Hostname: page-component-cd9895bd7-gxg78 Total loading time: 0 Render date: 2024-12-27T01:43:21.797Z Has data issue: false hasContentIssue false
  • English
  • Français

Mold Compounds: Linking Material Science and IC Package Reliability

Published online by Cambridge University Press:  21 February 2011

Steven K. Groothuis  and
K. Gail Heinen
Steven K. Groothuis
Affiliation:
Texas Instruments, Inc., Semiconductor Packaging Laboratory P.O. Box 655012 M/S 477, Dallas, TX 75265
K. Gail Heinen
Affiliation:
Texas Instruments, Inc., Semiconductor Packaging Laboratory P.O. Box 655012 M/S 477, Dallas, TX 75265
Get access

Abstract

Making the transition from mechanical testing of mold compounds to actual Integrated Circuit (IC) plastic package reliability requires an understanding of material behavior under the influences of moisture, temperature, and varying load conditions. This paper will focus on the role of material strengths, strain energy, and nonlinear effects in determining plastic package reliability. Examples of correlation between materials testing and reliability data will be presented.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 390: Symposium S – Electronic Packaging Materials Science VIII , 1995 , 77
Copyright
Copyright © Materials Research Society 1995

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Chen, A.S., et al., IEEE Proc. 44th Electro. Comp. & Techn. Conf., 115–120 (1994).Google Scholar
2. Kitano, M., et al., IEEE Proc. 26th Intl. Reliability Phys. Symp., 90–95 (1988).Google Scholar
3. Tay, A.A.O., et al., IEEE Proc. 31st Intl. Reliability Phys., 90–95 (1993).Google Scholar
4. Ganesan, G.S. and Berg, H.M., IEEE Proc. 43rd Electro. Comp. & Techn. Conf., 653–660 (1993).Google Scholar
5. Rosen, Stephen, Fundamental Principles of Polymeric Materials, (John Wiley & Sons, New York, 1993), p. 106–109.Google Scholar
6. Mogi, N. and Yasuda, H., IEEE Proc. 42nd Electro. Comp. & Techn. Conf., 1023–1029 (1992).Google Scholar
7. Kenner, V.H. and Harper, B.D., Semiconductor Research Corporation Technical Report T94059, 23–37 (April 1994).Google Scholar
8. Kawada, H. and Ikegami, K., Japan Soc. of Mech. Engrs. Intl. Journal, Series I, 35 (2), 152–158 (1992).Google Scholar
9. Ferry, J.D., Viscoelastic Properties of Polymers, 3rd ed. (John Wiley & Sons, Inc., New York, 1980).Google Scholar
10. Sauber, J., et al., IEEE Trans. Comp., Hybrids, & Manuf. Techn., 17 (4), 533–541 (1994).Google Scholar
11. Sawada, K., et al., IEEE Proc. 32nd Intl. Reliability Phys. Symp., 114–119 (1994).Google Scholar
12. Takigawa, Y., et al., IEEE VLSI Packaging Workshop Proceedings, (Kyoto, Japan) 15–19 (November 1994).Google Scholar
13. Ogura, I. and Takahashi, K., IEEE VLSI Packaging Workshop Proceedings, (Kyoto, Japan) 20–23 (November 1994).Google Scholar