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The Effect of Line Geometry on Void Growth in Thin, Narrow Aluminum Lines

Published online by Cambridge University Press:  15 February 2011

P. Børgesen ,
J. K. Lee ,
M. A. Korhonen  and
C.-Y. Li
P. Børgesen
Affiliation:
Department of Materials Science & EngineeringCornell University, Ithaca, NY 14853
J. K. Lee
Affiliation:
Department of Materials Science & EngineeringCornell University, Ithaca, NY 14853
M. A. Korhonen
Affiliation:
Department of Materials Science & EngineeringCornell University, Ithaca, NY 14853
C.-Y. Li
Affiliation:
Department of Materials Science & EngineeringCornell University, Ithaca, NY 14853
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Abstract

The stress induced growth of individual voids in passivated Al-lines at room temperature was monitored in-situ, without removing the passivation. The kinetics was strongly influenced by variations in line geometry, even over distances of many μm, indicating variations in the stress relaxation as well.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 225: Symposium G – Materials Reliability Issues in Microelectronics , 1991 , 149
Copyright
Copyright © Materials Research Society 1991

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References

REFERENCES

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[12]: Paszkiet, C. A., Børgesen, P., Korhonen, M. A., and Li, C.-Y., to be publishedGoogle Scholar