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Science Issues Related to Wafer Cleaning in Silicon Technology

Published online by Cambridge University Press:  25 February 2011

M. Liehr
M. Liehr*
Affiliation:
IBM Research Division, Thomas J. Watson Research Center, P.O.Box 218, Yorktown Heights, NY 10598, USA
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Abstract

This paper highlights a number of basic science issues related to wafer cleaning in silicon technology. Particle removal techniques, metal contamination, surface passivation, and integrated processing are used as key examples of areas of active research related to wafer cleaning. It is highlighted that wafer cleaning plays a far more significant role in device processing than just for contamination removal. However, even contamination removal faces formidable challenges such as the determination of safe contamination limits and the detection of trace amounts of contamination, all of which go well beyond the traditional realm of contamination control.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 259: Symposium B – Chemical Surface Preparation, Passivation and Cleaning for Semiconductor Growth and Processing , 1992 , 3
Copyright
Copyright © Materials Research Society 1992

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