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Material and Reliability Considerations for Anisotropically Conductive Adhesive Based Interconnects

Published online by Cambridge University Press:  15 February 2011

J. Dion ,
P. Borgesen ,
B. Yost ,
D. A. Lilienfeld  and
C.-Y. Li
J. Dion
Affiliation:
Department of Materials Science and Engineering, Cornell University, Ithaca, NY
P. Borgesen
Affiliation:
Department of Materials Science and Engineering, Cornell University, Ithaca, NY
B. Yost
Affiliation:
Department of Materials Science and Engineering, Cornell University, Ithaca, NY
D. A. Lilienfeld
Affiliation:
National Nanofabrication Facility, Cornell University, Ithaca, NY
C.-Y. Li
Affiliation:
Department of Materials Science and Engineering, Cornell University, Ithaca, NY
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Abstract

An adhesive based interconnect design in which the contact force between a bumped die and substrate is maintained by the shrinkage stress of the adhesive was investigated for use in high performance applications. In general, heating will reduce the contact force because of the differential thermal expansions and load relaxation in the adhesive. Special experimental techniques have been developed to measure the relevant materials properties. The potential for optimization in terms of materials selection is discussed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 323: Symposium J – Electronic Packaging Materials Science VII , 1993 , 27
Copyright
Copyright © Materials Research Society 1994

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References

[1]: Hatada, K., “A Direct Mounting of a 4000-pin LSI Chip Using a Photo-Hardening Resin”, Nikkei Microdevices (1987) pp. 107–115Google Scholar
[2]: Matsui, K., Utsumi, K., Ohkubo, H., and Sugitani, C., “Resin and Flexible Metal Bumps for Chip-on-Glass Technology”, Proc. 43rd Electronic Components & Technology Conf. (1989) pp. 205–210Google Scholar
[3]: Hogerton, P. B., Hall, J. B., Pujol, J. M., and Reylek, R. S., Mat. Res. Soc. Symp. Proc. 154 (1989) p. 145 Google Scholar
[4]: Masuda, M., Sakuma, K., Satoh, E., Yamasaki, Y., Miyasaka, H., and Takeuchi, J., “Chip on Glass Technology for Large Capacity and High Resolution LCD”, Proc. Int. Electronic Manufacturing Technology Symp. (1989) pp. 57–60Google Scholar
[5]: Nukii, T., Kajimoto, N., Atarashi, H., Matsubara, H., Yamamura, K., and Matsui, H., “LSI Chip Mounting Technology for Liquid Crystal Displays”, Proc. Int. Symp. on Microelectronics (1990) pp. 257–262Google Scholar
[6]: Basavanhally, N. R., Chang, D. D., Cranston, B., and Segar, S. G., Jr., “Direct Chip Interconnect with Adhesive Conductor Films”, IEEE-CHMT 15 (1992) 972–976 Google Scholar
[7]: Chang, D. D., Crawford, P. A., Fulton, J. A., McBride, R., Schmidt, M. B., Sinitski, R. E., and Wong, C. P., “An Overview and Evaluation of Anisotropically Conductive Adhesive Films for Fine Pitch Electronic Assembly”, Proc. 43rd Electronic Components & Technology Conf. (1993) 320–326Google Scholar
[8]: Børgesen, P., Dion, J., Yost, B., and Li, C.-Y., to be publishedGoogle Scholar
[9]: Lilienfeld, D. A., Borgesen, P., and Li, C.-Y., “A Damage Integral Based Analysis and Simulation of the Thermal Fatigue of Diebonds”, these proceedingsGoogle Scholar
[10]: Børgesen, P., Conway, H. D., and Li, C.-Y., “Thermal Mismatch Induced Loading and Damage in Diebonds”, submitted to J. Electr. Pack.Google Scholar
[11]: Li, C.-Y., Yost, B., Korhonen, M.A., and Dion, J., “Micromechanical Testing of Electronic Packaging Components and Materials”, these proceedings.Google Scholar
[12]: Dion, J., Yost, B., Borgesen, P., and Li, C.-Y., “Load Relaxation of Thin Polymer Adhesive”, in Proc. 1992 Joint ASME/JSME Conf. Electronic Pack. (Chen, W. T. and Abe, H.', eds., ASME, NY, 1992) 633–636Google Scholar