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Micro-ATR-IR as a Probe of BCB Layers for MCM-D/L Applications

Published online by Cambridge University Press:  15 February 2011

C. E. Mohler ,
A. J. G. Strandjord ,
D. W. Castillo ,
M. R. Stachowiak ,
R. H. Heistand ,
P. E. Garrou  and
T. G. Tessier
C. E. Mohler
Affiliation:
The Dow Chemical Company, Midland, MI 48674
A. J. G. Strandjord
Affiliation:
The Dow Chemical Company, Midland, MI 48674
D. W. Castillo
Affiliation:
The Dow Chemical Company, Midland, MI 48674
M. R. Stachowiak
Affiliation:
The Dow Chemical Company, Midland, MI 48674
R. H. Heistand
Affiliation:
The Dow Chemical Company, Midland, MI 48674
P. E. Garrou
Affiliation:
The Dow Chemical Company, Research Triangle Park, NC 27709
T. G. Tessier
Affiliation:
Motorola, Inc., Corporate Manufacturing Research Center, 1301 E. Algonquin Rd, Schaumburg, IL 60196
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Abstract

To lower the cost of multichip module packaging, hybridized substrate technologies have recently been reported which blend the desirable aspects of D and L fabrication (MCM-D/L). High performance dielectrics such as Cyclotene™3022 and photosensitive BCB have been shown to be compatible with laminate substrates used in MCM-DIL, however the cure levels of the dielectric on the laminates must be known for optimum processing.

In this paper, the capability of attenuated reflection IR microscopy (micro-ATR-IR) to probe thin films of BCB polymers is demonstrated. This technique enables the polymer layer to be probed regardless of the characteristics of the substrate. Cure levels of both Cyclotene™ 3022 and photodefinable BCB polymer films are obtained with micro-ATR-IR on both silicon and laminate substrate. Micro-ATR-IR is also used to probe a rapid thermal cure of Cyclotene Tm 3022 and photodefinable BCB layers on copper-clad polyimide laminate; these measurements cannot be made with transmission IR due to the high reflectivity of the substrate.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 323: Symposium J – Electronic Packaging Materials Science VII , 1993 , 295
Copyright
Copyright © Materials Research Society 1994

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