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Intrinsic and Doped m c-Si:H TFT Layers using 13.56 MHz PECVD at 250°C

Published online by Cambridge University Press:  21 March 2011

Czang-Ho Lee
Affiliation:
Electrical and Computer Engineering, University of Waterloo, Waterloo, Ontario, N2L 3G1, Canada
Denis Striakhilev
Affiliation:
Electrical and Computer Engineering, University of Waterloo, Waterloo, Ontario, N2L 3G1, Canada
Arokia Nathan
Affiliation:
Electrical and Computer Engineering, University of Waterloo, Waterloo, Ontario, N2L 3G1, Canada
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Abstract

Undoped and n+ hydrogenated microcrystalline silicon (μc-Si:H) films for thin film transistors (TFTs) were deposited at a temperature of 250°C with 99 ∼ 99.6 % hydrogen dilution of silane by standard 13.56 MHz plasma enhanced chemical vapor deposition (PECVD). High crystallinity m c-Si:H films were achieved at 99.6 % hydrogen dilution and at low rf power. An undoped 80 nm thick m c-Si:H film showed a dark conductivity of the order of 10−7 S/cm, the photosensitivity of an order of 102, and a crystalline volume fraction of 80 %. However, a 60 nm thick n+ μc-Si:H film deposited using a seed layer showed a high dark conductivity of 35 S/cm and a crystalline volume fraction of 60 %. Using n+ μc-Si:H films as drain and source contact layers in a-Si:H TFTs provides substantial performance improvement over n+ a-Si:H contacts. Finally, fully μ c-Si:H TFTs incorporating intrinsic m c-Si:H films as channel layers and n+ μc-Si:H films as contact layers have been fabricated and characterized. These TFTs exhibit a low threshold voltage and a field effect mobility of 0.85 cm2/Vs, and are far more stable under gate bias stress than a-Si:H TFTs.

Type
Research Article
Copyright
Copyright © Materials Research Society 2004

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References

REFERENCES

1. Street, R. A., Technology and Application of Hydrogenated Amorphous Silicon (Springer, New York, 2000).Google Scholar
2. Willeke, G., in Amorphous and Microcrystalline Semiconductor Devices Volume II Material and Device Physics, edited by Kanicki, J. (Artech House, New York, 1992), p. 55.Google Scholar
3. Lee, C. H., Striakhilev, D., and Nathan, A., J. Vac. Sci. Technol. A22, (2004), to appear.Google Scholar
4. Mulato, M., Chen, Y., Wagner, S., and Zanatta, A. R., J. Non-Cryst. Solids 266–269, 1260 (2000).Google Scholar
5. Roca, P. I Cabarrocas, Kalache, S., Vanderhghen, R., and Bonnassieux, Y., SID 03 DIGEST, 1096 (2003).Google Scholar
6. Meiling, H., Brockhoff, A. M., Rath, J. K., and Schropp, R. E. I., J. Non-Cryst. Solids 266–269, 1202 (1998).Google Scholar
7. Krishnan, A. T., Bae, S., and Fonash, S. J., IEEE Electron Devices Lett. 22, 399 (2001).Google Scholar
8. Bustarret, E., Hachinia, M. A., and Brunel, M., Appl. Phys. Lett. 52, 1675(1988).Google Scholar
9. Miri, A. M. and Chamberlain, S. G., Mater. Res. Soc. Symp. Proc. 377, 737(1995).Google Scholar
10. Kanicki, J., Appl. Phys. Lett. 53, 1943(1988).Google Scholar
11. Kuo, Y. and Latzko, K., Mater. Res. Soc. Symp. Proc. 507, 891(1998).Google Scholar
12. Mohan, N., Karim, K. S., and Nathan, A., J. Vac. Sci. Technol. A20, 1043(2002).Google Scholar