Hostname: page-component-586b7cd67f-vdxz6 Total loading time: 0 Render date: 2024-11-23T15:44:45.507Z Has data issue: false hasContentIssue false
  • English
  • Français

Low Temperature Plasma Sintering of Silver Nanoparticles for Potential Flexible Electronics Applications

Published online by Cambridge University Press:  07 January 2013

Siyuan Ma ,
Vadim Bromberg ,
Frank D. Egitto  and
Timothy J. Singler
Siyuan Ma
Affiliation:
Mechanical Engineering Department, Binghamton University, Binghamton, NY 13905, U.S.A.
Vadim Bromberg
Affiliation:
Mechanical Engineering Department, Binghamton University, Binghamton, NY 13905, U.S.A.
Frank D. Egitto
Affiliation:
Research and Development, Endicott Interconnect Technologies, Endicott, NY 13760, U.S.A.
Timothy J. Singler
Affiliation:
Mechanical Engineering Department, Binghamton University, Binghamton, NY 13905, U.S.A.
Get access

Abstract

Deposition of solution-processed functional materials generally requires additional post-processing to optimize the functionality of the material. We study sintering of Ag nanoparticle (NP) (with average diameter 77nm) deposits for improved electrical conductivity, with emphasis on Argon plasma methods compatible with the low temperature requirements of regular low-cost flexible polymer substrates. The relationship between plasma parameters (such as power and treatment time) versus sintering results (sintered structure depth, film continuity and electrical sheet resistance) will be reported. According to our efforts so far, we have achieved the electrical resistivity of the sintered film at about 20 times greater than the value of bulk silver using a process compatible with the low temperature requirements of common flexible polymer substrates.

Keywords

sinteringAgnanostructure
Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 1529: Symposium WW – Roll-to-Roll Processing of Electronics and Advanced Functionalities , 2012 , mrsf12-1529-ww06-14
Copyright
Copyright © Materials Research Society 2012

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

Logothetidis, S., “Polymeric substrates and encapsulation for flexible electronics: bonding structure, surface modification and functional nanolayer growth,” Rev. Adv. Mater. Sci., vol. 10, pp. 387–397, 2005.Google Scholar
Kamyshny, A., “Metal-based Inkjet Inks for Printed Electronics,” The Open Applied Physics Journal, vol. 4, no. 1, pp. 19–36, Mar. 2011.CrossRefGoogle Scholar
Singh, M., Haverinen, H. M., Dhagat, P., and Jabbour, G. E., “Inkjet printing-process and its applications.,” Advanced materials (Deerfield Beach, Fla.), vol. 22, no. 6, pp. 673–85, Mar. 2010.CrossRefGoogle ScholarPubMed
Manceau, M., Angmo, D., Jørgensen, M., and Krebs, F. C., “ITO-free flexible polymer solar cells: From small model devices to roll-to-roll processed large modules,” Organic Electronics, vol. 12, no. 4, pp. 566–574, Apr. 2011.CrossRefGoogle Scholar
Alsaid, D. A., Rebrosova, E., Joyce, M., Rebros, M., Atashbar, M., and Bazuin, B., “Gravure Printing of ITO Transparent Electrodes for Applications in Flexible Electronics,” Journal of Display Technology, vol. 8, no. 7, pp. 391–396, Jul. 2012.CrossRefGoogle Scholar
Andreescu, D., Eastman, C., Balantrapu, K., and Goia, D. V., “A simple route for manufacturing highly dispersed silver nanoparticles,” Journal of Materials Research, vol. 22, no. 09, pp. 2488–2496, Jan.2011.CrossRefGoogle Scholar
Deegan, R. D., Bakajin, O., Dupont, T. F., Huber, G., Nagel, S. R., and Witten, T. A., “Capillary flow as the cause of ring stains from dried liquid drops,” Nature, vol. 389, pp. 827–829, Oct. 1997.CrossRefGoogle Scholar
Reinhold, I., Hendriks, C. E., Eckardt, R., Kranenburg, J. M., Perelaer, J., Baumann, R. R., and Schubert, U. S., “Argon plasma sintering of inkjet printed silver tracks on polymer substrates,” Journal of Materials Chemistry, vol. 19, no. 21, p. 3384, 2009.CrossRefGoogle Scholar
Matula, R. A., “Electrical resistivity of copper, gold, palladium, and silver,” Journal of Physical and Chemical Reference Data, vol. 8, no. 4, p. 1147, 1979.CrossRefGoogle Scholar