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Indentation Technique to Investigate Elastic Moduli of Thin Films on Substrates

Published online by Cambridge University Press:  22 February 2011

D. S. Stone ,
T. W. Wu ,
P.-S. Alexopoulos  and
W. R. Lafontaine
D. S. Stone
Affiliation:
Materials Science and Engineering, Bard Hall, Cornell University, Ithaca, NY 14853; presently at Materials Science and Engineering, University of Wisconsin, 1509 University Avenue, Madison, WI 53706
T. W. Wu
Affiliation:
IBM Research Division, Almaden Research Center, IBM Magnetic Recording Institute, San Jose, CA 95120-6099
P.-S. Alexopoulos
Affiliation:
Materials Science and Engineering, Bard Hall, Cornell University, Ithaca, NY 14853; presently at Materials Science and Engineering, University of Wisconsin, 1509 University Avenue, Madison, WI 53706
W. R. Lafontaine
Affiliation:
Materials Science and Engineering, Bard Hall, Cornell University, Ithaca, NY 14853
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Abstract

Closed-form elasticity solutions are introduced, that predict the average displacement beneath square and triangular, uniformly loaded areas at the surface of a bilayer. The solutions aid in the application of depth-sensing indentation techniques for measuring thin film elastic moduli. The elasticity solutions agree closely with experimental data of Al, Si, 1 μm Al on Si, and 2 μm Cr on Si. The case of poor adhesion between the film and substrate is briefly examined.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 130: Symposium C – Thin Films: Stresses and Mechanical Properties I , 1988 , 105
Copyright
Copyright © Materials Research Society 1989

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