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Mössbauer Parameters Describing Several Intermetallic Phases in Tin-Containing Solders*
Published online by Cambridge University Press: 15 February 2011
Abstract
We report here on the Mbssbauer parameters of two intermetallic phases expected to be present in composite solders: the Cu9Sn3Ni phase present in some forms of eutectic Sn-Pb solders and the Ag-Sn (ζ) phase which may be present in lead-free solders containing appreciable amounts of silver. Both samples were prepared by mechanical alloying techniques.
Our results show that the isomer shift of the Ag-Sn ζ phase is + 2.13 mm/sec relative to SnO2 and the phase has a room-temperature recoilless fraction that is 36% of that of SnO2. The results for Cu9 Sn3Ni are an isomer shift of + 1.78 mm/sec and a recoilless fraction 58 % of that of SnO2.
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- Copyright © Materials Research Society 1994
Footnotes
This work is supported in part by the US Army, Harry Diamond Laboratories under a Cooperative Research and Development Agreement (CRADA) between UMBC and Army-HDL.