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Investigation and Modeling of Fluorine Co-Implantation Effects on Dopant Redistribution

Published online by Cambridge University Press:  01 February 2011

M. Diebel
Affiliation:
Department of Physics, Univ. of Washington, Seattle, WA 98195-1560, USA Silicon Technology Development, Texas Instruments, Dallas, TX 75243, USA
S. Chakravarthi
Affiliation:
Silicon Technology Development, Texas Instruments, Dallas, TX 75243, USA
S.T. Dunham
Affiliation:
Department of Electrical Engineering, Univ. of Washington, Seattle, WA 98195-2500, USA
C.F. Machala
Affiliation:
Silicon Technology Development, Texas Instruments, Dallas, TX 75243, USA
S. Ekbote
Affiliation:
Silicon Technology Development, Texas Instruments, Dallas, TX 75243, USA
A. Jain
Affiliation:
Silicon Technology Development, Texas Instruments, Dallas, TX 75243, USA
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Abstract

A comprehensive model is developed from ab-initio calculations to understand the effects of co-implanted fluorine (F) on boron (B) and phosphorus (P) under sub-amorphizing and amorphizing conditions. The depth of the amorphous-crystalline interface and the implant depth of F are the key parameters to understand the interactions. Under sub-amorphizing conditions, B and P diffusion are enhanced, in contrast to amorphized regions where the model predicts retarded diffusion. This analysis predicts the F effect on B and P to be entirely due to interactions of F with point-defects.

Type
Research Article
Copyright
Copyright © Materials Research Society 2003

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References

[1] Jeng, S.-P., Ma, T.-P., Canteri, R., Anderle, M., and Rubloff, G.W., Appl. Phys. Lett. 61, 1310 (1992).Google Scholar
[2] Huang, T.H. and Kwong, D.L., Appl. Phys. Lett. 65, 1829 (1994).Google Scholar
[3] Park, J. and Hwang, H. in Si Front-End Processing: Physics and Technology of Dopant-Defect Interactions, edited by Gossmann, H.-J. L., Haynes, T.E., Law, M.E., Larsen, A.N., and Odanaka, S., (Mater. Res. Soc. Symp. Proc. 568, Warrendale, PA, 1999) pp. 7175.Google Scholar
[4] Downey, D.F., Chow, J.W., Ishida, E., and Jones, K.S., Appl. Phys. Lett. 73, 1263 (1998).Google Scholar
[5] Robertson, L.S., Warnes, P.N., Jones, K.S., Earles, S.K., Law, M.E., Downey, D.F., Falk, S., and Liu, J. in Si Front-End Processing: Physics and Technology of Dopant-Defect Interactions II, edited by Agarwal, A., Pelaz, L., Vuong, H-H., Packan, P., Kase, M., (Mater. Res. Soc. Symp. Proc. 610, Warrendale, PA, 2000) pp. B4.2.1–B4.2.6.Google Scholar
[6] Kennel, H.W. et al., 2002. IEDM '02. Digest. International, 875, (2002).Google Scholar
[7] Diebel, M. and Dunham, S.T. in Si Front-End Junction Formation Technologies, edited by Downey, D.F., Law, M.E., Claverie, A.P., Rendon, M.J., (Mater. Res. Soc. Symp. Proc. 717, Warrendale, PA, 2002) pp. C4.5.1–C4.5.6.Google Scholar
[8] Diebel, M. and Dunham, S.T. (paper in preparation).Google Scholar