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Micro-Indentation and Micro-Scratch Tests on Sub-Micron Carbon Films

Published online by Cambridge University Press:  22 February 2011

T. W. Wu ,
R. A. Burn ,
M. M. Chen  and
P. S. Alexopoulos
T. W. Wu
Affiliation:
IBM Research Division, Almnaden Research Center, San Jose, CA 95120
R. A. Burn
Affiliation:
IBM Research Division, Almnaden Research Center, San Jose, CA 95120
M. M. Chen
Affiliation:
IBM General Product Division, San Jose, CA 95139
P. S. Alexopoulos
Affiliation:
IBM Research Division, Almnaden Research Center, San Jose, CA 95120
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Abstract

Micro-indentation and micro-scratch techniques were used to characterize the hardness and the adhesion strength of 0.11 μm thick sputtered carbon f-ilms on Silicon substrates. Hardness depth profiles and critical loads were measured using a microindenter under indentation and scratch testing modes, respectively. The carbon film with 6 mtorr argon sputtering pressure shows better practical adhesion (or higher critical load) and slightly higher hardness. The indentation fracture phenomenon observed on the 30 mtorr film is closely related to its poor adhesion. The failure mechanism will also be discussed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 130: Symposium C – Thin Films: Stresses and Mechanical Properties I , 1988 , 117
Copyright
Copyright © Materials Research Society 1989

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