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Package Reliability Analysis with Coupled Electro-Thermal and Mechanical Modeling

Published online by Cambridge University Press:  31 May 2013

Chan-Su Yun ,
Xiaopeng Xu ,
Arsen Terterian  and
Tommaso Cilento
Chan-Su Yun
Affiliation:
Synopsys, Inc., Mountain View, CA 94043, U.S.A.
Xiaopeng Xu
Affiliation:
Synopsys, Inc., Mountain View, CA 94043, U.S.A.
Arsen Terterian
Affiliation:
Synopsys Switzerland, LLC., Zurich, Switzerland.
Tommaso Cilento
Affiliation:
Synopsys Switzerland, LLC., Zurich, Switzerland.
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Abstract

Power consumption and dissipation during electrical operation lead to a temperature rise in the package. Elevated temperature in the package structure induces thermo-mechanical stresses which may increase reliability risks. Robust and reliable package design for power systems requires comprehensive analysis of system electrical, thermal, and mechanical behavior. This paper presents a self-consistent approach for package reliability analysis with coupled electro-thermal and thermo-mechanical modeling using TCAD tools.

Keywords

thermoelectricpackagingsimulation
Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 1559: Symposium AA – Advanced Interconnects for Micro- and Nanoelectronics—Materials, Processes and Reliability , 2013 , mrss13-1559-aa08-05
Copyright
Copyright © Materials Research Society 2013 

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References

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