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Evaluation of Monodispersed Silica Particles and Ceria Coated Silica Particles for Chemical Mechanical Polishing

Published online by Cambridge University Press:  01 February 2011

Zhenyu Lu ,
Seung-Ho Lee ,
Egon Matijević  and
S. V. Babu
Zhenyu Lu
Affiliation:
Departments of Chemistry and Chemical Engineering Center for Advanced Materials Processing Clarkson University, Potsdam, NY 13699
Seung-Ho Lee
Affiliation:
Departments of Chemistry and Chemical Engineering Center for Advanced Materials Processing Clarkson University, Potsdam, NY 13699
Egon Matijević
Affiliation:
Departments of Chemistry and Chemical Engineering Center for Advanced Materials Processing Clarkson University, Potsdam, NY 13699
S. V. Babu
Affiliation:
Departments of Chemistry and Chemical Engineering Center for Advanced Materials Processing Clarkson University, Potsdam, NY 13699
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Abstract

The properties of abrasive particles play a key role in chemical mechanical polishing (CMP). This study used well-defined dispersions of uniform particles, including spherical silica of varying diameters to polish Cu films and silica cores coated with nanosized ceria particles to polish oxide films. It was shown that the total surface area of the silica abrasives in the slurry controlled Cu material removal rate. However, pH, solid content, and particle size of ceria coated silica abrasives did not have a strong correlation to the removal rate of oxide films.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 732: Symposium I – Chemical-Mechanical Planarization , 2002 , I3.7
Copyright
Copyright © Materials Research Society 2002

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References

1. Mueller, B.L., Streinz, C.C., and Grumbine, S.K., U.S. Patent No. 5958288 (26 Nov. 1996); S.K. Grumbine, C.C. Streinz, and B.L. Mueller, U.S. Patent No. 6068787 (11 Jul. 1997).Google Scholar
2. Grover, G.S., and Mueller, B.L., Patent, U.S. No. 5759917 (30 Dec. 1996); G.S. Sandhu, D. Westmoreland, and D. Koos, U.S. Patent No. 6099604 (21 Aug. 1997).Google Scholar
3. Ramarajan, S., Hariharaputhiran, M., Her, Y.S., and Babu, S.V., Surfac. Eng. 15, 324 (1999); See also the papers on abrasives in Chemical-Mechanical Polishing—Fundamentals and Challenges (S.V. Babu, S. Danyluk, M.I. Krishnan and M. Tsujimura, Eds.), Warrendale, 2000. (Mater. Res. Soc. Proc. 566)Google Scholar
4. Bielmann, M., Mahajan, U., and Singh, R.K., in Chemical-Mechanical Polishing—Fundamentals and Challenges (Babu, S.V., Danyluk, S., Krishnan, M.I. and Tsujimura, M., Eds.), p.103. Warrendale, 2000. (Mater. Res. Soc. Proc. 566)Google Scholar
5. Hariharaputhiran, M., Zhang, J., Ramarajan, S., Keleher, J.J., Li, Y., and Babu, S.V., J. Electrochem. Soc. 147, 3820 (2000).Google Scholar
6. Bielmann, M., Master Thesis, University of Florida, Gainesville, FL (1998).Google Scholar
7. Basim, B.G., Adler, J.J., Mahajan, U., Singh, R.K., and Moudgil, B.M., J. Electrochem. Soc. 147, 3523 (2000).Google Scholar
8. Li, Y., Hariharaputhiran, M., and Babu, S.V., J. Mater. Res. 16, 1066 (2001).Google Scholar
9. Li, Y., PHD. Thesis, Department of Chemical Engineering, Clarkson University, Potsdam, NY (2001).Google Scholar