Hostname: page-component-586b7cd67f-gb8f7 Total loading time: 0 Render date: 2024-11-29T06:02:15.212Z Has data issue: false hasContentIssue false
  • English
  • Français

Optoelectronic Packaging for Computer and Communication Systems

Published online by Cambridge University Press:  15 February 2011

H. F. Lockwood  and
C. A. Armiento
H. F. Lockwood
Affiliation:
The Lockwood Group, P.O. Box 132, Newton MA 02162
C. A. Armiento
Affiliation:
GTE Laboratories Incorporated, 40 Sylvan Road, Waltham MA 02254
Get access

Abstract

The principal driver behind advanced hardware development in the communications and computer industries can be reduced to an optimal set of parameters related to performance, cost and reliability. High performance systems typically have high functional density. For example, the continuing trend of VLSI is toward reduced feature size, increased wiring density and larger chip size to achieve increasingly higher levels of on-chip functionality. At some point in the cost structure, however, the single chip solution is no longer viable, and monolithic integration gives way to hybrid integration. In this respect, the multichip module fills a void in the packaging/ integration hierarchy between the ever-larger single chip and the printed wiring board.

An analogous situation is emerging in optoelectronics. The single chip package with its relatively low system functionality and high cost is giving way to the multi-technology module that integrates optical and electronic functions within a single package. One of the most interesting approaches to the multi-technology module uses a silicon substrate as the platform for hybrid integration of electronics and optoelectronics. It will be argued that this “silicon waferboard” approach is the cost-effective route to manufacturability of high-performance modules for communications and computer systems. Enhanced reliability follows from applying standard IC processing technology at the platform level in the packaging hierarchy.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 323: Symposium J – Electronic Packaging Materials Science VII , 1993 , 3
Copyright
Copyright © Materials Research Society 1994

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Henry, C.H., Blonder, G.E., and Kazarinov, R.F., “Glass Waveguides on Silicon for Hybrid Optical Packaging,” J. Lightwave Technol., vol.17, no. 10, pp. 1530–1539, Oct. 1989.Google Scholar
2. Wale, M.J., Edge, C., Randle, F.A., and Pedder, D.J., “A New Self-Aligned Technique for the Assembly of Integrated Optical Devices with Optical Fibre and Electrical Interfaces,” in Proc. European Conference on Optical Communications (ECOC), Paper No. ThA19–7, pp. 368–371, 1989.Google Scholar
3. Armiento, C.A., Tabasky, M.J., Jagannath, C., Fitzgerald, T.W., Shieh, C.L., Barry, V.J., Rothman, M.A., Negri, A.J., Haugsjaa, P.O., and Lockwood, H.F., “Passive Coupling of an InGaAsP/InP Laser Array and Single Mode Fibers Using Silicon Waferboard,” Electron. Lett., vol.27, pp. 1109–1111, 1991.Google Scholar
4. Parker, J.W., “Optical Interconnection for Advanced Processor Systems: A Review of the ESPRIT II OLIVES Program,” J. Lightwave Technol., vol.9, no. 12, pp. 1764–1773, Dec. 1991.CrossRefGoogle Scholar
5. Bean, K.E., “Chemical Etching and Slice Cleanup of Silicon,” in Semiconductor Materials and Process Technology Handbook, Chapter 4, Edited by McGuire, G.E., Noyes Publications, 1988.Google Scholar
6. Bassous, E., “Fabrication of Novel Three-Dimensional Microstructures by the Anisotropic Etching of (100) and (110) Silicon,” IEEE Trans. on Electron Devices, vol. ED–25, pp. 1178–1184, Oct. 1978.Google Scholar
7. Armiento, C.A., Negri, A.J., Tabasky, M.J., Boudreau, R.A., Rothman, M.A., Fitzgerald, T.W., Haugsjaa, P.O., “Gigabit Transmitter Array Modules on Silicon Waferboard,” in Proc. IEEE Transactions on Components, Hybrids and Manufacturing, vol.15, no. 6, pp. 1072–1080, Dec. 1992.Google Scholar
8. Armiento, C.A., Tabasky, M.J., Jagannath, C., Fitzgerald, T.W., Shieh, C.L., Barry, V.J., Rothman, M.A., Haugsjaa, P.O., Holmstrom, R., Meland, E., Powazinik, W., and Lockwood, H.F., “Passive Coupling of an InGaAsP/InP Laser Array and Single Mode Fibers Using Silicon Waferboard,” in Proc. Optical Fiber Communications Conference, Feb. 1991.Google Scholar
9. Tabasky, M.J., Chirravuri, J., Choudhury, A.N.M.M., Budman, A.J., Haugsjaa, P.O., and Negri, A.J., “Four Channel Hybrid Receiver Utilizing a Silicon Substrate For Packaging,” in Proc. SPIE Conference No. 1582, pp. 152–157, 1992.Google Scholar