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High-Resolution Electron Microscopy of Planar Defects in Ain.

Published online by Cambridge University Press:  21 February 2011

Stuart Mckernan
Affiliation:
Department of Materials Science and Engineering, Bard Hall, Cornell University, Ithaca, NY 14853
M. Grant Norton
Affiliation:
Department of Materials Science and Engineering, Bard Hall, Cornell University, Ithaca, NY 14853
C. Barry Carter
Affiliation:
Department of Materials Science and Engineering, Bard Hall, Cornell University, Ithaca, NY 14853
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Abstract

The defects which occur in polycrystalline aluminum nitride are very detrimental to the beneficial physical and electrical properties. 'Dome-like' or 'D' defects, consisting of a flat basal fault joined to a curved planar fault, are examined by high-resolution electron microscopy. The basal segments are shown to contain a thin ∼5Å layer of a second phase and are associated with a stacking-fault and an antiphase boundary. A structural model is proposed for the defect which incorporates a layer of alumina at the basal segment of the 'D' defect. The formation of thisdefect is discussed.

Type
Research Article
Copyright
Copyright © Materials Research Society 1990

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References

1. Hagege, S., Ishida, Y., and Tanaka, S., J. de Physique, 49, C5189 (1988)Google Scholar
2. McKernan, S. and Carter, C. B., Proc. 47th EMSA meeting, 432 (1989) and 1989 MRS Symposium on Advances in Electronic Packaging Materials (in Press)Google Scholar
3. Denanot, M. F. and Rabier, J., J. Mat. Sci. 24, 1594 (1989)Google Scholar
4. Westwood, A. D. and M. R. Notis Submitted to American Ceramics Society.Google Scholar
5. Youngman, R. A. Harris, J. H., Labun, P. A., Graham, R. J., and Weiss, J. K. 1989 MRS Symposium on Advances in Electronic Packaging Materials (in Press)Google Scholar
6. Ishida, Y., Hagege, S., Ichinose, H. and Takahashi, Y., J. Elect. Microsc. Tech., 12, 244, (1989)10.1002/jemt.1060120307Google Scholar
7. TEMPAS multislice program; Kilaas, R., Total Resolution, Berkeley, CA 94707Google Scholar