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Direct Measurement of Hot-spot Temperature in Flip-chip Solder Joints With Cu Columns Under Current Stressing using Infrared Microscopy

Published online by Cambridge University Press:  01 February 2011

Chih Chen ,
Yu Chun Liang  and
D. J. Yao
Chih Chen
Affiliation:
[email protected], National Chiao Tung University, Dept. of Materials Sci. & Eng., Hsin-Chu, Taiwan, Province of China
Yu Chun Liang
Affiliation:
[email protected], National Chiao Tung University, Dept. of Materials Sci. & Eng., Hsin-Chu, Taiwan, Province of China
D. J. Yao
Affiliation:
[email protected], National Tsing Hua University, Institute of Microelectromechanical System, Hsinchu, Taiwan, Province of China
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Abstract

In this study, the temperature map distribution in the Sn3.0Ag0.5Cu solder bump with Cu column under current stressing is directly examined using infrared microscopy. It is the radiance changes between the different materials of the surface that cause the unreasonable temperature map distribution. By coating a thin layer of black optical paint which is in order to eliminate the radiance changes, we got the corrected temperature map distribution. Under a current stress of 1.15 × 104 A/cm2 at 100℃C, the hot-spot temperature is 132.2℃ which surpasses the average Cu column temperature of 129.7℃C and the average solder bump temperature of 127.4 ℃. Thermomigration in solder may still occur under a large current stressing.

Keywords

electromigrationCusoldering
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1249: Symposia E/F – Advanced Interconnects and Chemical Mechanical Planarization for Micro-and Nanoelectronics , 2010 , 1249-F08-02
Copyright
Copyright © Materials Research Society 2010

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