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Published online by Cambridge University Press: 01 February 2011
Molecular beam epitaxial Si1-xGex layers of various Ge concentrations ranging from 0% to 50% were grown on top of a Si substrate. The wafers were then implanted with a 40 keV, 1 x 1014cm-2 Si+. To study the development of {311} defects, the samples were annealed at 750°C for times ranging from 0 to 20 minutes. TEM was utilized to observe both the formation and dissolution of the defects. The Si1-xGex samples with ≤ 5% Ge exhibit {311} defect formation and dissolution; however, samples with the Ge content lying between 15% and 50% showed only dislocation loop formation. It is suggested that the decrease in bond strength with increasing Ge content is the reason for the lack of {311} defect formation.