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Electrochemical Properties and Microstructure of Tin Base Thin Film Electrode for Lithium Secondary Batteries

Published online by Cambridge University Press:  03 September 2012

Wanuk Choi
Affiliation:
Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, 373-1 Guseong-dong, Yuseong-gu, Daejeon, 305-701, Korea
Jeong Yong Lee*
Affiliation:
Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, 373-1 Guseong-dong, Yuseong-gu, Daejeon, 305-701, Korea
*
*Corresponding author: E-mail: [email protected], Tel.: 82-42-869-4216, Fax: 82-42-869-4276
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Abstract

Cu/Sn alloy electrode, as an anode for Li ion secondary batteries, was fabricated by annealing of Sn thin film electroplated on copper thin foil. The structure of Cu/Sn alloy electrode was determined using XRD, SEM and TEM. The thin film was consisted of Cu6Sn5, Cu3Sn and so on, the major component was a few ten nanometer sized Cu6Sn5 grains and the minor (Cu3Sn and β-(Cu,Sn)) was dispersed among the Cu6Sn5 grains. The electrochemical properties of Cu6Sn5 thin film were evaluated in coin type half-cell, which was configured with Cu6Sn5, thin film electrode, Li metal electrode and typical 1 mol LiPF6 in EC:DMC (1:1) electrolyte. Annealed Cu/Sn electrode took and released Li ions well during Li insertion and de-insertion. Cycle performance of annealed Cu/Sn electrode was better than that of as-deposited Sn electrode, which was caused by topotactic reaction of Cu6Sn5and composite structure of Cu/Sn alloys.

Type
Research Article
Copyright
Copyright © Materials Research Society 2004

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References

[1] Huggins, R. A., Solid State Ionics 113–115,57 (1998).Google Scholar
[2] Rom, I., Wachtler, M., Papst, I., Schmied, M., Besenhard, J. O., Hofer, F. and Winter, M., Solid State Ionics 143, 329 (2001).Google Scholar
[3] Hewitt, K.C., Beaulieu, L.Y. and Dahn, J.R., J.Electrochem.Soc. 148, A402 (2001).Google Scholar
[4] Dey, A. N., J. Electrochem. Soc. 118, 1545 (1971).Google Scholar
[5] Yao, N. P., Heredy, L. A. and Saunders, R. C., J. Electrochem. Soc. 118, 1039 (1971).Google Scholar
[6] Sharma, R. A. and Seefurth, R. N., J. Electrochem. Soc. 123, 1763 (1976).Google Scholar
[7] Weppner, W. and Huggins, R. A., J. Electrochem. Soc. 125, 7 (1978).Google Scholar
[8] Wen, C. J. and Huggins, R. A., J. Electrochem. Soc. 128, 1181 (1981).Google Scholar
[9] Wang, J., Raistrick, I. D. and Huggins, R. A., J. Electrochem. Soc. 133, 457 (1986).Google Scholar
[10] Courtney, I. A. and Dahn, J. R., J. Electrochem. Soc. 144, 2045 (1997).Google Scholar
[11] Yang, J., Wachtler, M., Winter, M. and Besenhard, J. O., Electrochemical and Solid-State Lett. 2, 161 (1999).Google Scholar
[12] Thackery, M.M., Vaughey, J.T., Kahaian, A.J., Kepler, K.D. and Benedek, R., Electrochem. Comm. 1, 111 (1999).Google Scholar
[13] JCPDS Card No. 6–0621 and 2-1436, powder diffraction file (Joint Committee on Powder Diffraction Standards, Swarthmore, PA, 1981).Google Scholar