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Diffusion of ion-implanted Boron and Silicon in Germanium

Published online by Cambridge University Press:  17 March 2011

Suresh Uppal
Affiliation:
Material Research Group, School of Engineering Sciences, United Kindom
A. F. W. Willoughby
Affiliation:
Material Research Group, School of Engineering Sciences, United Kindom
J. M. Bonar
Affiliation:
Department Electronics and Computer Science, University of Southampton, Southampton SO17 1BJ, United Kingdom
N. E. B. cowern
Affiliation:
Advance Technology Institute, University of Surrey, Guildford, Surrey GU2 7XH, United Kingdom
R. J. H. Morris
Affiliation:
Physics Department, University of Warwick, Coventry, CV4 7AL, United Kingdom
M. G. Dowsett
Affiliation:
Physics Department, University of Warwick, Coventry, CV4 7AL, United Kingdom
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Abstract

The diffusion of B and Si in Ge is studied using implantation doping. Concentration profiles after furnace annealing in the temperature range 800–900 °C were obtained using high resolution secondary ion mass spectroscopy (SIMS). Diffusion coefficients are calculated by fitting the annealed profiles. For B, we obtain diRusivity values which are two orders of magnitude slower than previously reported in literature. An activation energy of 4.65(±0.3) eV is calculated for B diffusion in Ge. The results suggest that diffusion mechanism other than vacancy should be considered for B diffusion in Ge. For Si diffusion in Ge, the diffusivity values calculated in the temperature range 750–875 °C are in agreement with previous work. The activation energy of 3.2(±0.3) eV for Si diffusion is closer to that for Ge self-diffusion which suggests that Si diffusion in Ge occurs via the same mechanism as in Ge self-diffusion.

Type
Research Article
Copyright
Copyright © Materials Research Society 2004

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