Hostname: page-component-586b7cd67f-dsjbd Total loading time: 0 Render date: 2024-11-25T15:44:14.007Z Has data issue: false hasContentIssue false
  • English
  • Français

Organic Solution Deposition of Copper Seed Layers onto Barrier Metals

Published online by Cambridge University Press:  17 March 2011

H. Gu ,
R. Fang ,
T. J. O'Keefe ,
M. J. O'Keefe ,
W.-S. Shih ,
J. A. M. Snook ,
K. D. Leedy  and
R. Cortez
H. Gu
Affiliation:
University of Missouri-Rolla, Dept. of Metallurgical Engineering and Materials Research Center, Rolla, MO 65409, U.S.A
R. Fang
Affiliation:
University of Missouri-Rolla, Dept. of Metallurgical Engineering and Materials Research Center, Rolla, MO 65409, U.S.A
T. J. O'Keefe
Affiliation:
University of Missouri-Rolla, Dept. of Metallurgical Engineering and Materials Research Center, Rolla, MO 65409, U.S.A
M. J. O'Keefe
Affiliation:
University of Missouri-Rolla, Dept. of Metallurgical Engineering and Materials Research Center, Rolla, MO 65409, U.S.A
W.-S. Shih
Affiliation:
Brewer Science, Inc., Rolla, MO 65401, U.S.A
J. A. M. Snook
Affiliation:
Brewer Science, Inc., Rolla, MO 65401, U.S.A
K. D. Leedy
Affiliation:
Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OH 45433, U.S.A
R. Cortez
Affiliation:
Air Force Research Laboratory, Sensors Directorate, Wright-Patterson AFB, OH 45433, U.S.A
Get access

Abstract

Spontaneous deposition of copper seed layers from metal bearing organic based solutions onto sputter deposited titanium, titanium nitride, and tantalum diffusion barrier thin films has been demonstrated. Based on electrochemically driven cementation exchange reactions, the process was used to produce adherent, selectively deposited copper metal particulate films on blanket and patterned barrier metal thin films on silicon substrates. The organic solution deposited copper films were capable of acting as seed layers for subsequent electrolytic and electroless copper deposition processes using standard plating baths. Electroless and electrolytic copper films from 0.1µm to 1.0µm thick were produced on a variety of samples on which the organic solution copper acted as the initial catalytic seed layer. The feasibility of using organic solution deposited palladium as a seed layer followed by electroless copper deposition has also been demonstrated. In addition, experiments conducted on patterned barrier metal samples with exposed areas of dielectric such as polyimide indicated that no organic solution copper or palladium deposition occurred on the insulating materials.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 612: Symposium D – Materials, Technology & Reliability for Advanced Interconnects.. , 2000 , D9.19.1
Copyright
Copyright © Materials Research Society 2000

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Ryu, C., Kwon, K.-W., Loke, A. L. S., Lee, H., Nogami, T., Dubin, V. M., Kavari, R. A., Way, G. W., and Wong, S. S., IEEE Transactions on Electron Devices 46(6), 1113 (1999).Google Scholar
2. Mikkola, R. D., Jiang, Q.-T., and Carpenter, B., Plating & Surface Finishing, March, 81 (2000).Google Scholar
3. Dubin, V. and Yosi, S.-D., J. Electrochem. Soc. 44(3), 898 (1997).10.1149/1.1837505Google Scholar
4. O'Keefe, T. J., Stroder, M., O'Keefe, M. J. in Advance Interconnects and Contact Materials and Processes for Future Integrated Circuits, ed. Murarka, S. P., Fraser, D. B., Eizenberg, M., Tung, R., Madar, R., Mater. Res. Soc. Proc. 514, 473, Warrendale, PA (1998).Google Scholar
5. O'Keefe, T. J., Method for Stripping Metals in Solvent Extraction, U. S. Patent #5,228,903, July 20, 1993.Google Scholar
6. Chia, L. M., Niera, M. P., Flores, C., and O'Keefe, T. J. in Extraction and Processing for the Treatment and Minimization of Wastes, ed. Hager, J. P. et al, TMS Annual Meeting, 279, Warrendale, PA (1994).Google Scholar
7. O'Keefe, M. J., Leedy, K. D., Grant, J. T., Fang, M., Gu, H., and O'Keefe, T. J., J. Vac. Sci. Tech. B 17(5), 2366 (1999).10.1116/1.590920Google Scholar