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Molecular Modeling of the Crystal Structure of LARC-CPI Thermoplastic Polyimide

Published online by Cambridge University Press:  15 February 2011

Mark V. Brilihart ,
Justyna Teverovsky ,
Pradnya Nagarkar  and
Peggy Cebe
Mark V. Brilihart
Affiliation:
Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139
Justyna Teverovsky
Affiliation:
Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139
Pradnya Nagarkar
Affiliation:
Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139
Peggy Cebe
Affiliation:
Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139
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Extract

Electrical components place high demands on the properties and performance of materials. Potential service environments have both broad temperature ranges and widely varying stress states. Polyimides are a class of polymers that possess the necessary performance characteristics for electronic applications. LARC-CPI, a novel semicrystalline thermoplastic polyimide developed by the NASA Langley Research Center [1], combines the excellent properties of polyimides with an ability to crystallize. This enhances mechanical performance and chemical resistance and imparts the processing benefits associated with thermoplastic materials. The high Modulus of Elasticity (2.5 to 3.6±0.2 GPa [2]), glass transition temperature (Tg = 222 °C [3]) and melting temperature (Tm = 350 °C [3]) combined with a relatively low dielectric constant (ε = 3.2 [4]) of LARC-CPI appear to meet the criteria for a wide range of electronic materials applications. Since many of the properties are attributed to the crystalline region and its orientation, thorough characterization of any ordered structures present in LARC-CPI is essential. The chemical repeat unit for LARC-CPI and a model repeat unit can be seen in Figure 1.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 323: Symposium J – Electronic Packaging Materials Science VII , 1993 , 251
Copyright
Copyright © Materials Research Society 1994

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