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A Macroscopic Model of Electromigration: Comparison with Experiment

Published online by Cambridge University Press:  15 February 2011

Yolanda J. Kime
Yolanda J. Kime*
Affiliation:
Physics Department, State University of New York: College at Cortland, P.O. Box 2000, Cortland, NY 13045-2000
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Abstract

Comparison of theory and experiment is critical in microelectronic reliability. In this work, a model which has been previously used for electromigration time to failure predictions (developed by Harrison) is extended to include predictions for numbers of voids and void sizes. Predictions from the model are compared to experimental measurements. The model makes reasonable predictions for mean lifetimes, numbers of voids, and void areas with very few free parameters. The model, however, does not adequately reproduce the range of lifetimes found in experiment.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 391: Symposium T – Materials Reliability in Microelectronics V , 1995 , 367
Copyright
Copyright © Materials Research Society 1995

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