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Mechanical Properties of Plated Copper

Published online by Cambridge University Press:  15 February 2011

M. A. Korhonen ,
D. D. Brown ,
C.-Y. Li  and
J. E. Steinwall
M. A. Korhonen
Affiliation:
Department of Materials Science and Engineering, Cornell University, NY 14853
D. D. Brown
Affiliation:
Department of Materials Science and Engineering, Cornell University, NY 14853
C.-Y. Li
Affiliation:
Department of Materials Science and Engineering, Cornell University, NY 14853
J. E. Steinwall
Affiliation:
IBM - Endicott Electronics Packaging, Endicott, NY 13760
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Abstract

Both electrodeposited and electroless copper are widely used in the electronics industry to form signal lines and plated-through holes in printed circuit cards and boards. Because of widely differing thermal expansion coefficients of copper and of the ceramic and polymeric substrates, large mechanical stresses develop in the metallization during thermal cycles, as e.g. during solder reflow. To safeguard against premature fracture it is imperative that the metallization is sufficiently ductile. Plated thin foil copper of poor ductility is known to be susceptible to cracks in plated-through holes which, besides causing problems in the manufacture, poses a threat to device reliability in service. In this paper we show that such cracks arise as a combination of reduced ductility due to presence of initial porosity in copper and due to grain boundary sliding and diffusional cavity growth during the soldering cycle. We emphasize that there exists strong interactions between these ductility reducing effects, such that their coupled action may exceed the effect when each mechanism operates independently. We review recent research on deformation and fracture of bulk and plated copper between RT and 300°C. Finally, we briefly discuss approaches to improve mechanical properties of plated thin foil copper.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 323: Symposium J – Electronic Packaging Materials Science VII , 1993 , 103
Copyright
Copyright © Materials Research Society 1994

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References

1. Fjelstad, J., in Electronic Materials Handbook, vol.1 (ASM International, Metals Park, Ohio, 1989), p. 507 Google Scholar
2. Curiel, J.A.. and Kumar, A., in Electronic Materials Handbook, vol.1 (ASM International, Metals Park, Ohio, 1989), p. 1018 Google Scholar
3. Shockley, F. and Wallner, R., in Electronic Materials Handbook, vol.1 (ASM International, Metals Park, Ohio, 1989), p. 572 Google Scholar
4. Gray, F.L., in Electronic Materials Handbook, vol.1 (ASM International, Metals Park, Ohio, 1989), p. 611 Google Scholar
5. Thomson, A.W., Metall. Trans. 18A, 1877 (1987)Google Scholar
6. Thomason, P.F., Ductile Fracture of Metals (Pergamon Press, Oxford, 1990)Google Scholar
7. Lau, J.H., Subrahmanian, R., Erasmus, S., Leung, S., and Li, C.-Y., in Thermal stress and strain in microelectronics packaging, edited by Lau, J.H. (Van Nostrand Reinhold, New York, 1993), p. 684 CrossRefGoogle Scholar
8. Barker, D.B. and Dasgupta, A., in Thermal stress and strain in microelectronics packaging, edited by Lau, J.H. (Van Nostrand Reinhold, New York, 1993), p. 648 Google Scholar
9. Crossman, F.W. and Ashby, M.F., Acta Metall. 23, 425 (1975)Google Scholar
10. Chen, C.W. and Machlin, E.S., Acta Metall. 4, 655 (1956)CrossRefGoogle Scholar
11. Intrater, J. and Machlin, E.S., Acta Metall. 7, 142 (1959)Google Scholar
12. Hart, E.W., Acta Metall. 15, 1546 (1967)Google Scholar
13. Chen, I.W., Met. Trans. 14A, 2289 (1983)Google Scholar
14. White, C.L., Schneibel, J.H., and Padgett, R.A., Metal. Trans. 14A, 595 (1983)Google Scholar
15. Kim, Y.S. and Nix, W.D., Mat. Sci. & Engg. A 127, 41 (1990)Google Scholar
16. Hull, D. and Rimmer, D.E., Philos. Mag. 4, 673 (1959)Google Scholar
17. Dyson, B.F., Can. Met. Quart. 18, 31 (1979)Google Scholar
18. Needleman, A. and Rice, J.R., Acta Metall. 28, 1315 (1980)Google Scholar
19. Chen, I.W. and Argon, A.S., Acta Metall. 29, 1759 (1981)CrossRefGoogle Scholar
20. Vitek, V., Mat. Sci. & Engg. 94, 24 (1987)Google Scholar
21. Zakraysek, L., Circuits Manufacturing, Dec. 1983, 38Google Scholar
22. Yu, K.S., Joshi, A., and Nix, W.D., Met. Trans 14A, 2447 (1983)Google Scholar
23. Nieh, T.G. and Nix, W.D., Met. Trans. 12A, 893 (1981)Google Scholar
24. Metals Handbook, vol.2, 10th edition (ASM International, Metals Park, OH, 1990), p. 266 Google Scholar
25. Hannula, S.P. and Li, C.-Y., unpublished research, 1983Google Scholar
26. Kim, W.H. and Laird, C., Mat. Sci. & Engg. 33, 225 (1978)Google Scholar
27. Baik, S. and Raj, R., Scripta Metall. 17 (1983), (1983)Google Scholar
28. Chang, H.C. and Grant, N.J., J. Metals 1956, 544 Google Scholar
29. Lorenzo, F. and Laird, C., Acta Metall. 32, 681 (1984)Google Scholar
30. Abdel-Raouf, H., Plumtree, A., and Topper, T.H., Met. Trans. 5, 267 (1974)Google Scholar
31. Nakahara, S. and Okinaka, Y., Annual Rev. Mater. Sci. 21, 93 (1991)CrossRefGoogle Scholar
32. Manusmare, P.G. and Leighly, H. P, Acta Met. 24, 1047 (1976)Google Scholar
33. Imabayashi, S., 1. Tanaka, Kikuchi, H., et al., IEEE 0569–5503, 1053 (1992)Google Scholar
34. Nakaso, A., Yamanoi, K., and Okamura, T., Proc. Printed Circuit World Convention III, Washington, 1984, Technical Paper WCIII-10, pp. 1–12 Google Scholar
35. Kurosawa, K., Takeda, Y., Takagi, K., and Kawamata, H., IPC Technical Review 1982 (2-3), 16 Google Scholar
36. Wu, T.Y. and Woychik, C.G., in Manufacturing Processes and Materials, Challenges in Microelectronics Packaging, edited by Chen, W.T., Engel, P., and Jahsman, W.E. (ASME, New York, 1991), p. 11 Google Scholar
37. Fox, A., J. Testing and Eval. 4, 74 (1976)Google Scholar
38. Wild, R.N., IPC Technical Review 1979 (11), 9Google Scholar
39. Borgesen, P., Lee, J.K., Gleixner, R., and Li, C.-Y., Appl. Phys. Lett. 60, 1706 (1992)Google Scholar
40. Ho, A., Brown, D., Borgesen, P. and Li, C.-Y., unpublished research, 1993 Google Scholar
41. Vinci, R.P., Marieb, T.N., and Bravman, J.C., to be publishedGoogle Scholar
42. Matlock, D.K. and Nix, W.D., Met. Trans. 5, 1401 (1974)Google Scholar
43. Steinwall, J.E., PhD. Thesis, Cornell University, 1992 Google Scholar
44. Mussot, P., Rey, C., and Zaoui, A., Res Mech. 14, 69 (1985)Google Scholar
45. Ono, N. and Karashima, S., Scripta Metall. 16, 381 (1982)Google Scholar