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Interfacial Reactions and Phase Stability in the Ni/InP System

Published online by Cambridge University Press:  25 February 2011

Suzanne E. Mohney  and
Y. Austin chang
Suzanne E. Mohney
Affiliation:
Department of Materials Science and Engineering, 221 Steidle Building, The Pennsylvania State University, University Park, PA 16802
Y. Austin chang
Affiliation:
Department of Materials Science and Engineering, 1509 University Avenue, University of Wisconsin, Madison, WI 53706
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Abstract

Nickel is widely used in electrical contacts to InP, especially in NiAuGe ohmic contact to n-type InP. Several researchers have even suggested that the reaction of Ni with InP plays an important role in the ohmic nature of Ni-based contacts. However, numerous discrepancies are found in the literature concerning the Ni/InP reaction. In this study, an examination of the phase equilibria in the Ni-In-P system aids in an interpretation of bulk and thick film diffusion couples, and many of the apparent discrepancies in the literature are clarified. Finally, minor variations in the processing of the contacts (changes in the annealing gas and substrate cleaning procedure) are found in this study to have a less important role in altering the Ni/InP reactions than previous researchers have suggested.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 337: Symposium B – Advanced Metallization for Devices and Circuits—Science, Technology and Manufacturing III , 1994 , 393
Copyright
Copyright © Materials Research Society 1994

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References

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