pacific Rim Blvd. Camas, WA 98607, [email protected]
Dave Evans
Affiliation:
Sharp Laboratory of America, Inc. 5700 NW Pacific Rim Blvd. Camas, WA 98607, [email protected]
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Abstract

For the high density FeRAM applications, the integration process-induces damages such as etching damage that degrades the properties of FRAM devices and the high surface roughness of ferroelectric thin film that results in the difficulty for alignment are critical issues. In order to solve these problems, selective deposition process is developed to simplify the integration processes and improve the properties of FeRAM memory devices. Based on the differential deposition rates of ferroelectric materials on high-k oxide and silicon dioxide, we can selectively deposit a c-axis oriented PGO thin film on the patterned high-k oxide such as ZrOx (x=0–2), HfOx (x=0–2), TiO2, and their mixtures other than on SiO2. By patterning the high-k dielectric, the PGO deposition is limited to just the preferred pattern high-k area. SEM, EDX and x-ray measurements further confirm that the c-axis oriented PGO thin films are selectively deposited on the high-k gate oxide other than on the field SiO2 including alignment mark area, which will eliminate the roughness problem for the alignments. Also the etching damage is eliminated since there is no need to etch the PGO film, which improved the properties of FeRAM devices.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 786: Symposium E – Fundamentals of Novel Oxide/Semiconductor Interfaces , 2003 , E9.9/C9.9
Copyright
Copyright © Materials Research Society 2004

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References

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