Hostname: page-component-745bb68f8f-s22k5 Total loading time: 0 Render date: 2025-01-28T23:19:26.969Z Has data issue: false hasContentIssue false
  • English
  • Français

The Influence of Thickness and Wavelength on the Mechanical Properties of a Compositionally Modulated Ceramic Thin Film

Published online by Cambridge University Press:  22 February 2011

W. C. Oliver ,
F. A. List  and
R. A. McKee
W. C. Oliver
Affiliation:
Metals and Ceramics Division, Oak Ridge National Laboratory, Oak Ridge, TN 37831
F. A. List
Affiliation:
Metals and Ceramics Division, Oak Ridge National Laboratory, Oak Ridge, TN 37831
R. A. McKee
Affiliation:
Metals and Ceramics Division, Oak Ridge National Laboratory, Oak Ridge, TN 37831
Get access

Abstract

The hardness and modulus of thin (<1 μm) ceramic films have been investigated using the differential mechanical properties microprobe (DMPM). The DMPM consists of a computer controlled ultra-low load indentation system with a special system that allows the elastic stiffness of the contact to be determined continuously during the indentation process. The films were deposited in a molecular beam epitaxy (MBE) system utilizing unique high temperature effusion cells. Two specimens have been studied. The first is a wedge shaped layer of amorphous Al2O3 on a silicon substrate. The thickness of the layer varies from 0 to 990 nm at the two extreme sides of a 3 in. silicon wafer. The effect of layer thickness on the hardness and modulus as measured with the DMPM has been quantified for this system. The second specimen is made up of 38 repetitions of alternating layers of crystalline TiO2 and amorphous Al2O3. The wavelength of the composition modulation and the thickness of the film varies uniformly from 0 to 38 nm and from 0 to 1460 nm respectively across the 3 in. diameter of the silicon substrate.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 130: Symposium C – Thin Films: Stresses and Mechanical Properties I , 1988 , 99
Copyright
Copyright © Materials Research Society 1989

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Narayanamunti, V., Phys. Today 24, (October 1984).10.1063/1.2915912Google Scholar
2. “Report of Research Briefing Panel on Selected Opportunities in Physics,” Hans Frauenfelder and Mildred Dresselhaus, S., Co-chairman, p. 107 in Research Briefings (1984).Google Scholar
3. Phys. Today 21 (January 1985).Google Scholar
4. Tench, D. and White, S., Metall. Trans. A 15A, 2039 (1984).10.1007/BF02646838Google Scholar
5. Baral, D., Ketterson, J. B., Hilliard, J. E., p. 465 in Proceeding of NATO Advanced Study Institute on Modulated Structure Materials, Elsevier, Oxford, 1984.10.1007/978-94-009-6195-1_25Google Scholar
6. Shin, Sung C., Hilliard, J. E., and Ketterson, J. B., J. Vac. Sci. Technol. A2, 296 (1984).10.1116/1.572585CrossRefGoogle Scholar
7. Gibson, J.M., Tung, R. T., Phillips, J. M., and Poate, J. M., Mater. Res. Soc. Proc., Series 25, edited by Baglin, G., 405 (1984).10.1557/PROC-25-405Google Scholar
8. Bean, J. C., Feldman, L. C., Fioy, A. T., Nakahara, S., Robinson, I. K., J. Vac. Sci. Technol. A2, 436 (1984).10.1116/1.572361CrossRefGoogle Scholar
9. Speriosin, V. S., Nicolet, M. A., Picraux, S. T., and Biefeld, R.M, Appl. Phys. Lett. 45, 223 (1984).10.1063/1.95190CrossRefGoogle Scholar
10. Pei, S. S., Shah, N. J., Hendel, R. H., Tu, C. W., and Dingle, R., in Proceedings of 1984 GaAs IC Conference, to be published.Google Scholar
11. Yang, W. M. C., Tsakalakos, T., and Hillard, J.E, J. Appl. Phys. 48, 876 (1977).10.1063/1.323749CrossRefGoogle Scholar
12. Sprugir, R. W. and Catlett, D S., Thin Solid Films 54, 197 (1978).Google Scholar
13. Bunshah, R. F., Nimmagadda, R., Doerr, H. J., Mouchan, B. A., Grechanuk, N. I., and Dabizha, E. V., Thin Solid Films 72, 261 (1980).10.1016/0040-6090(80)90007-3CrossRefGoogle Scholar
14. Pethica, J. B. and Oliver, W. C., in “Thin Films: Stress and Mechanical Properties,” Proceedings Symposium C, MRS Meeting Fall 1988.Google Scholar
15. Doerner, M. F., Nix, W. D., J. of Mater. Res. 1(4), 601–09 (1986).10.1557/JMR.1986.0601Google Scholar
16. Oliver, W. C., McHargue, C. J., Zinkle, S. J., Thin Sol. Films 153, 185–196 (1987).10.1016/0040-6090(87)90181-7Google Scholar
17. Hoffman, R. W., Mat. Res. Soc. Symp. Proc. Vol.69, 95 (1986).10.1557/PROC-69-95Google Scholar