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The Influence of Low Temperature Pre-Annealing on the Defect Removal and the Reduction of Junction Depth in Excimer Laser Annealing

Published online by Cambridge University Press:  01 February 2011

Sungkweon Baek ,
Taesung Jang  and
Hyunsang Hwang
Sungkweon Baek
Affiliation:
Department of Materials Science and Engineering, Kwangju Institute of Science and Technology, #1, Oryongdong, Buk-gu, Gwangju, 500-712, KOREA
Taesung Jang
Affiliation:
Department of Materials Science and Engineering, Kwangju Institute of Science and Technology, #1, Oryongdong, Buk-gu, Gwangju, 500-712, KOREA
Hyunsang Hwang
Affiliation:
Department of Materials Science and Engineering, Kwangju Institute of Science and Technology, #1, Oryongdong, Buk-gu, Gwangju, 500-712, KOREA
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Abstract

The influence of low temperature pre-annealing on p+/n ultra-shallow junction was investigated. An ultra-shallow junction was formed by means of B2H6 plasma doping at an energy of 500V. The activation was performed by excimer laser annealing. To study the low temperature annealing prior to laser annealing, furnace annealing at 300°C∼500°C for 5min was performed. Compared with control samples with no pre-annealing, the low temperature preannealing significantly improves junction characteristics, resulting in a reduction of junction depth and a lower leakage current density. A cross-sectional transmission electron microscopy analysis confirmed the lower defect density, which explains the lower leakage current. By optimizing the process conditions, excellent electrical characteristics of the p+/n ultra-shallow junction such as a junction depth of 28nm and a sheet resistance of 250Δ/sq. can be obtained.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 717: Symposium C – Si Front-End Junction Formation Technologies , 2002 , C1.12
Copyright
Copyright © Materials Research Society 2002

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