Hostname: page-component-586b7cd67f-rcrh6 Total loading time: 0 Render date: 2024-11-23T15:20:47.701Z Has data issue: false hasContentIssue false

Germanium & Carbon Co-implantation for Enhanced Short Channel Effect Control in PMOS Devices

Published online by Cambridge University Press:  01 February 2011

Benjamin Dumont
Affiliation:
[email protected], STMicroelectronics, Advanced Devices Module, 850, rue Jean Monnet, Crolles, N/A, 38926, France
Arnaud Pouydebasque
Affiliation:
[email protected], Philips Semiconductors, 850 rue Jean-Monnet, Crolles, N/A, 38926, France
Bartek Pawlak
Affiliation:
[email protected], Philips Research, Kapeldreef 75, B-3001, Leuven, N/A, N/A, Belgium
Benjamin Oudet
Affiliation:
[email protected], STMicroelectronics, 850 rue Jean-Monnet, Crolles, N/A, 38920, France
Dominique Delille
Affiliation:
[email protected], Philips Semiconductors, 850 rue Jean-Monnet, Crolles, N/A, 38926, France
Frederic Milesi
Affiliation:
[email protected], Ion Beam Services, ZI Peynier-Rousset, rue Gaston Imbert prolongée, Peynier, N/A, 13790, France
Kader Souifi
Affiliation:
[email protected], LPM - INSA de Lyon, Bât. Blaise Pascal, 7, avenue Jean Capelle, Villeurbanne, N/A, 69621, France
Thomas Skotnicki
Affiliation:
[email protected], STMicroelectronics, 850 rue Jean-Monnet, Crolles, N/A, 38920, France
Get access

Abstract

This work demonstrates the efficiency of a Germanium and Carbon co-implantation that suppresses the Boron Transient Enhanced Diffusion, enhances Boron activation and enables large improvement of Short Channel Effects in PMOS devices while maintaining drive current performances. We present here 65/45nm node devices on conventional bulk substrates featuring Germanium and Carbon engineered shallow junctions that enable to reduce the Drain Induced Barrier Lowering compared to devices implanted only with Boron. This improvement is attributed to the suppression of Boron channelling with Ge pre-amorphization (PAI), and to the reduction of Boron TED due to the trapping of interstitial defects by Carbon with Germanium PAI.

Type
Research Article
Copyright
Copyright © Materials Research Society 2006

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1 , Shima, et al., IEDM 2003 Tech.Dig., pp.493496 Google Scholar
2 , Oishi et al., VLSI 2004 Tech. Dig., pp.166167 Google Scholar
3 Rükcer, H. et al., IEDM 1999 Tech.Dig., pp.345348 Google Scholar
4 , Cacciato et al., Journal of Applied Physics March 1996 pp.23142325 Google Scholar
5 Gossmann, H.-J. et al., IEDM 1998 Tech. Dig., pp.725728 Google Scholar
6 Pawlak, B.J. et al., submitted to IEDM 2005 Google Scholar
7 Osten, H.J. et al., IEEE Transactions on Electron Devices 1999, pp.19101911 Google Scholar
8 Ducroquet, F. et al., IEDM 2004 Tech. Dig., pp.437440 Google Scholar
9 ITRS Technology Roadmap for Semiconductors 2003 http://public.itrs.netGoogle Scholar
10 , Al-Bayati et al., Ion Implantation Technology 2000, pp.5461 Google Scholar
11 Skotnicki, T. et al., ECS 2002, MASTAR model is available on http://public.itrs.netGoogle Scholar
12 Ernst, T. et al., VLSI 2002 Tech. Dig. pp.9293 Google Scholar