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Moisture Absorption and its Effects on the Performance of Printed Circuit Materials

Published online by Cambridge University Press:  15 February 2011

P. C. Liu ,
D. W. Wang ,
S. J. Fuerniss ,
M. D. Poliks ,
J. Obrzut ,
L. M. Siperko ,
W. T. Chen ,
R. D. Havens  and
R. M. Murcko
P. C. Liu
Affiliation:
IBM Corp., 1701 North Street, Endicott, NY 13760
D. W. Wang
Affiliation:
IBM Corp., 1701 North Street, Endicott, NY 13760
S. J. Fuerniss
Affiliation:
IBM Corp., 1701 North Street, Endicott, NY 13760
M. D. Poliks
Affiliation:
IBM Corp., 1701 North Street, Endicott, NY 13760
J. Obrzut
Affiliation:
IBM Corp., 1701 North Street, Endicott, NY 13760
L. M. Siperko
Affiliation:
IBM Corp., 1701 North Street, Endicott, NY 13760
W. T. Chen
Affiliation:
IBM Corp., 1701 North Street, Endicott, NY 13760
R. D. Havens
Affiliation:
IBM Corp., 1701 North Street, Endicott, NY 13760
R. M. Murcko
Affiliation:
IBM Corp., 1701 North Street, Endicott, NY 13760
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Abstract

Polymers have found wide usage in microelectronics industry. Their moisture absorption properties cause the concern of reliability without hermeticity (RwoH). For printed circuit packages, the lamination process, the components assembly, and the field performance of final product are strongly influenced by the presence of high level moisture content. For instance, moisture is an important factor in the development of internal shorts through metal migration when printed circuit package is in service. Moisture can also cause dimensional changes in printed circuit cores and delamination during the soldering processes in components assembly, resulting in manufacturing yield loss and defects. Understanding moisture properties of resins and the resin glass composites are therefore important in developing a strategy to control the moisture content of final products. This paper will discuss the moisture fundamental properties of two resins and their resin glass systems. These properties will be related to their assembly and reliability performance.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 323: Symposium J – Electronic Packaging Materials Science VII , 1993 , 309
Copyright
Copyright © Materials Research Society 1994

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